Polonium [Po]

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CPC
H01L2924/01084

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01084Polonium [Po]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor memory device structure
- Patent number 11,742,307
- Issue date Aug 29, 2023
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for microstructure modification of conducting lines
- Patent number 11,430,693
- Issue date Aug 30, 2022
- Yuan Ze University
- Cheng En Ho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor memory device structure
- Patent number 11,264,344
- Issue date Mar 1, 2022
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device structure
- Patent number 10,756,036
- Issue date Aug 25, 2020
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,577,703
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,458,033
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of alpha emitting species from plating baths
- Patent number 10,287,698
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 9,881,999
- Issue date Jan 30, 2018
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of refining solder materials
- Patent number 9,666,547
- Issue date May 30, 2017
- Honeywell International Inc.
- Martin W. Weiser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Memory device structure
- Patent number 9,589,918
- Issue date Mar 7, 2017
- OVONYX MEMORY TECHNOLOGY, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film, connection structure and method of pro...
- Patent number 9,515,042
- Issue date Dec 6, 2016
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and a method of manufacturing a printed wiring...
- Patent number 9,480,170
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Katsuhiko Tanno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma treatment for semiconductor devices
- Patent number 9,418,955
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,391,003
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor package with conductive clip and related method
- Patent number 9,391,004
- Issue date Jul 12, 2016
- Infineon Technologies Americas Corp.
- Martin Standing
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low fabrication cost, high performance, high reliability chip scale...
- Patent number 9,369,175
- Issue date Jun 14, 2016
- QUALCOMM Incorporated
- Jin-Yuan Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 9,275,961
- Issue date Mar 1, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate contact opening
- Patent number 9,275,964
- Issue date Mar 1, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a memory device
- Patent number 9,177,927
- Issue date Nov 3, 2015
- Micron Technology, Inc.
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 9,119,333
- Issue date Aug 25, 2015
- NGK Spark Plug Co., Ltd.
- Takuya Hando
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 9,101,054
- Issue date Aug 4, 2015
- Ibiden Co., Ltd.
- Yasushi Inagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Power semiconductor package
- Patent number 9,041,191
- Issue date May 26, 2015
- International Rectifier Corporation
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a memory device
- Patent number 8,900,945
- Issue date Dec 2, 2014
- Micron Technology, Inc.
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a high frequency device package
- Patent number 8,839,508
- Issue date Sep 23, 2014
- Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,779,560
- Issue date Jul 15, 2014
- PS4 Luxco S.A.R.L.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
- Publication number 20220293467
- Publication date Sep 15, 2022
- YUAN ZE UNIVERSITY
- Cheng EN HO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20220157753
- Publication date May 19, 2022
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20200357761
- Publication date Nov 12, 2020
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
- Publication number 20190319001
- Publication date Oct 17, 2019
- Ovonyx Memory Technology, LLC
- John Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20170145575
- Publication date May 25, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20170145579
- Publication date May 25, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS
- Publication number 20170145576
- Publication date May 25, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Contact Opening
- Publication number 20140170851
- Publication date Jun 19, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF
- Publication number 20140145329
- Publication date May 29, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Treatment for Semiconductor Devices
- Publication number 20140131861
- Publication date May 15, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130328188
- Publication date Dec 12, 2013
- Elpida Memory, Inc.
- Seiya Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130299098
- Publication date Nov 14, 2013
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT CHIP SCALE PACKAGE
- Publication number 20130273731
- Publication date Oct 17, 2013
- Jan GULPEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20130206466
- Publication date Aug 15, 2013
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20130130408
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
- Publication number 20130000709
- Publication date Jan 3, 2013
- E I DU PONT DE NEMOURS AND COMPANY NORTH CAROLINA STATE UNIVERSITY
- WILLIAM J. BORLAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
- Publication number 20120273799
- Publication date Nov 1, 2012
- Kabushiki Kaisha Toshiba
- Kazutaka TAKAGI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE
- Publication number 20120270340
- Publication date Oct 25, 2012
- Renesas Electronics Corporation
- Hiroshi Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120263946
- Publication date Oct 18, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND...
- Publication number 20120256326
- Publication date Oct 11, 2012
- Kazuyuki Mitsukura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICO...
- Publication number 20120248634
- Publication date Oct 4, 2012
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120234588
- Publication date Sep 20, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRO...
- Publication number 20120228026
- Publication date Sep 13, 2012
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Yasushi Akutsu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20120211271
- Publication date Aug 23, 2012
- NGK SPARK PLUG CO., LTD.
- Takuya HANDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120181078
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Yasushi INAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE
- Publication number 20120175786
- Publication date Jul 12, 2012
- James Yii Lee Kiong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING PLURAL SEMIC...
- Publication number 20120164788
- Publication date Jun 28, 2012
- ELPIDA MEMORY, INC.
- Akira Ide
- H01 - BASIC ELECTRIC ELEMENTS

Polonium [Po]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor memory device structure

Method for microstructure modification of conducting lines

Semiconductor memory device structure

Semiconductor memory device structure

Separation of alpha emitting species from plating baths

Separation of alpha emitting species from plating baths

Method for low temperature bonding and bonded structure

Separation of alpha emitting species from plating baths

Methods of fabricating nanostructures and nanowires and devices fab...

Semiconductor package with conductive clip

Method of refining solder materials

Memory device structure

Anisotropic conductive film, connection structure and method of pro...

Printed wiring board and a method of manufacturing a printed wiring...

Plasma treatment for semiconductor devices

Semiconductor package with conductive clip

Power semiconductor package with conductive clip and related method

Method for low temperature bonding and bonded structure

Low fabrication cost, high performance, high reliability chip scale...

Method for low temperature bonding and bonded structure

Low cost high frequency device package and methods

Substrate contact opening

Method of forming a memory device

Multilayer wiring board

Multilayer printed wiring board

Method for low temperature bonding and bonded structure

Power semiconductor package

Method of forming a memory device

Method of making a high frequency device package

Semiconductor device and manufacturing method thereof

Patents Applicationslast 30 patents

METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR MEMORY DEVICE STRUCTURE

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

SEPARATION OF ALPHA EMITTING SPECIES FROM PLATING BATHS

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Substrate Contact Opening

FINE PITCH MICROCONTACTS AND METHOD FOR FORMING THEREOF

Plasma Treatment for Semiconductor Devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

FAN-OUT CHIP SCALE PACKAGE

MULTILAYER PRINTED WIRING BOARD

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS

SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME

MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND...

METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICO...

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD OF PRO...

MULTILAYER WIRING BOARD

MULTILAYER PRINTED WIRING BOARD

METHOD OF POST-MOLD GRINDING A SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING PLURAL SEMIC...