relative to the bonding areas

Industry

CPC
H01L2224/30104

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/30104relative to the bonding areas

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,804,464
- Issue date Oct 31, 2023
- Kioxia Corporation
- Keiichi Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 10,366,962
- Issue date Jul 30, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multichip stacking package structure and method for manufacturing t...
- Patent number 9,412,722
- Issue date Aug 9, 2016
- DAWNING LEADING TECHNOLOGY INC.
- Diann-Fang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 7,126,212
- Issue date Oct 24, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 6,984,571
- Issue date Jan 10, 2006
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated device
- Patent number 6,905,557
- Issue date Jun 14, 2005
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220005779
- Publication date Jan 6, 2022
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP STACKING PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING T...
- Publication number 20160240512
- Publication date Aug 18, 2016
- Dawning Leading Technology Inc.
- Diann-Fang LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20150287692
- Publication date Oct 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080093747
- Publication date Apr 24, 2008
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20080061418
- Publication date Mar 13, 2008
- Ziptronix
- Paul Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20060292744
- Publication date Dec 28, 2006
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device integration method and integrated device
- Publication number 20020173120
- Publication date Nov 21, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensional device intergration method and intergrated device
- Publication number 20020094661
- Publication date Jul 18, 2002
- Ziptronix
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS

relative to the bonding areas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and manufacturing method thereof

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Multichip stacking package structure and method for manufacturing t...

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional integrated device

Patents Applicationslast 30 patents

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MULTICHIP STACKING PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING T...

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Three dimensional device intergration method and intergrated device