Post-treatment of the bump connector

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H01L2224/118

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/118Post-treatment of the bump connector

Industries

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Patents Grantslast 30 patents

Information Patent Grant
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Thermocompression bonding using metastable gas atoms
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Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
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- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Information Patent Grant
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Information Patent Grant
Metal bonding structure and manufacturing method thereof
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Uniform chip gaps via injection-molded solder pillars
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
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INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
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- International Business Machines Corporation
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- H01 - BASIC ELECTRIC ELEMENTS
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- TEXAS INSTRUMENTS INCORPORATED
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CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
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- TEXAS INSTRUMENTS INCORPORATED
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- Taiwan Semiconductor Manufacturing Company, Ltd.
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- TEXAS INSTRUMENTS INCORPORATED
- RAFAEL JOSE GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having an encapulant comprising conductive fi...

Semiconductor packages with an intermetallic layer

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Thermocompression bonding with passivated nickel-based contacting m...

Semiconductor device and method

Barrier structures between external electrical connectors

Semiconductor device package and method of manufacture

Logic drive with brain-like elasticity and integrality based on sta...

Injection molded solder head with improved sealing performance

Method of manufacturing a semiconductor package having conductive p...

Semiconductor wafer and method of ball drop on thin wafer with edge...

Light-emitting device and displayer

Integrated fan-out package and the methods of manufacturing

Chip package structure with bump

Semiconductor bonding structures and methods

Metal bonding structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Uniform chip gaps via injection-molded solder pillars

Semiconductor device with solder on pillar

Bump structure having a side recess and semiconductor structure inc...

Conductive terminal for side facing packages

Semiconductor device and method to minimize stress on stack via

Package for stress sensitive component and semiconductor device

Fan-out interconnect integration processes and structures

Integrated fan-out package structures with recesses in molding comp...

Electronic component and semiconductor device

Semiconductor devices and semiconductor packages including the same

Semiconductor device

Buffer layer(s) on a stacked structure having a via

Patents Applicationslast 30 patents

INTEGRATED DEVICE COMPRISING A PILLAR SHELL INTERCONNECT AND AN INN...

Semiconductor Device Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

SEMICONDUCTOR WAFER AND METHOD OF BALL DROP ON THIN WAFER WITH EDGE...

LEAD FRAME AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SOLDER BALL ATTACHMENT SYSTEM AND METHOD FOR PREVENTING WARPAGE

INTEGRATED DEVICE COMPRISING METALLIZATION INTERCONNECTS

SEMICONDUCTOR DEVICE WITH SOLDER ON PILLAR

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

UNIFORM CHIP GAPS VIA INJECTION-MOLDED SOLDER PILLARS

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

Chip Package Structure with Bump

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

METHOD OF FORMING PACKAGE STRUCTURE

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

Coating of Nanowires

PACKAGE STRUCTURE WITH A BARRIER LAYER

ALLOY FOR METAL UNDERCUT REDUCTION