Reinforcing a cap

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CPC
B81C2203/0163

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C2203/00Forming micro-structural systems

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B81C2203/0163Reinforcing a cap

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a plurality of sensor devices, and sensor device
- Patent number 12,195,330
- Issue date Jan 14, 2025
- Robert Bosch GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed, toughened glass package and method for produci...
- Patent number 11,993,511
- Issue date May 28, 2024
- Schott AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Covering for a component and method for producing a covering for a...
- Patent number 11,180,364
- Issue date Nov 23, 2021
- Snaptrack, Inc.
- Ansgar Schäufele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic component and module including the same
- Patent number 11,139,795
- Issue date Oct 5, 2021
- Murata Manufacturing Co., Ltd.
- Koichiro Kawasaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device package including a wall and a grounding ring...
- Patent number 10,689,249
- Issue date Jun 23, 2020
- Advanced Semiconductor Engineering, Inc.
- Ching-Han Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device including a cavity lid
- Patent number 10,626,012
- Issue date Apr 21, 2020
- Infineon Technologies AG
- Franz-Xaver Muehlbauer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Corrugated package for microelectromechanical system (MEMS) device
- Patent number 10,442,683
- Issue date Oct 15, 2019
- Akustica, Inc.
- Kuldeep Saxena
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Getter device for a micromechanical component
- Patent number 10,035,698
- Issue date Jul 31, 2018
- Robert Bosch GmbH
- Nicole Schittenhelm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Encapsulation structure including a mechanically reinforced cap and...
- Patent number 9,511,991
- Issue date Dec 6, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Xavier Baillin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device
- Patent number 9,434,607
- Issue date Sep 6, 2016
- Seiko Epson Corporation
- Takahiko Yoshizawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal mesh lid MEMS package and method
- Patent number 9,162,871
- Issue date Oct 20, 2015
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device with an interlocking mold package
- Patent number 9,159,637
- Issue date Oct 13, 2015
- Robert Bosch GmbH
- Ando Lars Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device, method of manufacturing the same, and oscillator
- Patent number 9,089,055
- Issue date Jul 21, 2015
- Seiko Epson Corporation
- Yoji Kitano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin film wafer level package
- Patent number 8,592,998
- Issue date Nov 26, 2013
- IMEC
- Gert Claes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Functional device with functional structure of a microelectromechan...
- Patent number 8,592,925
- Issue date Nov 26, 2013
- Seiko Epson Corporation
- Shogo Inaba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Metal mesh lid MEMS package and method
- Patent number 8,536,663
- Issue date Sep 17, 2013
- Amkor Technology, Inc.
- Bob Shih-Wei Kuo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for encapsulating a microcomponent using a mechanically rein...
- Patent number 8,338,282
- Issue date Dec 25, 2012
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Jean-Louis Pornin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS package having formed metal lid
- Patent number 8,309,388
- Issue date Nov 13, 2012
- Texas Instruments Incorporated
- Kurt P. Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microcomponent provided with a cavity delimited by a cap with enhan...
- Patent number 8,183,474
- Issue date May 22, 2012
- Commissariat a l'Energie Atomique
- Charlotte Gillot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming a capped micro-electro-mechanical system (MEMS)...
- Patent number 8,039,312
- Issue date Oct 18, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Veera M. Gunturu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for display device with reinforcing substance
- Patent number 7,990,601
- Issue date Aug 2, 2011
- QUALCOMM MEMS Technologies, Inc.
- Lauren Palmateer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for display device with reinforcing substance
- Patent number 7,710,629
- Issue date May 4, 2010
- QUALCOMM MEMS Technologies, Inc.
- Lauren Palmateer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for reducing back-glass deflection in an inter...
- Patent number 7,561,334
- Issue date Jul 14, 2009
- QUALCOMM MEMS Technologies, Inc.
- Qi Luo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for protecting microelectromechanical systems arr...
- Patent number 7,405,924
- Issue date Jul 29, 2008
- IDC, LLC
- Brian Gally
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for protecting microelectromechanical systems arr...
- Patent number 7,368,803
- Issue date May 6, 2008
- IDC, LLC
- Brian Gally
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated lid formed on MEMS device
- Patent number 7,098,065
- Issue date Aug 29, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical cap structure and the respective manufacturing method
- Patent number 6,462,392
- Issue date Oct 8, 2002
- Robert Bosch GmbH
- Stefan Pinter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor component
- Patent number 6,186,008
- Issue date Feb 13, 2001
- Siemens Aktiengesellschaft
- Thies Janczek
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
HERMETICALLY SEALED, TOUGHENED GLASS PACKAGE AND METHOD FOR PRODUCI...
- Publication number 20220135398
- Publication date May 5, 2022
- SCHOTT AG
- Jens Ulrich Thomas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE
- Publication number 20220041436
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Daniel Haug
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC COMPONENT AND MODULE INCLUDING THE SAME
- Publication number 20200052676
- Publication date Feb 13, 2020
- Murata Manufacturing Co., Ltd.
- Koichiro KAWASAKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER DEVICE FOR A MICROMECHANICAL COMPONENT
- Publication number 20170183220
- Publication date Jun 29, 2017
- ROBERT BOSCH GmbH
- Nicole Schittenhelm
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS
- Publication number 20160176706
- Publication date Jun 23, 2016
- WESTERN DIGITAL (FREMONT), LLC
- Pezhman Monadgemi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE WITH AN INTERLOCKING MOLD PACKAGE
- Publication number 20140264955
- Publication date Sep 18, 2014
- ROBERT BOSCH GmbH
- Ando Lars Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140231934
- Publication date Aug 21, 2014
- Tomohiro SAITO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND OSCILLATOR
- Publication number 20140070900
- Publication date Mar 13, 2014
- SEIKO EPSON CORPORATION
- Yoji Kitano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL THIN SHIELD ON ELECTRICAL DEVICE
- Publication number 20130032385
- Publication date Feb 7, 2013
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Peng Cheng Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120012950
- Publication date Jan 19, 2012
- SEIKO EPSON CORPORATION
- Shogo Inaba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR ENCAPSULATING A MICROCOMPONENT USING A MECHANICALLY REIN...
- Publication number 20110189844
- Publication date Aug 4, 2011
- COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE. ALT.
- Jean-Louis PORNIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Thin Film Wafer Level Package
- Publication number 20110180943
- Publication date Jul 28, 2011
- IMEC
- Gert Claes
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEM AND METHOD FOR DISPLAY DEVICE WITH REINFORCING SUBSTANCE
- Publication number 20100172013
- Publication date Jul 8, 2010
- QUALCOMM MEMS TECHNOLOGIES, INC.
- Lauren Palmateer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Package Having Formed Metal Lid
- Publication number 20090267223
- Publication date Oct 29, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Kurt P. WACHTLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microcomponent Provided with a Cavity Delimited by a Cap with Enhan...
- Publication number 20090194309
- Publication date Aug 6, 2009
- COMMISSARIAT A LE-ENERGIE ATOMIQUE
- Charlotte Gillot
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090179287
- Publication date Jul 16, 2009
- SEIKO EPSON CORPORATION
- Shogo Inaba
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE
- Publication number 20080036053
- Publication date Feb 14, 2008
- Wan-Hua Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method and apparatus for reducing back-glass deflection in an inter...
- Publication number 20070139655
- Publication date Jun 21, 2007
- Qi Luo
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and method for protecting microelectromechanical systems arr...
- Publication number 20060076648
- Publication date Apr 13, 2006
- Brian Gally
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and method for display device with reinforcing substance
- Publication number 20060066600
- Publication date Mar 30, 2006
- Lauren Palmateer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED LID FORMED ON MEMS DEVICE
- Publication number 20060065961
- Publication date Mar 30, 2006
- STMicroelectronics, Inc.
- Anthony M. Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
System and method for protecting microelectromechanical systems arr...
- Publication number 20060065436
- Publication date Mar 30, 2006
- Brian Gally
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Reinforcing a cap

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a plurality of sensor devices, and sensor device

Hermetically sealed, toughened glass package and method for produci...

Covering for a component and method for producing a covering for a...

Electronic component and module including the same

Semiconductor device package including a wall and a grounding ring...

Semiconductor device including a cavity lid

Corrugated package for microelectromechanical system (MEMS) device

Getter device for a micromechanical component

Encapsulation structure including a mechanically reinforced cap and...

MEMS device

Metal mesh lid MEMS package and method

Electronic device with an interlocking mold package

Electronic device, method of manufacturing the same, and oscillator

Thin film wafer level package

Functional device with functional structure of a microelectromechan...

Metal mesh lid MEMS package and method

Method for encapsulating a microcomponent using a mechanically rein...

MEMS package having formed metal lid

Microcomponent provided with a cavity delimited by a cap with enhan...

Method for forming a capped micro-electro-mechanical system (MEMS)...

System and method for display device with reinforcing substance

System and method for display device with reinforcing substance

Method and apparatus for reducing back-glass deflection in an inter...

System and method for protecting microelectromechanical systems arr...

System and method for protecting microelectromechanical systems arr...

Integrated lid formed on MEMS device

Micromechanical cap structure and the respective manufacturing method

Semiconductor sensor component

Patents Applicationslast 30 patents

HERMETICALLY SEALED, TOUGHENED GLASS PACKAGE AND METHOD FOR PRODUCI...

METHOD FOR PRODUCING A PLURALITY OF SENSOR DEVICES, AND SENSOR DEVICE

ELECTRONIC COMPONENT AND MODULE INCLUDING THE SAME

GETTER DEVICE FOR A MICROMECHANICAL COMPONENT

SYSTEMS AND METHODS FOR FORMING MEMS ASSEMBLIES INCORPORATING GETTERS

ELECTRONIC DEVICE WITH AN INTERLOCKING MOLD PACKAGE

ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE, METHOD OF MANUFACTURING THE SAME, AND OSCILLATOR

METAL THIN SHIELD ON ELECTRICAL DEVICE

FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR ENCAPSULATING A MICROCOMPONENT USING A MECHANICALLY REIN...

Thin Film Wafer Level Package

SYSTEM AND METHOD FOR DISPLAY DEVICE WITH REINFORCING SUBSTANCE

MEMS Package Having Formed Metal Lid

Microcomponent Provided with a Cavity Delimited by a Cap with Enhan...

FUNCTIONAL DEVICE AND MANUFACTURING METHOD THEREOF

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Method and apparatus for reducing back-glass deflection in an inter...

System and method for protecting microelectromechanical systems arr...

System and method for display device with reinforcing substance

INTEGRATED LID FORMED ON MEMS DEVICE

System and method for protecting microelectromechanical systems arr...