Polychromatic heating lamp

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CPC
H01L2224/7826

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7826Polychromatic heating lamp

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Full-automatic deep access ball bonding head device
- Patent number 11,437,343
- Issue date Sep 6, 2022
- ZHEJIANG RUIQUN TECHNOLOGY CO., LTD.
- Wen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and wire bonding device
- Patent number 11,404,393
- Issue date Aug 2, 2022
- Kaijo Corporation
- Eiji Kimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of vertically vibrating a bonding arm
- Patent number 11,302,667
- Issue date Apr 12, 2022
- Kaijo Corporation
- Riki Jindo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for establishing a wire connection as well as a c...
- Patent number 11,217,558
- Issue date Jan 4, 2022
- PAC Tech-Packaging Technologies GmbH
- Andrej Kolbasow
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED chip mounting method and device
- Patent number 10,910,530
- Issue date Feb 2, 2021
- ASTI GLOBAL INC., TAIWAN
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curtain airbag device mounting structure and curtain airbag deploym...
- Patent number 10,723,306
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Takamichi Komura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Discharge examination device, wire-bonding apparatus, and discharge...
- Patent number 10,607,959
- Issue date Mar 31, 2020
- Shinkawa Ltd.
- Kazumasa Sasakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for measuring a free air ball size during wire...
- Patent number 10,163,845
- Issue date Dec 25, 2018
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming ball in bonding wire
- Patent number 10,121,764
- Issue date Nov 6, 2018
- Nippon Micrometal Corporation
- Noritoshi Araki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonder and method of calibrating a wire bonder
- Patent number 9,620,477
- Issue date Apr 11, 2017
- ASM Technology Singapore Pte. Ltd.
- Keng Yew Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,415,456
- Issue date Aug 16, 2016
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antioxidant gas blow-off unit
- Patent number 9,362,251
- Issue date Jun 7, 2016
- Shinkawa Ltd.
- Mitsuaki Sakakura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of recovering a bonding apparatus from a bonding failure
- Patent number 9,314,869
- Issue date Apr 19, 2016
- ASM Technology Singapore Pte. Ltd.
- Wai Wah Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for determining acceptance/rejection of fine d...
- Patent number 9,199,337
- Issue date Dec 1, 2015
- Jtekt Corporation
- Jun Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Antioxidant gas supply unit
- Patent number 9,044,821
- Issue date Jun 2, 2015
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device package and method of manufacturing the same
- Patent number 8,829,691
- Issue date Sep 9, 2014
- Samsung Electronics Co., Ltd.
- Jae-yun Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,586,416
- Issue date Nov 19, 2013
- Renesas Electronics Corporation
- Masahiko Sekihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 8,415,245
- Issue date Apr 9, 2013
- Renesas Electronics Corporation
- Yasuki Takata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,313,015
- Issue date Nov 20, 2012
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor device, and bonding apparatus
- Patent number 8,292,160
- Issue date Oct 23, 2012
- Shinkawa Ltd.
- Yusuke Maruya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and method for forming same
- Patent number 8,247,911
- Issue date Aug 21, 2012
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 8,191,759
- Issue date Jun 5, 2012
- Shinkawa Ltd.
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level package using stud bump coated with solder
- Patent number 8,071,470
- Issue date Dec 6, 2011
- Carsem (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas delivery system for reducing oxidation in wire bonding operations
- Patent number 8,066,170
- Issue date Nov 29, 2011
- Kulicke and Soffa Industries, Inc.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus, record medium storing bonding control progr...
- Patent number 7,857,190
- Issue date Dec 28, 2010
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire bonding apparatus, record medium storing bonding control progr...
- Patent number 7,686,204
- Issue date Mar 30, 2010
- Kabushiki Kaisha Shinkawa
- Kuniyuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball forming device in a bonding apparatus and ball forming method
- Patent number 7,658,313
- Issue date Feb 9, 2010
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, ball forming device in said bonding apparatus, a...
- Patent number 7,644,852
- Issue date Jan 12, 2010
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for delivering shielding gas during wire bonding
- Patent number 7,628,307
- Issue date Dec 8, 2009
- ASM Technology Singapore Pte. Ltd.
- Yam Mo Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...
- Publication number 20220320040
- Publication date Oct 6, 2022
- Yamaha Robotics Holdings Co., Ltd.
- Hiroshi MUNAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING METHOD AND WIRE BONDING DEVICE
- Publication number 20210366869
- Publication date Nov 25, 2021
- KAIJO CORPORATION
- Eiji KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE
- Publication number 20210057374
- Publication date Feb 25, 2021
- NINGBO SHANGJIN AUTOMATION TECHNOLOGY CO., LTD.
- Wen CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...
- Publication number 20200161273
- Publication date May 21, 2020
- PAC TECH - PACKAGING TECHNOLOGIES GMBH
- ANDREJ KOLBASOW
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZE BONDED NAIL HEAD LEAD
- Publication number 20200043882
- Publication date Feb 6, 2020
- LUCAS-MILHAUPT, INC.
- Dean W Kick
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD FOR WIRE PREPARATION
- Publication number 20190372294
- Publication date Dec 5, 2019
- The Charles Stark Draper Laboratory, Inc.
- Mitchell W. Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING BALL IN BONDING WIRE
- Publication number 20180096965
- Publication date Apr 5, 2018
- NIPPON MICROMETAL CORPORATION
- Noritoshi ARAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANTIOXIDANT GAS SUPPLY UNIT
- Publication number 20140311590
- Publication date Oct 23, 2014
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER
- Publication number 20140209663
- Publication date Jul 31, 2014
- Keng Yew SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices and Methods for Providing an Electrical Connection
- Publication number 20140151905
- Publication date Jun 5, 2014
- INFINEON TECHNOLOGIES AG
- Michael Sternad
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140151341
- Publication date Jun 5, 2014
- SHINKAWA LTD.
- Katsutoshi KUNIYOSHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL
- Publication number 20130341378
- Publication date Dec 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Seok Khoon Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-CORE WIRE
- Publication number 20130319726
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Chin Teck Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF RECOVERING A BONDING APPARATUS FROM A BONDING FAILURE
- Publication number 20130180957
- Publication date Jul 18, 2013
- ASM Technology Singapore Pte Ltd
- Wai Wah LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE
- Publication number 20130180757
- Publication date Jul 18, 2013
- Nippon Micrometal Corporation
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING ACCEPTANCE/REJECTION OF FINE D...
- Publication number 20130006565
- Publication date Jan 3, 2013
- JTEKT Corporation
- Jun Matsumoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20120302009
- Publication date Nov 29, 2012
- RENESAS ELECTRONICS CORPORATION
- Masahiko SEKIHARA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175665
- Publication date Jul 12, 2012
- SAMSUNG LED Co., Ltd.
- Jae-yun LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS
- Publication number 20120074206
- Publication date Mar 29, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Wei Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS...
- Publication number 20120067940
- Publication date Mar 22, 2012
- Dodgie Reigh M. Calpito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
- Publication number 20120043655
- Publication date Feb 23, 2012
- CARSEM (M) SDN. BHD.
- Lily Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20120031877
- Publication date Feb 9, 2012
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS
- Publication number 20110315743
- Publication date Dec 29, 2011
- SHINKAWA LTD.
- Yusuke MARUYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20110278349
- Publication date Nov 17, 2011
- SHINKAWA LTD.
- Shinsuke Tei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS
- Publication number 20110073635
- Publication date Mar 31, 2011
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110057299
- Publication date Mar 10, 2011
- Renesas Electronics Corporation
- Yasuki TAKATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING GAS KIT DESIGN FOR COPPER BONDING
- Publication number 20110017806
- Publication date Jan 27, 2011
- Jerry Gomez Cayabyab
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED OXIDATION SYSTEM FOR WIRE BONDING
- Publication number 20100230476
- Publication date Sep 16, 2010
- KULICKE AND SOFFA INDUSTRIES, INC.
- Gary S. Gillotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Polychromatic heating lamp

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Full-automatic deep access ball bonding head device

Wire bonding method and wire bonding device

Method of vertically vibrating a bonding arm

Method and device for establishing a wire connection as well as a c...

LED chip mounting method and device

Curtain airbag device mounting structure and curtain airbag deploym...

Discharge examination device, wire-bonding apparatus, and discharge...

Method and apparatus for measuring a free air ball size during wire...

Method for forming ball in bonding wire

Wire bonder and method of calibrating a wire bonder

Antioxidant gas blow-off unit

Antioxidant gas blow-off unit

Method of recovering a bonding apparatus from a bonding failure

Method and apparatus for determining acceptance/rejection of fine d...

Antioxidant gas supply unit

Light-emitting device package and method of manufacturing the same

Method of manufacturing semiconductor device

Method of manufacturing semiconductor device and semiconductor device

Gas delivery system for reducing oxidation in wire bonding operations

Method of manufacturing semiconductor device, and bonding apparatus

Wire bonding structure and method for forming same

Wire bonding apparatus and wire bonding method

Wafer level package using stud bump coated with solder

Gas delivery system for reducing oxidation in wire bonding operations

Bonding apparatus and wire bonding method

Wire bonding apparatus, record medium storing bonding control progr...

Wire bonding apparatus, record medium storing bonding control progr...

Ball forming device in a bonding apparatus and ball forming method

Bonding apparatus, ball forming device in said bonding apparatus, a...

Apparatus for delivering shielding gas during wire bonding

Patents Applicationslast 30 patents

WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETE...

WIRE BONDING METHOD AND WIRE BONDING DEVICE

FULL-AUTOMATIC DEEP ACCESS BALL BONDING HEAD DEVICE

METHOD AND DEVICE FOR ESTABLISHING A WIRE CONNECTION AS WELL AS A C...

BRAZE BONDED NAIL HEAD LEAD

APPARATUS AND METHOD FOR WIRE PREPARATION

METHOD FOR FORMING BALL IN BONDING WIRE

ANTIOXIDANT GAS SUPPLY UNIT

WIRE BONDING APPARATUS AND METHOD

WIRE BONDER AND METHOD OF CALIBRATING A WIRE BONDER

Devices and Methods for Providing an Electrical Connection

WIRE BONDING APPARATUS

SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL

MULTI-CORE WIRE

METHOD OF RECOVERING A BONDING APPARATUS FROM A BONDING FAILURE

BONDING STRUCTURE OF MULTILAYER COPPER BONDING WIRE

METHOD AND APPARATUS FOR DETERMINING ACCEPTANCE/REJECTION OF FINE D...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LIGHT-EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

METHODS OF FORMING WIRE BONDS FOR WIRE LOOPS AND CONDUCTIVE BUMPS

ELECTRICAL CONTACT STRUCTURES SUITABLE FOR USE ON WAFER TRANSLATORS...

WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND BONDING APPARATUS

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

GAS DELIVERY SYSTEM FOR REDUCING OXIDATION IN WIRE BONDING OPERATIONS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

FORMING GAS KIT DESIGN FOR COPPER BONDING

BONDING APPARATUS AND WIRE BONDING METHOD

REDUCED OXIDATION SYSTEM FOR WIRE BONDING