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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, preparation method thereof, and display device
- Patent number 12,033,974
- Issue date Jul 9, 2024
- Shanghai Tianma Micro-Electronics Co,. Ltd.
- Quanpeng Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,978,715
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Tsung Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming board assembly with chemical vapor deposition di...
- Patent number 11,538,732
- Issue date Dec 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a recurrent neural network computer
- Patent number 11,489,012
- Issue date Nov 1, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Elisa Vianello
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board assembly with chemical vapor deposition diamond (CVDD) window...
- Patent number 11,189,543
- Issue date Nov 30, 2021
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,431,564
- Issue date Oct 1, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240250055
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID
- Publication number 20220278069
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsung KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20220052022
- Publication date Feb 17, 2022
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Quanpeng YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming Board Assembly with Chemical Vapor Deposition Di...
- Publication number 20220028753
- Publication date Jan 27, 2022
- Microchip Technology Caldicot Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...
- Publication number 20210035883
- Publication date Feb 4, 2021
- Microsemi Semiconductor Limited
- Philip Andrew Swire
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...
- Publication number 20190088613
- Publication date Mar 21, 2019
- TECHNETICS GROUP LLC
- Jason Wright
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20150214192
- Publication date Jul 30, 2015
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED BACKSIDE METAL GROUND PLANE FOR IMPROVED METAL ADHESION
- Publication number 20140138844
- Publication date May 22, 2014
- International Business Machines Corporation
- Jeffrey P. Gambino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS

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Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with multiple types of underfill and method forming the same

Display panel, preparation method thereof, and display device

Electronic device and display device using the same

Structure and formation method of chip package with protective lid

Method for forming board assembly with chemical vapor deposition di...

Method of producing a recurrent neural network computer

Board assembly with chemical vapor deposition diamond (CVDD) window...

Bond materials with enhanced plasma resistant characteristics and a...

Structure and formation method of chip package structure

Solder fatigue arrest for wafer level package

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

PACKAGE STRUCTURE WITH PROTECTIVE LID

Packages With Multiple Types of Underfill and Method Forming The Same

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH PROTECTIVE LID

DISPLAY PANEL, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE

Method for forming Board Assembly with Chemical Vapor Deposition Di...

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

Board Assembly with Chemical Vapor Deposition Diamond (CVDD) Window...

BOND MATERIALS WITH ENHANCED PLASMA RESISTANT CHARACTERISTICS AND A...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

PATTERNED BACKSIDE METAL GROUND PLANE FOR IMPROVED METAL ADHESION

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE