Post-treatment of the bump connector

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CPC
H01L2224/118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/118Post-treatment of the bump connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,300,598
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar, method for manufacturing the same, and method fo...
- Patent number 12,293,983
- Issue date May 6, 2025
- DIC Corporation
- Ryota Yamaguchi
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Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,293,988
- Issue date May 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,288,764
- Issue date Apr 29, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforcing resin composition, electronic component, method for man...
- Patent number 12,275,839
- Issue date Apr 15, 2025
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shigeru Yamatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an encapulant comprising conductive fi...
- Patent number 12,261,095
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xinyu Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method
- Patent number 12,243,837
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier structures between external electrical connectors
- Patent number 12,218,035
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Chun Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 12,183,700
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive with brain-like elasticity and integrality based on sta...
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- Issue date Dec 24, 2024
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package having conductive p...
- Patent number 12,159,822
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of ball drop on thin wafer with edge...
- Patent number 12,154,877
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light-emitting device and displayer
- Patent number 12,148,867
- Issue date Nov 19, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Kuai Qin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and the methods of manufacturing
- Patent number 12,142,597
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure with bump
- Patent number 12,119,320
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor bonding structures and methods
- Patent number 12,119,238
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tse Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
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- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform chip gaps via injection-molded solder pillars
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- Issue date Oct 1, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
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Information Patent Grant
Semiconductor device with solder on pillar
- Patent number 12,107,062
- Issue date Oct 1, 2024
- Texas Instruments Incorporated
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
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- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20250183204
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS
- Publication number 20250174590
- Publication date May 29, 2025
- Canon Kabushiki Kaisha
- HIROSHI FUSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BUMP AND METHOD FOR FABRICATING THE SAME
- Publication number 20250174587
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Yen-Hao SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-HEALING SOLDER INTERCONNECTION
- Publication number 20250157968
- Publication date May 15, 2025
- META PLATFORMS, INC.
- Pradip Sairam PICHUMANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20250125295
- Publication date Apr 17, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...
- Publication number 20250087611
- Publication date Mar 13, 2025
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Method of Manufacture
- Publication number 20250079368
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250079416
- Publication date Mar 6, 2025
- PICO SEMICONDUCTOR INC.
- Yong Kuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20250062275
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...
- Publication number 20250062263
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250029902
- Publication date Jan 23, 2025
- Realtek Semiconductor Corp.
- Nai-Jen Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE
- Publication number 20250022826
- Publication date Jan 16, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS
- Publication number 20250015024
- Publication date Jan 9, 2025
- RF360 Singapore Pte. Ltd.
- Poh Hoong YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR
- Publication number 20250015032
- Publication date Jan 9, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS
- Publication number 20240421113
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Eric Peter Lewandowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...
- Publication number 20240387343
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...
- Publication number 20240387396
- Publication date Nov 21, 2024
- Intel Corporation
- Jung Kyu Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20240379536
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS
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- TEXAS INSTRUMENTS INCORPORATED
- Jose Daniel Carlos Torres
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...
- Publication number 20240339426
- Publication date Oct 10, 2024
- NXP B.V.
- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240332233
- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
- STMicroelectronics International N.V.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...
- Publication number 20240321730
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method of fabricating the same

Conductive pillar, method for manufacturing the same, and method fo...

Semiconductor package and method of forming the same

Semiconductor device and manufacturing method thereof

Reinforcing resin composition, electronic component, method for man...

Metal-bump sidewall protection

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor packages with an intermetallic layer

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Semiconductor device and method

Barrier structures between external electrical connectors

Semiconductor device package and method of manufacture

Logic drive with brain-like elasticity and integrality based on sta...

Injection molded solder head with improved sealing performance

Method of manufacturing a semiconductor package having conductive p...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Light-emitting device and displayer

Integrated fan-out package and the methods of manufacturing

Chip package structure with bump

Semiconductor bonding structures and methods

Metal bonding structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Uniform chip gaps via injection-molded solder pillars

Semiconductor device with solder on pillar

Bump structure having a side recess and semiconductor structure inc...

Conductive terminal for side facing packages

Semiconductor device and method to minimize stress on stack via

Package for stress sensitive component and semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

Semiconductor Device and Method

SUBSTRATE MOUNTING METHOD, SUBSTRATE AND IMAGE FORMING APPARATUS

CONDUCTIVE BUMP AND METHOD FOR FABRICATING THE SAME

SELF-HEALING SOLDER INTERCONNECTION

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

Semiconductor Device Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

Chip Package Structure with Bump

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

METHOD OF FORMING PACKAGE STRUCTURE

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...