Removal of gases or vapours ; gas or pressure control

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CPC
C25D21/04

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CCHEMISTRY METALLURGY C25Electrolytic processing C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS ELECTROFORMING APPARATUS THEREFOR C25D21/00Processes for servicing or operating cells for electrolytic coating

Current Industry

C25D21/04Removal of gases or vapours ; gas or pressure control

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 12,227,867
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte
- Patent number 12,157,952
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and air bubble removing method of plating apparatus
- Patent number 12,152,312
- Issue date Nov 26, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical treatment system
- Patent number 12,139,809
- Issue date Nov 12, 2024
- Corrdesa, LLC
- Alan Rose
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gas-solid separation structure, feeding device and electrochemical...
- Patent number 12,121,873
- Issue date Oct 22, 2024
- BOE Technology Group Co., Ltd.
- Shaodong Sun
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Air bubble removing method of plating apparatus and plating apparatus
- Patent number 12,077,875
- Issue date Sep 3, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing apparatus for supplying gas of water repellent...
- Patent number 12,042,815
- Issue date Jul 23, 2024
- Tokyo Electron Limited
- Kotaro Tsurusaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and air bubble removing method
- Patent number 11,993,861
- Issue date May 28, 2024
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating method and electroplating apparatus
- Patent number 11,959,186
- Issue date Apr 16, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ting Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and system for production of antimicrobial disinfectant coat...
- Patent number 11,939,683
- Issue date Mar 26, 2024
- Prerna Goradia
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,908,698
- Issue date Feb 20, 2024
- SEMSYSCO GMBH
- Franz Markut
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Removing bubbles from plating cells
- Patent number 11,746,435
- Issue date Sep 5, 2023
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for the galvanic application of a surface coating
- Patent number 11,732,373
- Issue date Aug 22, 2023
- TOPOCROM SYSTEMS AG
- Karl Müll
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus for plating semiconductor wafer and plating method
- Patent number 11,585,008
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma electrolytic oxidation apparatus and method of plasma electr...
- Patent number 11,555,253
- Issue date Jan 17, 2023
- Korea Institute of Science and Technology
- Hun-su Lee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems and methods for enclosed electroplating chambers
- Patent number 11,542,626
- Issue date Jan 3, 2023
- Honeywell International Inc.
- James Piascik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, air bubble removing method, and storage medium t...
- Patent number 11,542,623
- Issue date Jan 3, 2023
- Ebara Corporation
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods
- Patent number 11,542,617
- Issue date Jan 3, 2023
- Hamilton Sundstrand Corporation
- Lei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic processing jig and electrolytic processing method
- Patent number 11,427,920
- Issue date Aug 30, 2022
- Tokyo Electron Limited
- Tomohisa Hoshino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of controlling chemical concentration in electrolyte and sem...
- Patent number 11,280,021
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Adaptive apparatus for release of trapped gas bubbles and enhanced...
- Patent number 11,274,378
- Issue date Mar 15, 2022
- Engineering and Software System Solutions, Inc.
- Kelly V. Smith
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Removing bubbles from plating cell
- Patent number 11,214,887
- Issue date Jan 4, 2022
- Lam Research Corporation
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Facility and method for localized surface treatment for industrial...
- Patent number 11,168,409
- Issue date Nov 9, 2021
- Cockerill Maintenance & Ingenierie S.A.
- Luc Vanhee
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,164,748
- Issue date Nov 2, 2021
- Semsyso GMBH
- Franz Markut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and device for the galvanic application of a surface coating
- Patent number 11,136,685
- Issue date Oct 5, 2021
- TOPOCROM SYSTEMS AG
- Karl Müll
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Systems, methods, and anodes for enhanced ionic liquid bath plating...
- Patent number 11,118,281
- Issue date Sep 14, 2021
- HONEYWELL INETRNATIONAL INC.
- James Piascik
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Leak checking method, leak checking apparatus, electroplating metho...
- Patent number 10,982,347
- Issue date Apr 20, 2021
- Ebara Corporation
- Shoichiro Ogata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating systems and methods
- Patent number 10,954,600
- Issue date Mar 23, 2021
- Hamilton Sundstrand Corporation
- Lei Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for electroplating nickel using sulfur-free...
- Patent number 10,954,604
- Issue date Mar 23, 2021
- Lam Research Corporation
- Bryan L Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical method and apparatus for forming a vacuum in a seal...
- Patent number 10,883,187
- Issue date Jan 5, 2021
- ATMOSPHERIX LLC
- Daniel A. Scherson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING DEVICE
- Publication number 20250051954
- Publication date Feb 13, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD
- Publication number 20240392463
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jun-Nan Nian
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
PLATING APPARATUS
- Publication number 20240318346
- Publication date Sep 26, 2024
- EBARA CORPORATION
- Shinji OMATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION
- Publication number 20240301583
- Publication date Sep 12, 2024
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jinyang ZHAO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING PROCESS METHOD
- Publication number 20240209540
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Yasuyuki Masuda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20240209542
- Publication date Jun 27, 2024
- EBARA CORPORATION
- Kazuhito TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS
- Publication number 20240200223
- Publication date Jun 20, 2024
- LAM RESEARCH CORPORATION
- Gregory J. Kearns
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Coating a Component in a Dipping Bath
- Publication number 20240183055
- Publication date Jun 6, 2024
- Bayerische Motoren Werke Aktiengesellschaft
- Elmar STEGMAYER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20240175165
- Publication date May 30, 2024
- EBARA CORPORATION
- Masaki Tomita
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS
- Publication number 20240141543
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Paolo CREMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
OPTIMIZED METHOD AND DEVICE FOR INSOLUBLE ANODE ACID SULFATE COPPER...
- Publication number 20240060202
- Publication date Feb 22, 2024
- Tao YE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESS KIT DE-BUBBLING
- Publication number 20230407514
- Publication date Dec 21, 2023
- LAM RESEARCH CORPORATION
- James Isaac Fortner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313405
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...
- Publication number 20230313406
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Paul R. McHugh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS
- Publication number 20230295829
- Publication date Sep 21, 2023
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230265578
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS
- Publication number 20230167574
- Publication date Jun 1, 2023
- EBARA CORPORATION
- Ryosuke Hiwatashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD
- Publication number 20230151508
- Publication date May 18, 2023
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20230142163
- Publication date May 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...
- Publication number 20230095518
- Publication date Mar 30, 2023
- Semsysco GmbH
- Aljbert LJATIFI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...
- Publication number 20230056444
- Publication date Feb 23, 2023
- Semsysco GmbH
- Andreas GLEISSNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL TREATMENT SYSTEM
- Publication number 20220220628
- Publication date Jul 14, 2022
- Corrdesa, LLC
- Alan Rose
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD
- Publication number 20220205126
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
REMOVING BUBBLES FROM PLATING CELLS
- Publication number 20220119977
- Publication date Apr 21, 2022
- LAM RESEARCH CORPORATION
- Stephen J. Banik
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ENCLOSED ELECTROPLATING CHAMBERS
- Publication number 20220112621
- Publication date Apr 14, 2022
- HONEYWELL INTERNATIONAL INC.
- James PIASCIK
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS AND PLATING APPARATUS
- Publication number 20220106701
- Publication date Apr 7, 2022
- EBARA CORPORATION
- Kazuhito Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GAS-SOLID SEPARATION STRUCTURE, FEEDING DEVICE AND ELECTROCHEMICAL...
- Publication number 20220097010
- Publication date Mar 31, 2022
- BOE TECHNOLOGY GROUP CO., LTD.
- Shaodong SUN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...
- Publication number 20220084813
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Makoto IYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA ELECTROLYTIC OXIDATION APPARATUS AND METHOD OF PLASMA ELECTR...
- Publication number 20220056608
- Publication date Feb 24, 2022
- Korea Institute of Science and Technology
- Hun-su LEE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE
- Publication number 20220020591
- Publication date Jan 20, 2022
- Semsysco GmbH
- Franz Markut
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Removal of gases or vapours ; gas or pressure control

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plating apparatus for plating semiconductor wafer and plating method

Method of controlling chemical concentration in electrolyte

Plating apparatus and air bubble removing method of plating apparatus

Electrochemical treatment system

Gas-solid separation structure, feeding device and electrochemical...

Air bubble removing method of plating apparatus and plating apparatus

Substrate processing apparatus for supplying gas of water repellent...

Plating apparatus and air bubble removing method

Electroplating method and electroplating apparatus

Method and system for production of antimicrobial disinfectant coat...

Method and device for plating a recess in a substrate

Removing bubbles from plating cells

Method and device for the galvanic application of a surface coating

Plating apparatus for plating semiconductor wafer and plating method

Plasma electrolytic oxidation apparatus and method of plasma electr...

Systems and methods for enclosed electroplating chambers

Plating apparatus, air bubble removing method, and storage medium t...

Electroplating systems and methods

Electrolytic processing jig and electrolytic processing method

Method of controlling chemical concentration in electrolyte and sem...

Adaptive apparatus for release of trapped gas bubbles and enhanced...

Removing bubbles from plating cell

Facility and method for localized surface treatment for industrial...

Method and device for plating a recess in a substrate

Method and device for the galvanic application of a surface coating

Systems, methods, and anodes for enhanced ionic liquid bath plating...

Leak checking method, leak checking apparatus, electroplating metho...

Electroplating systems and methods

Methods and apparatuses for electroplating nickel using sulfur-free...

Electrochemical method and apparatus for forming a vacuum in a seal...

Patents Applicationslast 30 patents

ELECTROPLATING DEVICE

SEMICONDUCTOR ELECTROCHEMICAL PLATING APPARATUS AND METHOD

PLATING APPARATUS

ELECTRODEPOSITION APPARATUS AND METHOD FOR ELECTRODEPOSITION

PLATING PROCESS METHOD

PLATING METHOD AND PLATING APPARATUS

CONTROL OF DISSOLVED GAS CONCENTRATION IN ELECTROPLATING BATHS

Method for Coating a Component in a Dipping Bath

PLATING APPARATUS

METHOD OF PROCESSING ARTICLES AND CORRESPONDING APPARATUS

OPTIMIZED METHOD AND DEVICE FOR INSOLUBLE ANODE ACID SULFATE COPPER...

PROCESS KIT DE-BUBBLING

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

ELECTROPLATING SYSTEMS AND METHODS WITH INCREASED METAL ION CONCENT...

PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

PLATING APPARATUS

PLATING APPARATUS AND AIR BUBBLE REMOVING METHOD

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SU...

ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTI...

ELECTROCHEMICAL TREATMENT SYSTEM

PLATING APPARATUS FOR PLATING SEMICONDUCTOR WAFER AND PLATING METHOD

REMOVING BUBBLES FROM PLATING CELLS

SYSTEMS AND METHODS FOR ENCLOSED ELECTROPLATING CHAMBERS

AIR BUBBLE REMOVING METHOD OF PLATING APPARATUS AND PLATING APPARATUS

GAS-SOLID SEPARATION STRUCTURE, FEEDING DEVICE AND ELECTROCHEMICAL...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...

PLASMA ELECTROLYTIC OXIDATION APPARATUS AND METHOD OF PLASMA ELECTR...

METHOD AND DEVICE FOR PLATING A RECESS IN A SUBSTRATE