Promethium [Pm]

Industry

CPC
H01L2924/01061

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01061Promethium [Pm]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming sacrificial adhesive ove...
- Patent number 10,998,248
- Issue date May 4, 2021
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 10,651,139
- Issue date May 12, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 10,559,494
- Issue date Feb 11, 2020
- Tessera, Inc.
- Vage Oganesian
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,470,346
- Issue date Nov 5, 2019
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming flipchip interconnect st...
- Patent number 10,388,626
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor component comprising copper metallizations
- Patent number 10,347,580
- Issue date Jul 9, 2019
- Infineon Technologies Austria AG
- Matthias Stecher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 10,312,217
- Issue date Jun 4, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module with EMI protection
- Patent number 10,010,019
- Issue date Jun 26, 2018
- GE Embedded Electronics Oy
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,966,303
- Issue date May 8, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating nanostructures and nanowires and devices fab...
- Patent number 9,881,999
- Issue date Jan 30, 2018
- The Regents of the University of California
- Arun Majumdar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Power semiconductor device and method therefor
- Patent number 9,865,590
- Issue date Jan 9, 2018
- Xenogenic Development Limited Liability Company
- Robert Bruce Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertical interconnect st...
- Patent number 9,847,309
- Issue date Dec 19, 2017
- STATS ChipPAC Pte. Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rigid-flex electronic module
- Patent number 9,674,948
- Issue date Jun 6, 2017
- GE Embedded Electronics Oy
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic elements with post-assembly planarization
- Patent number 9,659,812
- Issue date May 23, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of providing z-interconnect conduct...
- Patent number 9,640,504
- Issue date May 2, 2017
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor elements using micro-abrasive part...
- Patent number 9,640,437
- Issue date May 2, 2017
- Tessera, Inc.
- Vage Oganesian
- B24 - GRINDING POLISHING
Information Patent Grant
Stacked microelectronic assembly with TSVS formed in stages and car...
- Patent number 9,620,437
- Issue date Apr 11, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optical sensor and method of forming inte...
- Patent number 9,525,080
- Issue date Dec 20, 2016
- STATS ChipPAC Pte. Ltd.
- Zigmund R. Camacho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure element and method for producing a conductor st...
- Patent number 9,456,500
- Issue date Sep 27, 2016
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flex module and manufacturing method
- Patent number 9,425,158
- Issue date Aug 23, 2016
- GE Embedded Electronics Oy
- Antti Iihola
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of forming wafer level ground plane...
- Patent number 9,390,991
- Issue date Jul 12, 2016
- STATS ChipPAC Pte. Ltd.
- Guruprasad G. Badakere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor laser mounting for improved frequency stability
- Patent number 9,368,934
- Issue date Jun 14, 2016
- SpectraSensors, Inc.
- Gabi Neubauer
- G01 - MEASURING TESTING
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,318,426
- Issue date Apr 19, 2016
- Fujitsu Limited
- Motoaki Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming sacrificial adhesive ove...
- Patent number 9,318,441
- Issue date Apr 19, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microelectronic assembly with TSVS formed in stages and car...
- Patent number 9,269,692
- Issue date Feb 23, 2016
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Core-jacket bonding wire
- Patent number 9,236,166
- Issue date Jan 12, 2016
- Heraeus Deutschland GmbH & Co. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20180254213
- Publication date Sep 6, 2018
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20170256443
- Publication date Sep 7, 2017
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...
- Publication number 20140349008
- Publication date Nov 27, 2014
- 3D PLUS
- Christian Val
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS
- Publication number 20140252627
- Publication date Sep 11, 2014
- Infineon Technologies Austria AG
- Matthias STECHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Sacrificial Adhesive Ove...
- Publication number 20140252631
- Publication date Sep 11, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CAR...
- Publication number 20140206147
- Publication date Jul 24, 2014
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Providing Z-Interconnect Conduct...
- Publication number 20140203443
- Publication date Jul 24, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES
- Publication number 20140110844
- Publication date Apr 24, 2014
- Atotech Deutschland GmbH
- Albrecht Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE
- Publication number 20140051244
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Cheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS
- Publication number 20140042631
- Publication date Feb 13, 2014
- Infineon Technologies Austria AG
- Matthias STECHER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20130328132
- Publication date Dec 12, 2013
- Estivation Properties LLC
- Robert Bruce Davies
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130302570
- Publication date Nov 14, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...
- Publication number 20130295314
- Publication date Nov 7, 2013
- Maiko TANAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Chip Pad Resistant to Antenna Effect and Method
- Publication number 20130277860
- Publication date Oct 24, 2013
- Wu-Te Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER RECOVERY CIRCUIT BASED ON PARTIAL STANDING WAVES
- Publication number 20130260708
- Publication date Oct 3, 2013
- Ahmadreza Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORE-JACKET BONDING WIRE
- Publication number 20130213689
- Publication date Aug 22, 2013
- HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG
- Eugen Milke
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130187271
- Publication date Jul 25, 2013
- FUJITSU TEN LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE IN DIE BGA PACKAGE
- Publication number 20130154117
- Publication date Jun 20, 2013
- Micron Technology, Inc.
- Hock Chuan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...
- Publication number 20130105329
- Publication date May 2, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
- Publication number 20130099396
- Publication date Apr 25, 2013
- Henkel Corporation
- Jeffrey Gasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO FORM SOLDER ALLOY DEPOSITS ON SUBSTRATES
- Publication number 20130082091
- Publication date Apr 4, 2013
- Atotech Deutschland GmbH
- Kai-Jens Matejat
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT WITH ELECTROMAGNETIC INTRACHIP COMMUNICATION AND...
- Publication number 20130023210
- Publication date Jan 24, 2013
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
- Publication number 20130019458
- Publication date Jan 24, 2013
- Orthodyne Electronics Corporation
- Jonathan M. Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION
- Publication number 20130010441
- Publication date Jan 10, 2013
- Tessera, Inc.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductor Structural Element and Method for Producing a Conductor S...
- Publication number 20120320549
- Publication date Dec 20, 2012
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20120309131
- Publication date Dec 6, 2012
- Renesas Electronics Corporation
- KOJI BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE

Promethium [Pm]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of forming sacrificial adhesive ove...

Semiconductor integrated circuit device

Semiconductor device and method of forming wafer level ground plane...

Microelectronic elements with post-assembly planarization

Electronic module with EMI protection

Semiconductor device and method of forming flipchip interconnect st...

Semiconductor component comprising copper metallizations

Method for low temperature bonding and bonded structure

Electronic module with EMI protection

Microelectronic elements with post-assembly planarization

Methods of fabricating nanostructures and nanowires and devices fab...

Power semiconductor device and method therefor

Semiconductor device and method of forming vertical interconnect st...

Rigid-flex electronic module

Microelectronic elements with post-assembly planarization

Semiconductor device and method of providing z-interconnect conduct...

Methods of forming semiconductor elements using micro-abrasive part...

Stacked microelectronic assembly with TSVS formed in stages and car...

Semiconductor device with optical sensor and method of forming inte...

Semiconductor integrated circuit device

Conductor structure element and method for producing a conductor st...

Rigid-flex module and manufacturing method

Method for low temperature bonding and bonded structure

Semiconductor device and method of forming wafer level ground plane...

Semiconductor laser mounting for improved frequency stability

Method for low temperature bonding and bonded structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming sacrificial adhesive ove...

Stacked microelectronic assembly with TSVS formed in stages and car...

Core-jacket bonding wire

Patents Applicationslast 30 patents

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...

SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS

Semiconductor Device and Method of Forming Sacrificial Adhesive Ove...

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

STACKED MICROELECTRONIC ASSEMBLY WITH TSVS FORMED IN STAGES AND CAR...

Semiconductor Device and Method of Providing Z-Interconnect Conduct...

WIRE BONDABLE SURFACE FOR MICROELECTRONIC DEVICES

METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR COMPONENT COMPRISING COPPER METALLIZATIONS

POWER SEMICONDUCTOR DEVICE AND METHOD THEREFOR

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

ADHESIVE SHEET AND METHOD FOR MANUFACTURING THE SAME, SEMICONDUCTOR...

Chip Pad Resistant to Antenna Effect and Method

POWER RECOVERY CIRCUIT BASED ON PARTIAL STANDING WAVES

CORE-JACKET BONDING WIRE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED DIE IN DIE BGA PACKAGE

METHOD TO FORM SOLDER DEPOSITS AND NON-MELTING BUMP STRUCTURES ON S...

WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE

METHOD TO FORM SOLDER ALLOY DEPOSITS ON SUBSTRATES

INTEGRATED CIRCUIT WITH ELECTROMAGNETIC INTRACHIP COMMUNICATION AND...

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

MICROELECTRONIC ELEMENTS WITH POST-ASSEMBLY PLANARIZATION

Conductor Structural Element and Method for Producing a Conductor S...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR