Platinum [Pt] as principal constituent

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H01L2224/13669

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/13669Platinum [Pt] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing an electronic component, wherein a semiconduct...
- Patent number 11,842,980
- Issue date Dec 12, 2023
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using core material for reverse reflow
- Patent number 11,646,285
- Issue date May 9, 2023
- MK Electron Co., Ltd.
- Jae Yeol Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,224,301
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang Fang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages
- Patent number 9,698,088
- Issue date Jul 4, 2017
- Samsung Electronics Co., Ltd.
- Heungkyu Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip assembly process comprising pre-coating interconnect elem...
- Patent number 9,406,662
- Issue date Aug 2, 2016
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- François Marion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump package and methods of formation thereof
- Patent number 9,373,609
- Issue date Jun 21, 2016
- Infineon Technologies AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 9,368,390
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad for thermocompression bonding, process for producing a...
- Patent number 9,281,280
- Issue date Mar 8, 2016
- Robert Bosch GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor apparatus including a metal alloy between a first con...
- Patent number 8,378,490
- Issue date Feb 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Recessed pillar structure
- Patent number 8,241,963
- Issue date Aug 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with redundant micro-bumps
- Patent number 8,237,274
- Issue date Aug 7, 2012
- Xilinx, Inc.
- Arifur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multi-layered wiring layer and fabricat...
- Patent number 8,212,356
- Issue date Jul 3, 2012
- Seiko Epson Corporation
- Yasuo Yamasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,816,180
- Issue date Oct 19, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,811,835
- Issue date Oct 12, 2010
- Fujitsu Limited
- Masataka Mizukoshi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 7,582,966
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with multi-layer die c...
- Patent number 7,550,315
- Issue date Jun 23, 2009
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing a base that includes connecting a first base...
- Patent number 7,514,295
- Issue date Apr 7, 2009
- Fujitsu Limited
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor package with multi-layer metal...
- Patent number 7,253,022
- Issue date Aug 7, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with wire bonded stacked dice and multi-layer...
- Patent number 7,208,828
- Issue date Apr 24, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having substrate with multi-layer metal bumps
- Patent number 7,202,556
- Issue date Apr 10, 2007
- Micron Technology, Inc.
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level coated copper stud bumps
- Patent number 6,731,003
- Issue date May 4, 2004
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240038706
- Publication date Feb 1, 2024
- Sony Semiconductor Solutions Corporation
- Takashi IMAHIGASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW
- Publication number 20210366858
- Publication date Nov 25, 2021
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing an Electronic Component, Wherein a Semiconduct...
- Publication number 20210351156
- Publication date Nov 11, 2021
- Osram Opto Semiconductors GmbH
- Mathias Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190013284
- Publication date Jan 10, 2019
- Advanced Semiconductor Engineering, Inc.
- Jen-Kuang FANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...
- Publication number 20160315040
- Publication date Oct 27, 2016
- MK Electron Co., Ltd.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact bumps methods of making contact bumps
- Publication number 20160233188
- Publication date Aug 11, 2016
- SMARTRAC TECHNOLOGY GmbH
- Frank Kriebel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Package
- Publication number 20160225733
- Publication date Aug 4, 2016
- DIODES INCORPORATION
- Duane Thomas Wilcoxen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURE OF COATED COPPER PILLARS
- Publication number 20150279797
- Publication date Oct 1, 2015
- ATOTECH DEUTSCHLAND GMBH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME
- Publication number 20140145328
- Publication date May 29, 2014
- Georgia Tech Research Corporation
- Rao Tummala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Package and Methods of Formation Thereof
- Publication number 20140110835
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Meng Tong Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...
- Publication number 20140035168
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME
- Publication number 20130307144
- Publication date Nov 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20130130496
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Chips and Semiconductor Packages and Methods of Fabri...
- Publication number 20130075905
- Publication date Mar 28, 2013
- SAMSUNG ELECTRONICS CO., LTD.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120299197
- Publication date Nov 29, 2012
- Samsung Electronics Co., Ltd.
- Heungkyu KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20120235301
- Publication date Sep 20, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chyi-Tsong NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Recessed Pillar Structure
- Publication number 20120012997
- Publication date Jan 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND FABRICATION PROCESS...
- Publication number 20110115076
- Publication date May 19, 2011
- SEIKO EPSON CORPORATION
- Yasuo YAMASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A BASE
- Publication number 20090181497
- Publication date Jul 16, 2009
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING A BASE
- Publication number 20090176331
- Publication date Jul 9, 2009
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20080054457
- Publication date Mar 6, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH MULTI-LAYER DIE C...
- Publication number 20070262469
- Publication date Nov 15, 2007
- VICTOR TAN CHER 'KHNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
- Publication number 20070222087
- Publication date Sep 27, 2007
- Sangdo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for processing base
- Publication number 20060030071
- Publication date Feb 9, 2006
- FUJITSU LIMITED
- Masataka Mizukoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having wire bonded die and multi layer metal...
- Publication number 20050173788
- Publication date Aug 11, 2005
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor package with multi-layer metal...
- Publication number 20040232564
- Publication date Nov 25, 2004
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level coated copper stud bumps
- Publication number 20030173684
- Publication date Sep 18, 2003
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package having substrate with multi-layer metal bumps
- Publication number 20030116866
- Publication date Jun 26, 2003
- Victor Tan Cher 'Khng
- H01 - BASIC ELECTRIC ELEMENTS

Platinum [Pt] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing an electronic component, wherein a semiconduct...

Industrial chip scale package for microelectronic device

Semiconductor package using core material for reverse reflow

Bonding electrode structure of flip-chip led chip and fabrication m...

Semiconductor package device and method of manufacturing the same

Semiconductor packages

Flip-chip assembly process comprising pre-coating interconnect elem...

Bump package and methods of formation thereof

Semiconductor apparatus

Manufacture of coated copper pillars

Bonding pad for thermocompression bonding, process for producing a...

Semiconductor apparatus including a metal alloy between a first con...

Recessed pillar structure

Integrated circuit package with redundant micro-bumps

Semiconductor device having multi-layered wiring layer and fabricat...

Semiconductor chip and method for fabricating the same

Method for processing a base that includes connecting a first base...

Method for processing a base that includes connecting a first base...

Semiconductor chip and method for fabricating the same

Method for fabricating semiconductor package with multi-layer die c...

Method for processing a base that includes connecting a first base...

Method for fabricating semiconductor package with multi-layer metal...

Semiconductor package with wire bonded stacked dice and multi-layer...

Semiconductor package having substrate with multi-layer metal bumps

Wafer-level coated copper stud bumps

Method of forming dual height solder interconnections

Solder mass having conductive encapsulating arrangement

Patents Applicationslast 30 patents

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW

Method for Producing an Electronic Component, Wherein a Semiconduct...

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...

Contact bumps methods of making contact bumps

Chip Scale Package

MANUFACTURE OF COATED COPPER PILLARS

INTERCONNECT ASSEMBLIES AND METHODS OF MAKING AND USING SAME

Bump Package and Methods of Formation Thereof

BONDING PAD FOR THERMOCOMPRESSION BONDING, PROCESS FOR PRODUCING A...

THREE-DIMENSIONAL CHIP STACK AND METHOD OF FORMING THE SAME

SEMICONDUCTOR APPARATUS

Semiconductor Chips and Semiconductor Packages and Methods of Fabri...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR APPARATUS

Recessed Pillar Structure

SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND FABRICATION PROCESS...

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

METHOD FOR PROCESSING A BASE

METHOD FOR PROCESSING A BASE

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE WITH MULTI-LAYER DIE C...

SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS

Method for processing base

Semiconductor package having wire bonded die and multi layer metal...

Method for fabricating semiconductor package with multi-layer metal...

Wafer-level coated copper stud bumps

Semiconductor package having substrate with multi-layer metal bumps