Protection against chemical alteration

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CPC
B81B7/0025

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0025Protection against chemical alteration

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Micromechanical component for a sensor device or microphone device
- Patent number 12,151,936
- Issue date Nov 26, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for fabricating MEMS havi...
- Patent number 12,103,845
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical sensor and microelect...
- Patent number 11,958,740
- Issue date Apr 16, 2024
- Robert Bosch GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 11,885,689
- Issue date Jan 30, 2024
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Corrosion tolerant micro-electromechanical fluid ejection device
- Patent number 11,787,180
- Issue date Oct 17, 2023
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,752,499
- Issue date Sep 12, 2023
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Actuator layer patterning with polysilicon and etch stop layer
- Patent number 11,731,871
- Issue date Aug 22, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone device with ingress protection
- Patent number 11,671,766
- Issue date Jun 6, 2023
- KNOWLES ELECTRONICS, LLC.
- Sung Bok Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor package
- Patent number 11,565,933
- Issue date Jan 31, 2023
- Infineon Technologies AG
- Michael Kandler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planarization layers over silicon dies
- Patent number 11,364,493
- Issue date Jun 21, 2022
- Hewlett-Packard Development Company, L.P.
- Michael W. Cumbie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate assembly and method of bonding substrates
- Patent number 11,167,284
- Issue date Nov 9, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- Sung-Yi Yang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical component and method for producing same
- Patent number 11,148,940
- Issue date Oct 19, 2021
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Dirk Rudloff
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reflective device
- Patent number 11,099,379
- Issue date Aug 24, 2021
- Google LLC
- Nicolas Abele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Environmentally protected sensing device
- Patent number 10,964,613
- Issue date Mar 30, 2021
- Invensense, Inc.
- Calin Miclaus
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,924,867
- Issue date Feb 16, 2021
- Knowles Electroics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Insulated sensors
- Patent number 10,876,986
- Issue date Dec 29, 2020
- Hewlett-Packard Development Company, L.P.
- George H. Corrigan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deposition of protective material at wafer level in front end for e...
- Patent number 10,858,245
- Issue date Dec 8, 2020
- Infineon Technologies AG
- Florian Brandl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wearable device with combined sensing capabilities
- Patent number 10,852,192
- Issue date Dec 1, 2020
- Pixart Imaging Incorporation
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor device and method for fabricating the same
- Patent number 10,818,805
- Issue date Oct 27, 2020
- Infineon Technologies AG
- Franz-Peter Kalz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Release chemical protection for integrated complementary metal-oxid...
- Patent number 10,683,205
- Issue date Jun 16, 2020
- Invensense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High performance sealed-gap capacitive microphone
- Patent number 10,681,473
- Issue date Jun 9, 2020
- Hayrettin Koymen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hybrid diamond-polymer thin film sensors and fabrication method
- Patent number 10,667,709
- Issue date Jun 2, 2020
- Board of Trustees of Michigan State University
- Wen Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,631,099
- Issue date Apr 21, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,965
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,687
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,407,302
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,364,146
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reflective device to scan light to project an image on a display su...
- Patent number 10,365,477
- Issue date Jul 30, 2019
- North Inc.
- Nicolas Abele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Structure for device with integrated microelectromechanical systems
- Patent number 10,343,902
- Issue date Jul 9, 2019
- Soitec
- Bruno Ghyselen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electromechanical device including connector formed of dielectric m...
- Patent number 10,280,078
- Issue date May 7, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Wei Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
- Publication number 20240425366
- Publication date Dec 26, 2024
- United Microelectronics Corp.
- Jung-Hao CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OVER-THE-SINK DRYING ELEMENT
- Publication number 20240406640
- Publication date Dec 5, 2024
- DORAI HOME, INC.
- Jason Klug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20240118141
- Publication date Apr 11, 2024
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
- Publication number 20230415482
- Publication date Dec 28, 2023
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A MICROFLUIDIC SENSOR
- Publication number 20230404777
- Publication date Dec 21, 2023
- CAMBRIDGE ENTERPRISE LIMITED
- Sohini KAR-NARAYAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFLUIDIC PASSAGE WITH PROTECTIVE LAYER
- Publication number 20230241889
- Publication date Aug 3, 2023
- Hewlett-Packard Development Company, L.P.
- Juan Carlos Ramos
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE
- Publication number 20220396477
- Publication date Dec 15, 2022
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER
- Publication number 20220380209
- Publication date Dec 1, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE DEVICE WITH INGRESS PROTECTION
- Publication number 20220150645
- Publication date May 12, 2022
- KNOWLES ELECTRONICS, LLC
- Sung Bok LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GAS SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20220128498
- Publication date Apr 28, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Seungeon MOON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...
- Publication number 20220119248
- Publication date Apr 21, 2022
- United Microelectronics Corp.
- Jung-Hao CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
- Publication number 20220040691
- Publication date Feb 10, 2022
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sung-Yi YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE
- Publication number 20220040977
- Publication date Feb 10, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A MICROELECTROMECHANICAL SENSOR AND MICROELECT...
- Publication number 20220033256
- Publication date Feb 3, 2022
- ROBERT BOSCH GmbH
- Achim Kronenberger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20210188625
- Publication date Jun 24, 2021
- SENSIRION AG
- Matthias STUDER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20210041298
- Publication date Feb 11, 2021
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANARIZATION LAYERS OVER SILICON DIES
- Publication number 20200282394
- Publication date Sep 10, 2020
- Hewlett-Packard Development Company, L.P.
- Michael W. Cumbie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME
- Publication number 20200239303
- Publication date Jul 30, 2020
- Fraunhofer-Gesellschaft zur foerderung der Angewandten Forschung e.V.
- Dirk RUDLOFF
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE
- Publication number 20200245078
- Publication date Jul 30, 2020
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE
- Publication number 20200092657
- Publication date Mar 19, 2020
- Nanofone Limited
- Hayrettin Koymen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR PACKAGE
- Publication number 20200039815
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Michael KANDLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REFLECTIVE DEVICE
- Publication number 20190146212
- Publication date May 16, 2019
- NORTH INC.
- Nicolas Abele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES
- Publication number 20190126272
- Publication date May 2, 2019
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Sung-Yi YANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AMORPHOUS THIN METAL FILM
- Publication number 20190119101
- Publication date Apr 25, 2019
- Hewlett-Packard Development Company, L.P.
- James Elmer Abbott
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES
- Publication number 20190113390
- Publication date Apr 18, 2019
- PIXART IMAGING INCORPORATION
- Chih-Ming Sun
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RELEASE CHEMICAL PROTECTION FOR INTEGRATED COMPLEMENTARY METAL-OXID...
- Publication number 20180346323
- Publication date Dec 6, 2018
- InvenSense, Inc.
- Michael J. Daneman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE
- Publication number 20180302726
- Publication date Oct 18, 2018
- Nanofone Ltd.
- Hayrettin Koymen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS-SENSOR STRUCTURES
- Publication number 20180086664
- Publication date Mar 29, 2018
- VAON, LLC
- Henry Steen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180044177
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE FOR DEVICE WITH INTEGRATED MICROELECTROMECHANICAL SYSTEMS
- Publication number 20170253478
- Publication date Sep 7, 2017
- SOITEC
- Bruno Ghyselen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Protection against chemical alteration

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Micromechanical component for a sensor device or microphone device

Micro-electromechanical system and method for fabricating MEMS havi...

Method for producing a microelectromechanical sensor and microelect...

Wearable device with combined sensing capabilities

Corrosion tolerant micro-electromechanical fluid ejection device

Substrate assembly and method of bonding substrates

Actuator layer patterning with polysilicon and etch stop layer

Microphone device with ingress protection

Sensor package

Planarization layers over silicon dies

Substrate assembly and method of bonding substrates

Microelectromechanical component and method for producing same

Reflective device

Environmentally protected sensing device

Microphone package

Insulated sensors

Deposition of protective material at wafer level in front end for e...

Wearable device with combined sensing capabilities

Semiconductor sensor device and method for fabricating the same

Release chemical protection for integrated complementary metal-oxid...

High performance sealed-gap capacitive microphone

Hybrid diamond-polymer thin film sensors and fabrication method

Microphone package

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Reflective device to scan light to project an image on a display su...

Structure for device with integrated microelectromechanical systems

Electromechanical device including connector formed of dielectric m...

Patents Applicationslast 30 patents

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...

OVER-THE-SINK DRYING ELEMENT

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

A MICROFLUIDIC SENSOR

MICROFLUIDIC PASSAGE WITH PROTECTIVE LAYER

MICROMECHANICAL COMPONENT FOR A SENSOR DEVICE OR MICROPHONE DEVICE

ACTUATOR LAYER PATTERNING WITH POLYSILICON AND ETCH STOP LAYER

MICROPHONE DEVICE WITH INGRESS PROTECTION

GAS SENSOR AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR FABRICATING MEMS HAVI...

SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES

A CORROSION TOLERANT MICRO-ELECTROMECHANICAL FLUID EJECTION DEVICE

METHOD FOR PRODUCING A MICROELECTROMECHANICAL SENSOR AND MICROELECT...

SEMICONDUCTOR CHIP

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

PLANARIZATION LAYERS OVER SILICON DIES

MICROELECTROMECHANICAL COMPONENT AND METHOD FOR PRODUCING SAME

MICROPHONE PACKAGE

HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE

SENSOR PACKAGE

REFLECTIVE DEVICE

SUBSTRATE ASSEMBLY AND METHOD OF BONDING SUBSTRATES

AMORPHOUS THIN METAL FILM

WEARABLE DEVICE WITH COMBINED SENSING CAPABILITIES

RELEASE CHEMICAL PROTECTION FOR INTEGRATED COMPLEMENTARY METAL-OXID...

HIGH PERFORMANCE SEALED-GAP CAPACITIVE MICROPHONE

GLASS-SENSOR STRUCTURES

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

STRUCTURE FOR DEVICE WITH INTEGRATED MICROELECTROMECHANICAL SYSTEMS