Pretreatment of metal

Industry

CPC
H05K2203/0392

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0392Pretreatment of metal

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,807,947
- Issue date Nov 7, 2023
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Methods of etching conductive features, and related devices and sys...
- Patent number 11,425,822
- Issue date Aug 23, 2022
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 11,255,018
- Issue date Feb 22, 2022
- KATEEVA, LTD.
- Nava Shpaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 11,102,892
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of etching conductive features, and related devices and sys...
- Patent number 11,006,528
- Issue date May 11, 2021
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for producing an etch resist pattern on a metallic surface
- Patent number 10,806,035
- Issue date Oct 13, 2020
- Kateeva, Inc.
- Nava Shpaisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treated copper foil, copper foil with carrier, laminate, me...
- Patent number 10,791,631
- Issue date Sep 29, 2020
- JX Nippon Mining & Metals Corporation
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating metal foil with n-heterocyclic carbene compounds containing...
- Patent number 10,588,222
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Grant
System for pressing pre-tin shaping
- Patent number 10,512,172
- Issue date Dec 17, 2019
- Tyco Electronics (Dongguan) Co., Ltd.
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced substrate includes a carbene-coated metal foil laminated t...
- Patent number 10,506,723
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Dylan J. Boday
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Methods of etching conductive features, and related devices and sys...
- Patent number 10,398,034
- Issue date Aug 27, 2019
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 10,366,949
- Issue date Jul 30, 2019
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing traces of PCB
- Patent number 10,306,768
- Issue date May 28, 2019
- TRIALLIAN CORPORATION
- Albert Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure
- Patent number 10,219,384
- Issue date Feb 26, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transparent conductive layer, a film comprising the layer, and a pr...
- Patent number 10,201,082
- Issue date Feb 5, 2019
- BASF SE
- Rui Zhang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Coating metal foil with N-heterocyclic carbene compounds containing...
- Patent number 9,974,193
- Issue date May 15, 2018
- International Business Machines Corporation
- Dylan J. Boday
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and semiconductor device
- Patent number 9,875,957
- Issue date Jan 23, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of forming articles including metal structures having maxim...
- Patent number 9,468,986
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Ernesto Gene de la Garza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate having a circuit pattern and method for making th...
- Patent number 9,474,161
- Issue date Oct 18, 2016
- Taiwan Green Point Enterprises Co., Ltd.
- Sheng-Hung Yi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing the same
- Patent number 9,253,897
- Issue date Feb 2, 2016
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and process for producing same
- Patent number 8,785,785
- Issue date Jul 22, 2014
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 8,637,775
- Issue date Jan 28, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyoung Hwan Lim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated wiring board and method for manufacturing the same
- Patent number 8,502,086
- Issue date Aug 6, 2013
- Fujikura Ltd.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photoresist-free metal deposition
- Patent number 8,500,985
- Issue date Aug 6, 2013
- Novellus Systems, Inc.
- Steven T. Mayer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing pattern-forming metal structures on a carri...
- Patent number 8,202,567
- Issue date Jun 19, 2012
- Atotech Deutschland GmbH
- Franz Kohnle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 8,052,882
- Issue date Nov 8, 2011
- Shinko Electric Industries Co., Ltd.
- Hitoshi Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aqueous solution for surface treatment of metal and method for prev...
- Patent number 8,043,662
- Issue date Oct 25, 2011
- Rohm and Haas Electronic Materials LLC
- Masanori Orihashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20240035167
- Publication date Feb 1, 2024
- Kateeva, Inc.
- Nava Shpaisman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...
- Publication number 20220220272
- Publication date Jul 14, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Yuki KITAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...
- Publication number 20220145460
- Publication date May 12, 2022
- JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
- Jian Zong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20220136113
- Publication date May 5, 2022
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...
- Publication number 20210227696
- Publication date Jul 22, 2021
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE
- Publication number 20210007225
- Publication date Jan 7, 2021
- Kateeva, Inc.
- Nava Shpaisman
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...
- Publication number 20190335589
- Publication date Oct 31, 2019
- Kateeva, Inc.
- Nava Shpaisman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...
- Publication number 20180192521
- Publication date Jul 5, 2018
- Jet Cu Pcb Ltd.
- Nava SHPAISMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...
- Publication number 20180168051
- Publication date Jun 14, 2018
- International Business Machines Corporation
- Dylan J. Boday
- B32 - LAYERED PRODUCTS
Information Patent Application
Wiring Substrate and Semiconductor Device
- Publication number 20180166372
- Publication date Jun 14, 2018
- Shinko Electric Industries Co., Ltd.
- Noriyoshi SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...
- Publication number 20180160546
- Publication date Jun 7, 2018
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT CONDUCTIVE LAYER, A FILM COMPRISING THE LAYER, AND A PR...
- Publication number 20170251553
- Publication date Aug 31, 2017
- BASF SE
- Rui ZHANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...
- Publication number 20160157362
- Publication date Jun 2, 2016
- International Business Machines Corporation
- Dylan J. Boday
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rough Copper for Noise Reduction in High Speed Circuits
- Publication number 20160088722
- Publication date Mar 24, 2016
- DELL PRODUCTS, L.P.
- Sandor Farkas
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160050755
- Publication date Feb 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20140291385
- Publication date Oct 2, 2014
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140110023
- Publication date Apr 24, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Hwan LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTORESIST-FREE METAL DEPOSITION
- Publication number 20140014522
- Publication date Jan 16, 2014
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING TH...
- Publication number 20120273261
- Publication date Nov 1, 2012
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sheng-Hung YI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20120168209
- Publication date Jul 5, 2012
- Toshiba Materials Co., Ltd.
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board and Method Of Manufacturing The Same
- Publication number 20110247858
- Publication date Oct 13, 2011
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyoung Hwan LIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHANT FOR COPPER OR COPPER ALLOY, LIQUID FOR ETCHING PRETREATMENT...
- Publication number 20110049104
- Publication date Mar 3, 2011
- Makoto Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH H...
- Publication number 20100215840
- Publication date Aug 26, 2010
- J.G. Systems Inc.
- John J. Grunwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100147576
- Publication date Jun 17, 2010
- FUJIKURA LTD.
- Takaharu Hondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING PATTERN-FORMING METAL STRUCTURES ON A CARRI...
- Publication number 20100136252
- Publication date Jun 3, 2010
- Franz Kohnle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD
- Publication number 20100059257
- Publication date Mar 11, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jin-Hak CHOI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20090283497
- Publication date Nov 19, 2009
- Shinko Electric Industries Co., Ltd.
- Hitoshi KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090277801
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Photoresist-free metal deposition
- Publication number 20090280243
- Publication date Nov 12, 2009
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY
- Publication number 20090184090
- Publication date Jul 23, 2009
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Markus WUCHSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Pretreatment of metal

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods for producing an etch resist pattern on a metallic surface

Methods of etching conductive features, and related devices and sys...

Methods for producing an etch resist pattern on a metallic surface

Method for producing a printed circuit board structure

Coating metal foil with N-heterocyclic carbene compounds containing...

Methods of etching conductive features, and related devices and sys...

Methods for producing an etch resist pattern on a metallic surface

Surface treated copper foil, copper foil with carrier, laminate, me...

Coating metal foil with n-heterocyclic carbene compounds containing...

System for pressing pre-tin shaping

Enhanced substrate includes a carbene-coated metal foil laminated t...

Methods of etching conductive features, and related devices and sys...

Wiring substrate and semiconductor device

Method for manufacturing traces of PCB

Circuit board structure

Transparent conductive layer, a film comprising the layer, and a pr...

Coating metal foil with N-heterocyclic carbene compounds containing...

Wiring substrate and semiconductor device

Printed wiring board, method for manufacturing printed wiring board...

Security mesh and method of making

Methods of forming articles including metal structures having maxim...

Circuit substrate having a circuit pattern and method for making th...

Wiring substrate and method for manufacturing the same

Ceramic circuit board and process for producing same

Printed circuit board and method of manufacturing the same

Laminated wiring board and method for manufacturing the same

Photoresist-free metal deposition

Method of manufacturing pattern-forming metal structures on a carri...

Method of manufacturing wiring substrate

Aqueous solution for surface treatment of metal and method for prev...

Patents Applicationslast 30 patents

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

COPPER-CLAD LAMINATED PLATE, RESIN-CLAD COPPER FOIL, AND CIRCUIT SU...

Hydrophobic Low-Dielectric-Constant Film and Preparation Method The...

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...

METHODS FOR PRODUCING AN ETCH RESIST PATTERN ON A METALLIC SURFACE

METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...

METHODS OF ETCHING CONDUCTIVE FEATURES, AND RELATED DEVICES AND SYS...

COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...

Wiring Substrate and Semiconductor Device

Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Me...

TRANSPARENT CONDUCTIVE LAYER, A FILM COMPRISING THE LAYER, AND A PR...

COATING METAL FOIL WITH N-HETEROCYCLIC CARBENE COMPOUNDS CONTAINING...

Rough Copper for Noise Reduction in High Speed Circuits

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PHOTORESIST-FREE METAL DEPOSITION

CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING TH...

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

Printed Circuit Board and Method Of Manufacturing The Same

ETCHANT FOR COPPER OR COPPER ALLOY, LIQUID FOR ETCHING PRETREATMENT...

METHOD AND COMPOSITION TO ENHANCE CORROSION RESISTANCE OF THROUGH H...

LAMINATED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING PATTERN-FORMING METAL STRUCTURES ON A CARRI...

METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING WIRING SUBSTRATE

Photoresist-free metal deposition

Photoresist-free metal deposition

THIN-FILM ASSEMBLY AND METHOD FOR PRODUCING SAID ASSEMBLY