Post-treatment of the bump connector

Industry

CPC
H01L2224/118

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/118Post-treatment of the bump connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
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- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
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Information Patent Grant
Integrated fan-out package and the methods of manufacturing
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- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
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Information Patent Grant
Chip package structure with bump
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Information Patent Grant
Semiconductor bonding structures and methods
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Information Patent Grant
Metal bonding structure and manufacturing method thereof
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Information Patent Grant
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Information Patent Grant
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Information Patent Grant
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- Rafael Jose Guevara
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Information Patent Grant
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- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
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Information Patent Grant
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Information Patent Grant
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
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Information Patent Grant
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Semiconductor devices and semiconductor packages including the same
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Information Patent Grant
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- Patent number 12,021,050
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
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- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,990,428
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming brass-coated metals in flip-chip redistribution l...
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Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
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- Advanced Semiconductor Engineering, Inc.
- An-Nong Wen
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Information Patent Grant
Semiconductor structure and method for preparing the same
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Information Patent Grant
Semiconductor device and method for manufacturing the same
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Information Patent Grant
Systems for thermally treating conductive elements on semiconductor...
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- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip packaged devices with thermal pad
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- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of manufacturing bump structure
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- Issue date Mar 5, 2024
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- Ching-Yu Chang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
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Information Patent Grant
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- Patent number 11,908,831
- Issue date Feb 20, 2024
- STMicroelectronics Pte Ltd
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- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
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- Taiwan Semiconductor Manufacturing Co., Ltd.
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METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
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- TEXAS INSTRUMENTS INCORPORATED
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- H01 - BASIC ELECTRIC ELEMENTS
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- ROHM CO., LTD.
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- Publication date Oct 10, 2024
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- Wen Yuan CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF BONDING COLUMN TYPE DEPOSITS
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- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
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Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
- Publication number 20240332033
- Publication date Oct 3, 2024
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- Michele DERAI
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- Publication number 20240321730
- Publication date Sep 26, 2024
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- Hsiao-Tsung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20240321801
- Publication date Sep 26, 2024
- Beijing Youzhuju Network Technology Co., Ltd.
- Haiying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312939
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-HO TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
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- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
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- Publication date Sep 12, 2024
- NanoWired GmbH
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- H01 - BASIC ELECTRIC ELEMENTS
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- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
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- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282738
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Yuki NAKANO
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Information Patent Application
SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR
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- Publication date Aug 22, 2024
- NXP USA, Inc.
- Trent Uehling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240272355
- Publication date Aug 15, 2024
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
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Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
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- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Publication number 20240266316
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE
- Publication number 20240258252
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER...
- Publication number 20240243087
- Publication date Jul 18, 2024
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- Ryan Joseph Carrazzone
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...
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- Publication date Jul 11, 2024
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- JUNHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REPAIR OF SOLDER BUMPS
- Publication number 20240222302
- Publication date Jul 4, 2024
- ORBOTECH LTD.
- Zvi KOTLER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240222303
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Daehyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240222305
- Publication date Jul 4, 2024
- Industrial Technology Research Institute
- Yu-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS

Post-treatment of the bump connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light-emitting device and displayer

Integrated fan-out package and the methods of manufacturing

Chip package structure with bump

Semiconductor bonding structures and methods

Metal bonding structure and manufacturing method thereof

Semiconductor package and manufacturing method thereof

Uniform chip gaps via injection-molded solder pillars

Semiconductor device with solder on pillar

Bump structure having a side recess and semiconductor structure inc...

Conductive terminal for side facing packages

Semiconductor device and method to minimize stress on stack via

Package for stress sensitive component and semiconductor device

Fan-out interconnect integration processes and structures

Integrated fan-out package structures with recesses in molding comp...

Electronic component and semiconductor device

Semiconductor devices and semiconductor packages including the same

Semiconductor device

Buffer layer(s) on a stacked structure having a via

Fingerprint sensor and manufacturing method thereof

Bonding structures in semiconductor packaged device and method of f...

Method of forming brass-coated metals in flip-chip redistribution l...

Package structure with a barrier layer

Semiconductor package and method for manufacturing the same

Semiconductor structure and method for preparing the same

Semiconductor device and method for manufacturing the same

Systems for thermally treating conductive elements on semiconductor...

Flip chip packaged devices with thermal pad

Bump structure and method of manufacturing bump structure

Method and system for packing optimization of semiconductor devices

Method for manufacturing a wafer level chip scale package (WLCSP)

Patents Applicationslast 30 patents

Chip Package Structure with Bump

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE P...

SURFACE FINISHES FOR CONTACTS AND FIDUCIAL MARKERS ON INTEGRATED CI...

METHOD OF FORMING PACKAGE STRUCTURE

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUITS WITH CONDUCTIVE POSTS HAVING ROUGH SIDEWALLS

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

LEADLESS SEMICONDUCTOR PACKAGE WITH DUAL-SIDED STUD STRUCTURE FOR D...

METHOD OF BONDING COLUMN TYPE DEPOSITS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...

INTEGRATED DEVICE COMPRISING STACKED INDUCTORS WITH LOW OR NO MUTUA...

CHIP AND METHOD FOR FORMING THE SAME, AND PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

Coating of Nanowires

PACKAGE STRUCTURE WITH A BARRIER LAYER

ALLOY FOR METAL UNDERCUT REDUCTION

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH PAD CONTACT FEATURE AND METHOD THEREFOR

WIRING SUBSTRATE

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

BUMP STRUCTURE AND METHOD OF MANUFACTURING BUMP STRUCTURE

METHODS AND APPARATUS TO REDUCE VARIATION IN HEIGHT OF BUMPS AFTER...

SEMICONDUCTOR PACKAGE HAVING DUMMY SOLDERS AND MANUFACTURING METHOD...

REPAIR OF SOLDER BUMPS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME