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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/8203
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Patents Grants
last 30 patents
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
12,218,098
Issue date
Feb 4, 2025
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack with cascade and vertical connections
Patent number
12,068,283
Issue date
Aug 20, 2024
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for interconnecting stacked semiconductor devices
Patent number
12,033,983
Issue date
Jul 9, 2024
Intel Corporation
Junfeng Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of embedding low-k materials in antennas
Patent number
11,984,668
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Monsen Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked integrated circuits with redistribution lines
Patent number
11,923,338
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnect structure for stacked device
Patent number
11,915,977
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,841,531
Issue date
Dec 12, 2023
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,842,970
Issue date
Dec 12, 2023
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3DIC interconnect apparatus and method
Patent number
11,798,916
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,792,941
Issue date
Oct 17, 2023
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor structure
Patent number
11,735,555
Issue date
Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device manufacturing method and semiconductor device
Patent number
11,705,445
Issue date
Jul 18, 2023
Kioxia Corporation
Hideo Numata
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for interconnecting stacked semiconductor devices
Patent number
11,676,944
Issue date
Jun 13, 2023
Intel Corporation
Junfeng Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked chip package and methods of manufacture thereof
Patent number
11,664,349
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System on integrated chips and methods of forming same
Patent number
11,658,150
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sung-Feng Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for contacting and rewiring an electronic component embedded...
Patent number
11,570,904
Issue date
Jan 31, 2023
AT&S Austria Technologie & Systemtechnik
Wolfgang Schrittwieser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and structures for increasing the allowable die size in TMV...
Patent number
11,488,892
Issue date
Nov 1, 2022
Amkor Technology Singapore Holding Pte Ltd.
Louis W. Nicholls
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer scale bonded active photonics interposer
Patent number
11,435,523
Issue date
Sep 6, 2022
The Research Foundation for the State University of New York
Douglas Coolbaugh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
Patent number
11,348,861
Issue date
May 31, 2022
Infineon Technologies Austria AG
Sergey Yuferev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
Patent number
11,309,277
Issue date
Apr 19, 2022
Infineon Technologies AG
Petteri Palm
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stackable electronic package and method of fabricating same
Patent number
11,309,304
Issue date
Apr 19, 2022
General Electric Company
James Sabatini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,189,553
Issue date
Nov 30, 2021
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,183,475
Issue date
Nov 23, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die stack with cascade and vertical connections
Patent number
11,171,114
Issue date
Nov 9, 2021
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a printed circuit board structure
Patent number
11,172,576
Issue date
Nov 9, 2021
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Johannes Stahr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
Patent number
11,133,242
Issue date
Sep 28, 2021
STMicroelectronics S.r.l.
Michele Derai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
Patent number
11,134,572
Issue date
Sep 28, 2021
IMBERATEK, LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,121,102
Issue date
Sep 14, 2021
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
Publication number
20250167157
Publication date
May 22, 2025
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Pablo RENAUD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240258253
Publication date
Aug 1, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
Publication number
20240170457
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3DIC Interconnect Apparatus and Method
Publication number
20230378139
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Shu-Ting Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
Publication number
20220293581
Publication date
Sep 15, 2022
KIOXIA Corporation
Hideo NUMATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220148987
Publication date
May 12, 2022
Amkor Technology Singapore Holding Pte. Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
Publication number
20220077097
Publication date
Mar 10, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
Publication number
20220044991
Publication date
Feb 10, 2022
Amkor Technology Singapore Holding Pte. Ltd
Naoki HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
Publication number
20220037291
Publication date
Feb 3, 2022
Intel Corporation
Min-Tih Ted Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit board structure and method for manufacturing a circuit boar...
Publication number
20210392752
Publication date
Dec 16, 2021
ImberaTek LLC
Risto Tuominen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System on Integrated Chips and Methods of Forming Same
Publication number
20210343680
Publication date
Nov 4, 2021
Taiwan Semiconductor Manufacturing Co., Ltd.
Sung-Feng Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
Publication number
20210329788
Publication date
Oct 21, 2021
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
Publication number
20210166992
Publication date
Jun 3, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Louis W. Nicholls
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
Publication number
20210013134
Publication date
Jan 14, 2021
STMicroelectronics S.r.l.
Michele DERAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
Publication number
20210005536
Publication date
Jan 7, 2021
Sergey Yuferev
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH SILICON VIA STRUCTURE
Publication number
20200381340
Publication date
Dec 3, 2020
United Microelectronics Corp.
Zhao-Bing LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20200328170
Publication date
Oct 15, 2020
Amkor Technology, Inc.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER INTEGRATED MODULE
Publication number
20200303326
Publication date
Sep 24, 2020
DELTA ELECTRONICS (SHANGHAI) CO., LTD.
Jianhong ZENG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Integrated Circuits with Redistribution Lines
Publication number
20200258865
Publication date
Aug 13, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE
Publication number
20200251439
Publication date
Aug 6, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Structure and Method of Forming
Publication number
20200118956
Publication date
Apr 16, 2020
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH SILICON...
Publication number
20200105647
Publication date
Apr 2, 2020
United Microelectronics Corp.
Zhao-Bing LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
Publication number
20200066623
Publication date
Feb 27, 2020
J-DEVICES CORPORATION
Naoki HAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLATING INTERCONNECT FOR SILICON CHIP
Publication number
20200027737
Publication date
Jan 23, 2020
TEXAS INSTRUMENTS INCORPORATED
Jerard Canuto Malado
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D STACKED-CHIP PACKAGE
Publication number
20190355640
Publication date
Nov 21, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Integrated Circuits with Redistribution Lines
Publication number
20190252354
Publication date
Aug 15, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Ying Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD THEREOF
Publication number
20190198351
Publication date
Jun 27, 2019
SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
Xiaochun Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Circuit Board Structure
Publication number
20190150288
Publication date
May 16, 2019
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Johannes Stahr
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20190139908
Publication date
May 9, 2019
Toshiba Memory Corporation
Masaya SHIMA
H01 - BASIC ELECTRIC ELEMENTS