Plurality of lead frames mounted in one device

Industry

CPC
H01L23/49537

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49537Plurality of lead frames mounted in one device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a semiconductor package with connection lug
- Patent number 12,125,772
- Issue date Oct 22, 2024
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame assembly having a plurality of dicing holes
- Patent number 12,113,001
- Issue date Oct 8, 2024
- CHANG WAH TECHNOLOGY CO., LTD.
- Chia-Neng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of transistors attached to a heat sink with a periphery n...
- Patent number 12,113,002
- Issue date Oct 8, 2024
- Mitsubishi Electric Corporation
- Hiroki Katsube
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 12,094,793
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Custom leadframe from standard plus printed leadframe portion
- Patent number 12,080,633
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Jo Bito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including source pad region and drain pad regi...
- Patent number 12,062,716
- Issue date Aug 13, 2024
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip packaged semiconductor device
- Patent number 12,057,377
- Issue date Aug 6, 2024
- MagnaChip Semiconductor, Ltd.
- Hyun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a lead frame and a passive c...
- Patent number 12,033,923
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,033,922
- Issue date Jul 9, 2024
- Denso Corporation
- Akihiro Fukatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,002,730
- Issue date Jun 4, 2024
- Mitsubishi Electric Corporation
- Ikumi Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,996,344
- Issue date May 28, 2024
- Denso Corporation
- Shoichiro Omae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
- Patent number 11,978,692
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component apparatus having a first lead frame and a seco...
- Patent number 11,955,410
- Issue date Apr 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yukinori Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-embedded board
- Patent number 11,948,849
- Issue date Apr 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Koo Woong Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module having a plurality of lead frames connected to a sub...
- Patent number 11,935,819
- Issue date Mar 19, 2024
- Murata Manufacturing Co., Ltd.
- Hideshi Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of lead frames for cooling a power device
- Patent number 11,929,307
- Issue date Mar 12, 2024
- Hitachi Astemo, Ltd.
- Yusuke Takagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged stackable electronic power device for surface mounting and...
- Patent number 11,894,290
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 11,894,291
- Issue date Feb 6, 2024
- Mitsubishi Electric Corporation
- Shuhei Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,887,905
- Issue date Jan 30, 2024
- Denso Corporation
- Susumu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with electrically insulated carrier and at least one step o...
- Patent number 11,876,028
- Issue date Jan 16, 2024
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 11,854,950
- Issue date Dec 26, 2023
- Mitsubishi Electric Corporation
- Hideo Komo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package module
- Patent number 11,842,950
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with galvanically isolated semiconductor chips
- Patent number 11,837,531
- Issue date Dec 5, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having reduced capacitance between source and...
- Patent number 11,817,494
- Issue date Nov 14, 2023
- ANCORA SEMICONDUCTORS INC.
- Li-Fan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal semiconductor package molds
- Patent number 11,791,170
- Issue date Oct 17, 2023
- Texas Instruments Incorporated
- Anis Fauzi Bin Abdul Aziz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF
- Publication number 20240387485
- Publication date Nov 21, 2024
- DIODES INCORPORATED
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...
- Publication number 20240347427
- Publication date Oct 17, 2024
- INFINEON TECHNOLOGIES AG
- Edward FÜRGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...
- Publication number 20240332136
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING
- Publication number 20240321698
- Publication date Sep 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
- Publication number 20240321665
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Package and a Semiconduct...
- Publication number 20240258213
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240258209
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Kazuo FUNAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20240258254
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Yuki TERADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Power Semiconductor Package
- Publication number 20240243106
- Publication date Jul 18, 2024
- Wolfspeed, Inc.
- Daniel Ginn Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213126
- Publication date Jun 27, 2024
- Power Master Semiconductor Co., Ltd.
- Jooyaung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240213123
- Publication date Jun 27, 2024
- DENSO CORPORATION
- SACHIO KODAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED STACKABLE ELECTRONIC POWER DEVICE FOR SURFACE MOUNTING AND...
- Publication number 20240203837
- Publication date Jun 20, 2024
- STMicroelectronics S.r.l.
- Cristiano Gianluca STELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CIRCUIT BOARD
- Publication number 20240186302
- Publication date Jun 6, 2024
- Mitsubishi Electric Corporation
- Keisuke EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240153920
- Publication date May 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi-Hung HOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...
- Publication number 20240112990
- Publication date Apr 4, 2024
- Rohm Co., Ltd.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module Having Double Sided Heat Dissipation Structure...
- Publication number 20240096730
- Publication date Mar 21, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240055316
- Publication date Feb 15, 2024
- LX Semicon Co., Ltd.
- Deog Soo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES
- Publication number 20240047317
- Publication date Feb 8, 2024
- Littelfuse Semiconductor (Wuxi) Co., Ltd
- Lucas Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...
- Publication number 20240038612
- Publication date Feb 1, 2024
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030111
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240030338
- Publication date Jan 25, 2024
- Ancora Semiconductors Inc.
- Li-Fan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014106
- Publication date Jan 11, 2024
- Power Master Semiconductor Co., Ltd.
- Jooyaung EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014107
- Publication date Jan 11, 2024
- ROHM CO., LTD.
- Yoshizo OSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-SYMMETRICAL SEMICONDUCTOR ARRANGEMENT
- Publication number 20240006330
- Publication date Jan 4, 2024
- Huawei Technologies Co., Ltd
- Juergen HOEGERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230411257
- Publication date Dec 21, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Siang Miang YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20230402349
- Publication date Dec 14, 2023
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES
- Publication number 20230361088
- Publication date Nov 9, 2023
- INFINEON TECHNOLOGIES AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
- Publication number 20230361087
- Publication date Nov 9, 2023
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE
- Publication number 20230352377
- Publication date Nov 2, 2023
- Hitachi Energy Switzerland AG
- Dominik TRUESSEL
- H01 - BASIC ELECTRIC ELEMENTS

Plurality of lead frames mounted in one device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a semiconductor package with connection lug

Lead frame assembly having a plurality of dicing holes

Plurality of transistors attached to a heat sink with a periphery n...

Package with electrically insulated carrier and at least one step o...

Package with different types of semiconductor dies attached to a fl...

Custom leadframe from standard plus printed leadframe portion

Semiconductor package having routable encapsulated conductive subst...

Semiconductor device including source pad region and drain pad regi...

Multichip packaged semiconductor device

Semiconductor device

Semiconductor package structure having a lead frame and a passive c...

Semiconductor device and electronic device

Semiconductor module

Semiconductor device

Semiconductor package, semiconductor module and methods for manufac...

Plurality of overlapping power terminals in a semiconductor module

Electronic component apparatus having a first lead frame and a seco...

Package-embedded board

Circuit module having a plurality of lead frames connected to a sub...

Plurality of lead frames for cooling a power device

Semiconductor device including a bidirectional switch

Packaged stackable electronic power device for surface mounting and...

Manufacturing method of semiconductor device and semiconductor device

Semiconductor device

Package with electrically insulated carrier and at least one step o...

Semiconductor module and semiconductor device

Package module

Semiconductor device with galvanically isolated semiconductor chips

Semiconductor device having reduced capacitance between source and...

Universal semiconductor package molds

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT PACKAGE AND MANUFACURING METHOD THEREOF

LEADFRAME COMPRISING A LEAD WITH AN ELEVATION FOR INCREASING MECHAN...

POWER SEMICONDUCTOR DEVICE WITH A STRESS-FREE JOINT BETWEEN METAL P...

CHIP-ON-CHIP POWER CARD HAVING IMMERSION COOLING

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

Methods for Manufacturing a Semiconductor Package and a Semiconduct...

SEMICONDUCTOR DEVICE

BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE

Thermal Enhanced Power Semiconductor Package

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PACKAGED STACKABLE ELECTRONIC POWER DEVICE FOR SURFACE MOUNTING AND...

SEMICONDUCTOR DEVICE AND CIRCUIT BOARD

ELECTRONIC DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

Semiconductor Module Having Double Sided Heat Dissipation Structure...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE ASSEMBLY FOR TVS DEVICES

PACKAGE WITH ELECTRICALLY INSULATED CARRIER AND AT LEAST ONE STEP O...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

HIGH-SYMMETRICAL SEMICONDUCTOR ARRANGEMENT

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES

MOLDED POWER SEMICONDUCTOR PACKAGE

PRE-PRODUCT, METHOD AND ELECTRONIC DEVICE