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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/75317Removable auxiliary member

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 12,080,678
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for releasing ultra-small or ultra-thin discrete components...
- Patent number 11,728,201
- Issue date Aug 15, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,962
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 11,410,963
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 11,400,514
- Issue date Aug 2, 2022
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,189,594
- Issue date Nov 30, 2021
- Shinkawa Ltd.
- Osamu Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Setting up ultra-small or ultra-thin discrete components for easy a...
- Patent number 10,937,680
- Issue date Mar 2, 2021
- Uniqarta, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,210
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,840,209
- Issue date Nov 17, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering tool and method for sintering an electronic subassembly
- Patent number 10,814,396
- Issue date Oct 27, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices f...
- Patent number 10,636,770
- Issue date Apr 28, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for transfer of semiconductor devices
- Patent number 10,622,337
- Issue date Apr 14, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,615,153
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Semiconductor device on glass substrate
- Patent number 10,615,152
- Issue date Apr 7, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,566,319
- Issue date Feb 18, 2020
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Grant
Apparatus and method for direct transfer of semiconductor devices
- Patent number 10,490,532
- Issue date Nov 26, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Sintering device
- Patent number 10,483,229
- Issue date Nov 19, 2019
- Danfoss Silicon Power GmbH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Apparatus for multi-direct transfer of semiconductors
- Patent number 10,373,937
- Issue date Aug 6, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Substrate with array of LEDs for backlighting a display device
- Patent number 10,361,176
- Issue date Jul 23, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device on string circuit and method of making the same
- Patent number 10,325,885
- Issue date Jun 18, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Method and apparatus for improved direct transfer of semiconductor die
- Patent number 10,290,615
- Issue date May 14, 2019
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device, heat insulating load...
- Patent number 10,020,282
- Issue date Jul 10, 2018
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor substrates with metal contact layer and method...
- Patent number 9,768,036
- Issue date Sep 19, 2017
- Semikron Elektronik GmbH & Co., KG
- Christian Göbl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20230377936
- Publication date Nov 23, 2023
- Kulicke and Soffa Industries, Inc.
- Val Marinov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230197669
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210091037
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20210074671
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20210016353
- Publication date Jan 21, 2021
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- B22 - CASTING POWDER METALLURGY
Information Patent Application
APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...
- Publication number 20200251453
- Publication date Aug 6, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20200243491
- Publication date Jul 30, 2020
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE
- Publication number 20200235081
- Publication date Jul 23, 2020
- Rohinni, LLC
- Andrew Huska
- G02 - OPTICS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212000
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200211999
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Direct Transfer of Semiconductor Devices
- Publication number 20200168587
- Publication date May 28, 2020
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...
- Publication number 20200135534
- Publication date Apr 30, 2020
- UNIQARTA, INC.
- Val Marinov
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200098721
- Publication date Mar 26, 2020
- SHINKAWA LTD.
- Osamu WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE
- Publication number 20190348405
- Publication date Nov 14, 2019
- Rohinni, LLC
- Cody Peterson
- G02 - OPTICS
Information Patent Application
METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE
- Publication number 20190237445
- Publication date Aug 1, 2019
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR LIGHT DIFFUSION
- Publication number 20190139945
- Publication date May 9, 2019
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINTERING DEVICE
- Publication number 20170229418
- Publication date Aug 10, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY
- Publication number 20170216920
- Publication date Aug 3, 2017
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20140248477
- Publication date Sep 4, 2014
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE
- Publication number 20140226297
- Publication date Aug 14, 2014
- DEXERIALS CORPORATION
- Ryoji Kojima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thin Semiconductor Chip Mounting
- Publication number 20140069989
- Publication date Mar 13, 2014
- Mutsumi Masumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonder And Bonding Method
- Publication number 20140069564
- Publication date Mar 13, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Ryuichi TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD
- Publication number 20140033518
- Publication date Feb 6, 2014
- MIKADO TECHNOS CO., LTD.
- Takashi Ito
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20130255878
- Publication date Oct 3, 2013
- Fujitsu Limited
- Tetsuya TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Composite and a Power Semiconductor Module
- Publication number 20130203218
- Publication date Aug 8, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FORMING LAMINATE AND LAMINATING DEVICE
- Publication number 20130126074
- Publication date May 23, 2013
- Kabushiki Kaisha Meiki Seisakusho
- Tomoaki HIROSE
- B32 - LAYERED PRODUCTS
Information Patent Application
BUFFER FILM FOR MULTI-CHIP PACKAGING
- Publication number 20130092310
- Publication date Apr 18, 2013
- DEXERIALS CORPORATION
- Akira Ishigami
- B32 - LAYERED PRODUCTS
Information Patent Application
Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...
- Publication number 20130040424
- Publication date Feb 14, 2013
- INFINEON TECHNOLOGIES AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS

Removable auxiliary member

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and systems for manufacturing semiconductor devices

Methods for releasing ultra-small or ultra-thin discrete components...

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Method for transfer of semiconductor devices onto glass substrates

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Sintering tool and method for sintering an electronic subassembly

Bonding apparatus and bonding method

Method for improved transfer of semiconductor die

Setting up ultra-small or ultra-thin discrete components for easy a...

Apparatus for direct transfer of semiconductor device die

Methods and systems for manufacturing semiconductor devices

Methods and systems for manufacturing semiconductor devices

Sintering tool and method for sintering an electronic subassembly

Apparatus and method for direct transfer of semiconductor devices f...

Method and apparatus for transfer of semiconductor devices

Apparatus for direct transfer of semiconductor device die

Semiconductor device on glass substrate

Apparatus for direct transfer of semiconductor device die

Apparatus and method for direct transfer of semiconductor devices

Sintering device

Apparatus for multi-direct transfer of semiconductors

Substrate with array of LEDs for backlighting a display device

Semiconductor device on string circuit and method of making the same

Method and apparatus for improved direct transfer of semiconductor die

Solder bump stretching method

Method for manufacturing semiconductor device, heat insulating load...

Solder bump stretching method and device for performing the same

Power semiconductor substrates with metal contact layer and method...

Patents Applicationslast 30 patents

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

APPARATUS AND METHOD FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES F...

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

SEMICONDUCTOR DEVICE ON GLASS SUBSTRATE

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Apparatus and Method for Direct Transfer of Semiconductor Devices

Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy A...

BONDING APPARATUS AND BONDING METHOD

APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE

METHOD FOR IMPROVED TRANSFER OF SEMICONDUCTOR DIE

METHOD AND APPARATUS FOR LIGHT DIFFUSION

SOLDER BUMP STRETCHING METHOD

SINTERING DEVICE

SINTERING TOOL AND METHOD FOR SINTERING AN ELECTRONIC SUBASSEMBLY

ELECTRONIC COMPONENT BONDING METHOD

BUFFER FILM FOR MULTI-CHIP PACKAGING

METHOD OF MANUFACTURING CONNECTION STRUCTURE

Thin Semiconductor Chip Mounting

Die Bonder And Bonding Method

VACUUM THERMAL BONDING APPARATUS AND VACUUM THERMAL BONDING METHOD

PRINTED CIRCUIT BOARD MANUFACTURING METHOD

Method for Producing a Composite and a Power Semiconductor Module

METHOD FOR FORMING LAMINATE AND LAMINATING DEVICE

BUFFER FILM FOR MULTI-CHIP PACKAGING

Fixing Semiconductor Die in Dry and Pressure Supported Assembly Pro...