Pre-treatment of the connector or the bonding area

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H01L2224/85009

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85009Pre-treatment of the connector or the bonding area

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire cleaning guide
- Patent number 8,283,593
- Issue date Oct 9, 2012
- Kabushiki Kaisha Shinkawa
- Masayuki Horino
- B08 - CLEANING
Information Patent Grant
Semiconductor arrangement having specially fashioned bond wires
- Patent number 8,174,104
- Issue date May 8, 2012
- Micronas GmbH
- Pascal Stumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and wire bonding method
- Patent number 7,975,901
- Issue date Jul 12, 2011
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,889,513
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and manufacturing method of semiconductor device
- Patent number 7,834,465
- Issue date Nov 16, 2010
- NEC Electronics Corporation
- Tsutomu Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method
- Patent number 7,576,297
- Issue date Aug 18, 2009
- Kabushiki Kaisha Shinkawa
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wirebonder to bond an IC chip to a substrate
- Patent number 7,152,308
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit device manufacturing method including mounting circuit elem...
- Patent number 7,105,384
- Issue date Sep 12, 2006
- Sanyo Electric Co., LTD
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a device package
- Patent number 6,998,295
- Issue date Feb 14, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Makoto Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Initial ball forming method for wire bonding wire and wire bonding...
- Patent number 6,874,673
- Issue date Apr 5, 2005
- Kabushiki Kaisha Shinkawa
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed semiconductor device
- Patent number 6,753,596
- Issue date Jun 22, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 6,716,668
- Issue date Apr 6, 2004
- Oki Electric Industry Co., Ltd.
- Keiko Hayami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming pin-form wires and the like
- Patent number 6,687,988
- Issue date Feb 10, 2004
- Kabushiki Kaisha Shinkawa
- Kazuo Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bond surface conditioning system for improved bondability
- Patent number 6,602,726
- Issue date Aug 5, 2003
- Texas Instruments Incorporated
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-scale production of chip-scale semiconductor packages using w...
- Patent number 6,589,801
- Issue date Jul 8, 2003
- Amkor Technology, Inc.
- Ju-Hoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 6,530,512
- Issue date Mar 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Hiroshi Kawashimo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonded device with ball-shaped bonds
- Patent number 6,495,773
- Issue date Dec 17, 2002
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two step wire bond process
- Patent number 6,461,898
- Issue date Oct 8, 2002
- Motorola, Inc.
- Seok Mo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor device
- Patent number 6,399,414
- Issue date Jun 4, 2002
- Oki Electric Industry Co., Ltd.
- Keiko Hayami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a gold plating electrode a substrate based on th...
- Patent number 6,331,347
- Issue date Dec 18, 2001
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 6,215,182
- Issue date Apr 10, 2001
- Fujitsu Limited
- Kaname Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with an improved lead-chip adhesion structure...
- Patent number 6,211,573
- Issue date Apr 3, 2001
- NEC Corporation
- Michihiko Ichinose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two step wire bond process
- Patent number 6,165,888
- Issue date Dec 26, 2000
- Motorola, Inc.
- Seok Mo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method
- Patent number 6,134,777
- Issue date Oct 24, 2000
- Robert Bosch GmbH
- Ingolf Wildner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid and selective heating method in integrated circuit package as...
- Patent number 6,041,994
- Issue date Mar 28, 2000
- Texas Instruments Incorporated
- Ming Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for producing electronic elements
- Patent number 5,992,725
- Issue date Nov 30, 1999
- Kabushiki Kaisha Toshiba
- Hidemitsu Egawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method, semiconductor device, capillary for wire bondi...
- Patent number 5,842,628
- Issue date Dec 1, 1998
- Fujitsu Limited
- Ryuji Nomoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding apparatus and method using a covered wire
- Patent number 5,797,388
- Issue date Aug 25, 1998
- Kabushiki Kaisha Shinkawa
- Osamu Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a gold plating electrode, a substrate based on t...
- Patent number 5,767,008
- Issue date Jun 16, 1998
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method
- Patent number 5,647,942
- Issue date Jul 15, 1997
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Haji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20100294435
- Publication date Nov 25, 2010
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND...
- Publication number 20090302447
- Publication date Dec 10, 2009
- Pascal Stumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20090294158
- Publication date Dec 3, 2009
- Naoki Matsushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDI...
- Publication number 20090166861
- Publication date Jul 2, 2009
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20090166774
- Publication date Jul 2, 2009
- FUJIFILM CORPORATION
- Hidenobu TAKAHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, and manufacturing method of semiconductor device
- Publication number 20090072416
- Publication date Mar 19, 2009
- NEC Electronics Corporation
- Tsutomu Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Cleaning Guide
- Publication number 20080197168
- Publication date Aug 21, 2008
- KABUSHIKI KAISHA SHINKAWA
- Masayuki Horino
- B08 - CLEANING
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL
- Publication number 20080185737
- Publication date Aug 7, 2008
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus
- Publication number 20080023525
- Publication date Jan 31, 2008
- KABUSHIKI KAISHA SHINKAWA
- Toru Maeda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor package substrate and semiconductor package having th...
- Publication number 20070278659
- Publication date Dec 6, 2007
- Siliconware Precision Industries Co., Ltd.
- Wen Liang Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070158392
- Publication date Jul 12, 2007
- RENESAS TECHNOLOGY CORP.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond Surface Conditioning System for Improved Bondability
- Publication number 20070094867
- Publication date May 3, 2007
- TEXAS INSTRUMENTS INCORPORATED
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding apparatus and method
- Publication number 20070000878
- Publication date Jan 4, 2007
- KABUSHIKI KAISHA SHINKAWA
- Kazuo Fujita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding apparatus and method
- Publication number 20070001320
- Publication date Jan 4, 2007
- KABUSHIKI KAISHA SHINKAWA
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060216863
- Publication date Sep 28, 2006
- Renesas Technology Corp.
- Hideyuki Arakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for removing material from a substrate surface
- Publication number 20060037700
- Publication date Feb 23, 2006
- NANOFILM TECHNOLOGIES INTERNATIONAL PTE LTD
- Xu Shi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor device and method of wire bonding for semiconductor d...
- Publication number 20040188858
- Publication date Sep 30, 2004
- DENSO Corporation
- Yoshifumi Watanabe
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device
- Publication number 20040159924
- Publication date Aug 19, 2004
- RENESAS TECHNOLOGY CORP.
- Shigeo Tokumitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device manufacturing method
- Publication number 20040152241
- Publication date Aug 5, 2004
- Ryosuke Usui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device package and method of manufacturing the same
- Publication number 20040115918
- Publication date Jun 17, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Makoto Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20040108602
- Publication date Jun 10, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Dai Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond surface conditioning system for improved bondability
- Publication number 20040093725
- Publication date May 20, 2004
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Initial ball forming method for wire bonding wire and wire bonding...
- Publication number 20040000577
- Publication date Jan 1, 2004
- KABUSHIKI KAISHA SHINKAWA
- Shinichi Nishiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND SURFACE CONDITIONING SYSTEM FOR IMPROVED BONDABILITY
- Publication number 20030143778
- Publication date Jul 31, 2003
- Sean Michael Malolepszy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming semiconductor device
- Publication number 20020137259
- Publication date Sep 26, 2002
- Keiko Hayami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding apparatus and wire bonding method
- Publication number 20020066773
- Publication date Jun 6, 2002
- Hiroshi Kawashimo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A GOLD PLATING ELECTRODE A SUBSTRATE BASED ON TH...
- Publication number 20010008685
- Publication date Jul 19, 2001
- HIROSHI HAJI
- H01 - BASIC ELECTRIC ELEMENTS

Pre-treatment of the connector or the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire cleaning guide

Semiconductor arrangement having specially fashioned bond wires

Bonding apparatus and wire bonding method

Semiconductor device

Semiconductor device, and manufacturing method of semiconductor device

Bonding apparatus and method

Wirebonder to bond an IC chip to a substrate

Circuit device manufacturing method including mounting circuit elem...

Method of manufacturing a device package

Initial ball forming method for wire bonding wire and wire bonding...

Resin-sealed semiconductor device

Method for forming semiconductor device

Method for forming pin-form wires and the like

Bond surface conditioning system for improved bondability

Wafer-scale production of chip-scale semiconductor packages using w...

Wire bonding apparatus and wire bonding method

Wire bonded device with ball-shaped bonds

Two step wire bond process

Method for forming semiconductor device

Method for forming a gold plating electrode a substrate based on th...

Semiconductor device and method for producing the same

Semiconductor device with an improved lead-chip adhesion structure...

Two step wire bond process

Bonding method

Rapid and selective heating method in integrated circuit package as...

Apparatus and method for producing electronic elements

Wire bonding method, semiconductor device, capillary for wire bondi...

Wire-bonding apparatus and method using a covered wire

Method for forming a gold plating electrode, a substrate based on t...

Wire bonding method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

BONDING APPARATUS AND WIRE BONDING METHOD

SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND...

ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDI...

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor device, and manufacturing method of semiconductor device

Wire Cleaning Guide

INTEGRATED CIRCUIT SYSTEM WITH PRE-CONFIGURED BOND WIRE BALL

Bonding apparatus

Semiconductor package substrate and semiconductor package having th...

Semiconductor device and a method of manufacturing the same

Bond Surface Conditioning System for Improved Bondability

Bonding apparatus and method

Bonding apparatus and method

Method of manufacturing semiconductor device

Method and apparatus for removing material from a substrate surface

Semiconductor device and method of wire bonding for semiconductor d...

Semiconductor device

Circuit device manufacturing method

Device package and method of manufacturing the same

RESIN-SEALED SEMICONDUCTOR DEVICE

Bond surface conditioning system for improved bondability

Initial ball forming method for wire bonding wire and wire bonding...

BOND SURFACE CONDITIONING SYSTEM FOR IMPROVED BONDABILITY

Method for forming semiconductor device

Wire bonding apparatus and wire bonding method

METHOD FOR FORMING A GOLD PLATING ELECTRODE A SUBSTRATE BASED ON TH...