Recess in conductor

Industry

CPC
H05K2201/09745

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/09745Recess in conductor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light sensing module and display apparatus
- Patent number 11,815,391
- Issue date Nov 14, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiahua Wang
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board and semiconductor module including the same
- Patent number 11,758,652
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Dongyoon Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component
- Patent number 11,647,581
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ceramic electronic component
- Patent number 11,641,712
- Issue date May 2, 2023
- Murata Manufacturing Co., Ltd.
- Yuki Takemori
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control device for an electric machine
- Patent number 11,129,270
- Issue date Sep 21, 2021
- Robert Bosch GmbH
- Harald Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic substrate and method for producing a metal-ceramic su...
- Patent number 11,129,273
- Issue date Sep 21, 2021
- Rogers Germany GmbH
- Xinhe Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing printed wiring board and printed wiring board
- Patent number 11,109,481
- Issue date Aug 31, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid ejection apparatus
- Patent number 11,031,538
- Issue date Jun 8, 2021
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,980,134
- Issue date Apr 13, 2021
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adapter plate for HF structures
- Patent number 10,935,057
- Issue date Mar 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Jörg Langenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid ejection apparatus
- Patent number 10,727,392
- Issue date Jul 28, 2020
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Accurate positioning and alignment of a component during processes...
- Patent number 10,667,387
- Issue date May 26, 2020
- ams Sensors Singapore Pte. Ltd.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete component carrier
- Patent number 10,667,399
- Issue date May 26, 2020
- Nokia Solutions and Networks Oy
- Alex Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,531,559
- Issue date Jan 7, 2020
- Kabushiki Kaisha Toshiba
- Akira Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for pressing pre-tin shaping
- Patent number 10,512,172
- Issue date Dec 17, 2019
- Tyco Electronics (Dongguan) Co., Ltd.
- Hongzhou Shen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 10,481,709
- Issue date Nov 19, 2019
- Jui-Jen Yueh
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laminated body
- Patent number 10,477,671
- Issue date Nov 12, 2019
- Sekisui Chemical Co., Ltd.
- Hiroshi Maenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 10,462,894
- Issue date Oct 29, 2019
- Force10 Networks, Inc.
- Joel R. Goergen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and semiconductor package including the same
- Patent number 10,448,508
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Soo-jae Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sleeved coaxial printed circuit board vias
- Patent number 10,375,838
- Issue date Aug 6, 2019
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-surface edge pads for vertical mount packages and methods of...
- Patent number 10,354,945
- Issue date Jul 16, 2019
- Invensas Corporation
- Rajesh Katkar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy free electronic (safe) rigid-flexible/stretchable circ...
- Patent number 10,285,270
- Issue date May 7, 2019
- Joseph Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 10,276,522
- Issue date Apr 30, 2019
- Delta Electronics, Inc.
- Tao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,278,292
- Issue date Apr 30, 2019
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connection substrate
- Patent number 10,278,286
- Issue date Apr 30, 2019
- NGK Insulators, Ltd.
- Akiyoshi Ide
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Liquid ejection apparatus
- Patent number 10,236,434
- Issue date Mar 19, 2019
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...
- Publication number 20240268033
- Publication date Aug 8, 2024
- ROBERT BOSCH GmbH
- Florian Eichkorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE
- Publication number 20240188215
- Publication date Jun 6, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Sensing Module and Display Apparatus
- Publication number 20220291038
- Publication date Sep 15, 2022
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jiahua WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME
- Publication number 20220159832
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Dongyoon SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE
- Publication number 20210386376
- Publication date Dec 16, 2021
- Koninklijke Philips N.V.
- Johannes Wilhelmus WEEKAMP
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20210185830
- Publication date Jun 17, 2021
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Control Device for an Electric Machine
- Publication number 20210168927
- Publication date Jun 3, 2021
- ROBERT BOSCH GmbH
- Harald Hundt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20200321510
- Publication date Oct 8, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE COMPONENT CARRIER
- Publication number 20200170116
- Publication date May 28, 2020
- Nokia Solutions and Networks Oy
- Alex CHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20190230795
- Publication date Jul 25, 2019
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20190157541
- Publication date May 23, 2019
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION APPARATUS
- Publication number 20180342664
- Publication date Nov 29, 2018
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Kakiuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED BODY
- Publication number 20180302976
- Publication date Oct 18, 2018
- Sekisui Chemical Co., Ltd.
- Hiroshi Maenaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...
- Publication number 20180235080
- Publication date Aug 16, 2018
- HEPTAGON MICRO OPTICS PTE. LTD.
- Peter Riel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENT HAVING PRE-SOLDERED SURFACE WITH FLUX RESERVOIRS
- Publication number 20180161905
- Publication date Jun 14, 2018
- Antaya Technologies Corporation
- Alexandra Mary Mackin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC D...
- Publication number 20170150605
- Publication date May 25, 2017
- SONY CORPORATION
- Takashi NAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS
- Publication number 20160128207
- Publication date May 5, 2016
- Intel Corporation
- MD Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20140369014
- Publication date Dec 18, 2014
- YAZAKI CORPORATION
- Yusuke Takagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140339699
- Publication date Nov 20, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140291701
- Publication date Oct 2, 2014
- MITSUBISHI ELECTRIC CORPORATION
- Yukimasa Hayashida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION
- Publication number 20140262458
- Publication date Sep 18, 2014
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT CONNECTION STRUCTURE
- Publication number 20140240940
- Publication date Aug 28, 2014
- KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO
- Hajime ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140215782
- Publication date Aug 7, 2014
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM PRINTED CIRCUIT BOARD FOR LIGHTING AND DISPLAY BACKPLANES
- Publication number 20140218943
- Publication date Aug 7, 2014
- CRYSTALPLEX CORPORATION
- William R. Freeman
- F21 - LIGHTING
Information Patent Application
Heat Sink Package
- Publication number 20140217572
- Publication date Aug 7, 2014
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE MODULE WITH HEAT-CONDUCTING POLES
- Publication number 20140168979
- Publication date Jun 19, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- F21 - LIGHTING
Information Patent Application
Discrete-Pin Printed-Circuit Mounting with Notches
- Publication number 20140160681
- Publication date Jun 12, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20140139310
- Publication date May 22, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE ELECTRONIC DEVICE
- Publication number 20140117565
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Henrik Ewe
- H01 - BASIC ELECTRIC ELEMENTS

Recess in conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multilayer wiring board and method of producing the same

Light sensing module and display apparatus

Printed circuit board and semiconductor module including the same

Ceramic electronic component

Ceramic electronic component

Method for orienting solder balls on a BGA device

Control device for an electric machine

Metal-ceramic substrate and method for producing a metal-ceramic su...

Method for manufacturing printed wiring board and printed wiring board

Liquid ejection apparatus

Method for orienting solder balls on a BGA device

Adapter plate for HF structures

Resin multilayer substrate and method of manufacturing the same

Liquid ejection apparatus

Accurate positioning and alignment of a component during processes...

Discrete component carrier

Electronic device

System for pressing pre-tin shaping

Electronic device

Laminated body

Circuit board

Printed circuit board and semiconductor package including the same

Fiducial mark for chip bonding

Sleeved coaxial printed circuit board vias

Multi-surface edge pads for vertical mount packages and methods of...

Solder alloy free electronic (safe) rigid-flexible/stretchable circ...

Power module

Method for orienting solder balls on a BGA device

Connection substrate

Liquid ejection apparatus

Patents Applicationslast 30 patents

FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTR...

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

Light Sensing Module and Display Apparatus

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MODULE INCLUDING THE SAME

ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

Control Device for an Electric Machine

LIQUID EJECTION APPARATUS

DISCRETE COMPONENT CARRIER

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

LIQUID EJECTION APPARATUS

LIQUID EJECTION APPARATUS

LAMINATED BODY

ACCURATE POSITIONING AND ALIGNMENT OF A COMPONENT DURING PROCESSES...

ELECTRICAL COMPONENT HAVING PRE-SOLDERED SURFACE WITH FLUX RESERVOIRS

CIRCUIT BOARD, POWER STORAGE DEVICE, BATTERY PACK, AND ELECTRONIC D...

BGA STRUCTURE USING CTF BALLS IN HIGH STRESS REGIONS

WIRING BOARD

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

SEMICONDUCTOR DEVICE

UNDER BALL METALLURGY (UBM) FOR IMPROVED ELECTROMIGRATION

ELECTRONIC COMPONENT CONNECTION STRUCTURE

MULTILAYER WIRING SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

ALUMINUM PRINTED CIRCUIT BOARD FOR LIGHTING AND DISPLAY BACKPLANES

Heat Sink Package

LIGHT EMITTING DIODE MODULE WITH HEAT-CONDUCTING POLES

Discrete-Pin Printed-Circuit Mounting with Notches

WIRING BOARD

LAMINATE ELECTRONIC DEVICE