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CPC
B81B7/0019

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0019Protection against thermal alteration or destruction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for dissipating heat with microelectromechanic...
- Patent number 11,760,626
- Issue date Sep 19, 2023
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for operating a mems device based on sensed tem...
- Patent number 11,738,994
- Issue date Aug 29, 2023
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with optimized geometry for reducing the offset due to...
- Patent number 11,603,310
- Issue date Mar 14, 2023
- STMicroelectronics S.r.l.
- Francesco Rizzini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for operating a MEMS device based on sensed tem...
- Patent number 11,548,780
- Issue date Jan 10, 2023
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hydrogen sensor on medium or low temperature solid micro heating pl...
- Patent number 11,440,793
- Issue date Sep 13, 2022
- Shanghai Jiaotong University
- Guifu Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive sensors having temperature stable output
- Patent number 11,427,465
- Issue date Aug 30, 2022
- Sciosense B.V.
- Olaf Wunnicke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for dissipating heat with microelectromechanic...
- Patent number 11,358,860
- Issue date Jun 14, 2022
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for operating a MEMS device based on sensed tem...
- Patent number 11,186,479
- Issue date Nov 30, 2021
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure relief device for microphone protection in an electronic d...
- Patent number 11,046,576
- Issue date Jun 29, 2021
- Motorola Mobility LLC
- Giles Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,924,867
- Issue date Feb 16, 2021
- Knowles Electroics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High temperature capacitive MEMS pressure sensor
- Patent number 10,823,631
- Issue date Nov 3, 2020
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Planar processing of suspended microelectromechanical systems (MEMS...
- Patent number 10,800,649
- Issue date Oct 13, 2020
- Analog Devices International Unlimited Company
- Michael John Flynn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitive RF MEMS intended for high-power applications
- Patent number 10,770,640
- Issue date Sep 8, 2020
- Thales
- Afshin Ziaei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon carbide microelectromechanical structure, device, and method
- Patent number 10,717,642
- Issue date Jul 21, 2020
- The Government of the United States of America, as represented by the Secreta...
- Francis J. Kub
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microphone package
- Patent number 10,631,099
- Issue date Apr 21, 2020
- Knowles Electronics, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon carbide microelectromechanical structure, device, and method
- Patent number 10,589,983
- Issue date Mar 17, 2020
- The Government of the United States of America, as represented by the Secreta...
- Francis J. Kub
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared sensor design using an epoxy film as an infrared absorptio...
- Patent number 10,570,006
- Issue date Feb 25, 2020
- Texas Instruments Incorporated
- Ricky Alan Jackson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Infrared sensor design using an epoxy film as an infrared absorptio...
- Patent number 10,526,198
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Ricky Alan Jackson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical resonator with improved electrical features
- Patent number 10,501,310
- Issue date Dec 10, 2019
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Proof mass and polysilicon electrode integrated thereon
- Patent number 10,505,006
- Issue date Dec 10, 2019
- Invensense, Inc.
- Bongsang Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Internal temperature measurement device
- Patent number 10,190,921
- Issue date Jan 29, 2019
- Omron Corporation
- Shinya Nakagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded structures for high glass strength and robust packaging
- Patent number 10,189,707
- Issue date Jan 29, 2019
- Continental Automotive Systems, Inc.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Monolithic fabrication of thermally isolated microelectromechanical...
- Patent number 10,131,535
- Issue date Nov 20, 2018
- Honeywell International Inc.
- John R. Reinke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated micro-channel heatsink in DMD substrate for enhanced coo...
- Patent number 9,971,147
- Issue date May 15, 2018
- Xerox Corporation
- Christopher D. Atwood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for an ovenized silicon platform using Si/SiO2 hy...
- Patent number 9,957,159
- Issue date May 1, 2018
- Weibin Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component and corresponding test method for a micro...
- Patent number 9,764,945
- Issue date Sep 19, 2017
- Robert Bosch GmbH
- Sebastian Reiss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for nuclear event circumvention in an inertial...
- Patent number 9,580,300
- Issue date Feb 28, 2017
- Honeywell International Inc.
- Robert Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device connected to a substrate by flexible support structures
- Patent number 9,334,153
- Issue date May 10, 2016
- HRL Laboratories, LLC
- Raviv Perahia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thermally shorted bolometer
- Patent number 9,199,838
- Issue date Dec 1, 2015
- Robert Bosch GmbH
- Gary O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensing device to minimize thermal noise
- Patent number 8,881,596
- Issue date Nov 11, 2014
- Continental Automotive Systems, Inc.
- Jen-Huang Albert Chiou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...
- Publication number 20230331545
- Publication date Oct 19, 2023
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20230304879
- Publication date Sep 28, 2023
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20230107211
- Publication date Apr 6, 2023
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MOR...
- Publication number 20230094674
- Publication date Mar 30, 2023
- SKYWORKS GLOBAL PTE. LTD.
- Siarhei Dmitrievich Barsukou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
- Publication number 20230016416
- Publication date Jan 19, 2023
- Rohm Co., Ltd.
- Toru HIGUCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTRONICS H-FRAME DEVICE
- Publication number 20220289559
- Publication date Sep 15, 2022
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...
- Publication number 20220259036
- Publication date Aug 18, 2022
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20220048760
- Publication date Feb 17, 2022
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...
- Publication number 20210323811
- Publication date Oct 21, 2021
- Cisco Technology, Inc.
- Joel Richard Goergen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pressure Relief Device for Microphone Protection in an Electronic D...
- Publication number 20210171338
- Publication date Jun 10, 2021
- Motorola Mobility LLC
- Giles Davis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Capacitive Sensors Having Temperature Stable Output
- Publication number 20210163282
- Publication date Jun 3, 2021
- Sciosense B.V.
- Olaf Wunnicke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20210053819
- Publication date Feb 25, 2021
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE
- Publication number 20200245078
- Publication date Jul 30, 2020
- KNOWLES ELECTRONICS, LLC
- Tony K. Lim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYDROGEN SENSOR ON MEDIUM OR LOW TEMPERATURE SOLID MICRO HEATING PL...
- Publication number 20200239300
- Publication date Jul 30, 2020
- Shanghai Jiaotong University
- Guifu Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH OPTIMIZED GEOMETRY FOR REDUCING THE OFFSET DUE TO...
- Publication number 20200216305
- Publication date Jul 9, 2020
- STMicroelectronics S.r.l.
- Francesco RIZZINI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Silicon Carbide Microelectromechanical Structure, Device, and Method
- Publication number 20200115219
- Publication date Apr 16, 2020
- The Government of the United States of America, as represented by the Secreta...
- Francis J. Kub
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR
- Publication number 20190323912
- Publication date Oct 24, 2019
- Rosemount Aerospace Inc.
- Jun Zheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL RESONATOR WITH IMPROVED ELECTRICAL FEATURES
- Publication number 20180339898
- Publication date Nov 29, 2018
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PLANAR PROCESSING OF SUSPENDED MICROELECTROMECHANICAL SYSTEMS (MEMS...
- Publication number 20180148318
- Publication date May 31, 2018
- ANALOG DEVICES GLOBAL
- Michael John Flynn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MICRO-CHANNEL HEATSINK IN DMD SUBSTRATE FOR ENHANCED COO...
- Publication number 20180088319
- Publication date Mar 29, 2018
- Xerox Corporation.
- Christopher D. Atwood
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GLASS-SENSOR STRUCTURES
- Publication number 20180086664
- Publication date Mar 29, 2018
- VAON, LLC
- Henry Steen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERNAL TEMPERATURE MEASUREMENT DEVICE
- Publication number 20170276553
- Publication date Sep 28, 2017
- Omron Corporation
- Shinya Nakagawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR AN OVENIZED SILICON PLATFORM USING Si/SiO2 HY...
- Publication number 20170275157
- Publication date Sep 28, 2017
- Evigia Systems, Inc.
- Weibin Zhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20170225950
- Publication date Aug 10, 2017
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTIO...
- Publication number 20170174505
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Ricky Alan JACKSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL...
- Publication number 20160340174
- Publication date Nov 24, 2016
- Honeywell International Inc.
- John R. Reinke
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING
- Publication number 20160244322
- Publication date Aug 25, 2016
- CONTINENTAL AUTOMOTIVE SYSTEMS, INC.
- Xiaoyi Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stress Isolation Platform for MEMS Devices
- Publication number 20160090297
- Publication date Mar 31, 2016
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Structure with Multiple Active Layers in an SOI Wafer
- Publication number 20160043108
- Publication date Feb 11, 2016
- Silanna Semiconductor U.S.A., Inc.
- Stephen A. Fanelli
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PRESSURE SENSOR WITH THERMAL COMPENSATION
- Publication number 20160009546
- Publication date Jan 14, 2016
- Semiconductor Manufacturing International (Shanghai) Corporation
- XIANMING ZHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Protection against thermal alteration or destruction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and method for dissipating heat with microelectromechanic...

Systems and methods for operating a mems device based on sensed tem...

MEMS device with optimized geometry for reducing the offset due to...

Systems and methods for operating a MEMS device based on sensed tem...

Hydrogen sensor on medium or low temperature solid micro heating pl...

Capacitive sensors having temperature stable output

Apparatus and method for dissipating heat with microelectromechanic...

Systems and methods for operating a MEMS device based on sensed tem...

Pressure relief device for microphone protection in an electronic d...

Microphone package

High temperature capacitive MEMS pressure sensor

Planar processing of suspended microelectromechanical systems (MEMS...

Capacitive RF MEMS intended for high-power applications

Silicon carbide microelectromechanical structure, device, and method

Microphone package

Silicon carbide microelectromechanical structure, device, and method

Infrared sensor design using an epoxy film as an infrared absorptio...

Infrared sensor design using an epoxy film as an infrared absorptio...

Microelectromechanical resonator with improved electrical features

Proof mass and polysilicon electrode integrated thereon

Internal temperature measurement device

Embedded structures for high glass strength and robust packaging

Monolithic fabrication of thermally isolated microelectromechanical...

Integrated micro-channel heatsink in DMD substrate for enhanced coo...

System and method for an ovenized silicon platform using Si/SiO2 hy...

Micromechanical component and corresponding test method for a micro...

Systems and methods for nuclear event circumvention in an inertial...

MEMS device connected to a substrate by flexible support structures

Thermally shorted bolometer

Semiconductor sensing device to minimize thermal noise

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...

SENSING ELEMENT AND RELATED METHODS

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

PIEZOELECTRIC MEMS DEVICE WITH THERMAL COMPENSATION FROM ONE OR MOR...

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE

MICROELECTRONICS H-FRAME DEVICE

APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

APPARATUS AND METHOD FOR DISSIPATING HEAT WITH MICROELECTROMECHANIC...

Pressure Relief Device for Microphone Protection in an Electronic D...

Capacitive Sensors Having Temperature Stable Output

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

MICROPHONE PACKAGE

HYDROGEN SENSOR ON MEDIUM OR LOW TEMPERATURE SOLID MICRO HEATING PL...

MEMS DEVICE WITH OPTIMIZED GEOMETRY FOR REDUCING THE OFFSET DUE TO...

Silicon Carbide Microelectromechanical Structure, Device, and Method

HIGH TEMPERATURE CAPACITIVE MEMS PRESSURE SENSOR

MICROELECTROMECHANICAL RESONATOR WITH IMPROVED ELECTRICAL FEATURES

PLANAR PROCESSING OF SUSPENDED MICROELECTROMECHANICAL SYSTEMS (MEMS...

INTEGRATED MICRO-CHANNEL HEATSINK IN DMD SUBSTRATE FOR ENHANCED COO...

GLASS-SENSOR STRUCTURES

INTERNAL TEMPERATURE MEASUREMENT DEVICE

SYSTEM AND METHOD FOR AN OVENIZED SILICON PLATFORM USING Si/SiO2 HY...

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTIO...

MONOLITHIC FABRICATION OF THERMALLY ISOLATED MICROELECTROMECHANICAL...

EMBEDDED STRUCTURES FOR HIGH GLASS STRENGTH AND ROBUST PACKAGING

Stress Isolation Platform for MEMS Devices

Semiconductor Structure with Multiple Active Layers in an SOI Wafer

MEMS PRESSURE SENSOR WITH THERMAL COMPENSATION