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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8203Reshaping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 12,068,283
- Issue date Aug 20, 2024
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 12,033,983
- Issue date Jul 9, 2024
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of embedding low-k materials in antennas
- Patent number 11,984,668
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Monsen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuits with redistribution lines
- Patent number 11,923,338
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for stacked device
- Patent number 11,915,977
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,908,783
- Issue date Feb 20, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,841,531
- Issue date Dec 12, 2023
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,842,970
- Issue date Dec 12, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC interconnect apparatus and method
- Patent number 11,798,916
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,792,941
- Issue date Oct 17, 2023
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,735,555
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 11,705,445
- Issue date Jul 18, 2023
- Kioxia Corporation
- Hideo Numata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting stacked semiconductor devices
- Patent number 11,676,944
- Issue date Jun 13, 2023
- Intel Corporation
- Junfeng Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip package and methods of manufacture thereof
- Patent number 11,664,349
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips and methods of forming same
- Patent number 11,658,150
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for contacting and rewiring an electronic component embedded...
- Patent number 11,570,904
- Issue date Jan 31, 2023
- AT&S Austria Technologie & Systemtechnik
- Wolfgang Schrittwieser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for increasing the allowable die size in TMV...
- Patent number 11,488,892
- Issue date Nov 1, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale bonded active photonics interposer
- Patent number 11,435,523
- Issue date Sep 6, 2022
- The Research Foundation for the State University of New York
- Douglas Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,348,861
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembling on adhesion layer or dielectric layer, extending be...
- Patent number 11,309,277
- Issue date Apr 19, 2022
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable electronic package and method of fabricating same
- Patent number 11,309,304
- Issue date Apr 19, 2022
- General Electric Company
- James Sabatini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
- Patent number 11,189,553
- Issue date Nov 30, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Naoki Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,183,475
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack with cascade and vertical connections
- Patent number 11,171,114
- Issue date Nov 9, 2021
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding device...
- Patent number 11,133,242
- Issue date Sep 28, 2021
- STMicroelectronics S.r.l.
- Michele Derai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure and method for manufacturing a circuit boar...
- Patent number 11,134,572
- Issue date Sep 28, 2021
- IMBERATEK, LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,121,102
- Issue date Sep 14, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with through silicon via structure
- Patent number 11,081,427
- Issue date Aug 3, 2021
- United Microelectronics Corp.
- Zhao-Bing Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240258253
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES
- Publication number 20240170457
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
- Publication number 20240030265
- Publication date Jan 25, 2024
- Semiconductor Components Industries, LLC
- Weng-Jin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20230378139
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20220293581
- Publication date Sep 15, 2022
- KIOXIA Corporation
- Hideo NUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220148987
- Publication date May 12, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20220077097
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20220044991
- Publication date Feb 10, 2022
- Amkor Technology Singapore Holding Pte. Ltd
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS
- Publication number 20220037291
- Publication date Feb 3, 2022
- Intel Corporation
- Min-Tih Ted Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board structure and method for manufacturing a circuit boar...
- Publication number 20210392752
- Publication date Dec 16, 2021
- ImberaTek LLC
- Risto Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System on Integrated Chips and Methods of Forming Same
- Publication number 20210343680
- Publication date Nov 4, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...
- Publication number 20210166992
- Publication date Jun 3, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Louis W. Nicholls
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20210013134
- Publication date Jan 14, 2021
- STMicroelectronics S.r.l.
- Michele DERAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20210005536
- Publication date Jan 7, 2021
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH SILICON VIA STRUCTURE
- Publication number 20200381340
- Publication date Dec 3, 2020
- United Microelectronics Corp.
- Zhao-Bing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200328170
- Publication date Oct 15, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER INTEGRATED MODULE
- Publication number 20200303326
- Publication date Sep 24, 2020
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Jianhong ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuits with Redistribution Lines
- Publication number 20200258865
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20200251439
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Forming
- Publication number 20200118956
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH SILICON...
- Publication number 20200105647
- Publication date Apr 2, 2020
- United Microelectronics Corp.
- Zhao-Bing LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...
- Publication number 20200066623
- Publication date Feb 27, 2020
- J-DEVICES CORPORATION
- Naoki HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING INTERCONNECT FOR SILICON CHIP
- Publication number 20200027737
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jerard Canuto Malado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACKED-CHIP PACKAGE
- Publication number 20190355640
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Integrated Circuits with Redistribution Lines
- Publication number 20190252354
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Ying Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD THEREOF
- Publication number 20190198351
- Publication date Jun 27, 2019
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Structure
- Publication number 20190150288
- Publication date May 16, 2019
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20190139908
- Publication date May 9, 2019
- Toshiba Memory Corporation
- Masaya SHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3DIC Interconnect Apparatus and Method
- Publication number 20190115322
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Ting Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die stack with cascade and vertical connections

Method for interconnecting stacked semiconductor devices

Method of embedding low-k materials in antennas

Stacked integrated circuits with redistribution lines

Interconnect structure for stacked device

Wiring substrate, semiconductor package having the wiring substrate...

Wafer scale bonded active photonics interposer

Semiconductor package and manufacturing method thereof

3DIC interconnect apparatus and method

Circuit board structure and method for manufacturing a circuit boar...

Manufacturing method of semiconductor structure

Method for manufacturing an electronic module and electronic module

Semiconductor device manufacturing method and semiconductor device

Method for interconnecting stacked semiconductor devices

Stacked chip package and methods of manufacture thereof

System on integrated chips and methods of forming same

Method for contacting and rewiring an electronic component embedded...

Methods and structures for increasing the allowable die size in TMV...

Wafer scale bonded active photonics interposer

Semiconductor package and method of manufacturing a semiconductor p...

Chip assembling on adhesion layer or dielectric layer, extending be...

Stackable electronic package and method of fabricating same

Wiring substrate, semiconductor package having the wiring substrate...

Semiconductor structure

Method for producing a printed circuit board structure

Die stack with cascade and vertical connections

Method of manufacturing semiconductor devices, corresponding device...

Circuit board structure and method for manufacturing a circuit boar...

Semiconductor package and manufacturing method thereof

Semiconductor device with through silicon via structure

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

STACKED INTEGRATED CIRCUITS WITH REDISTRIBUTION LINES

STACKED CHIP SCALE OPTICAL SENSOR PACKAGE

3DIC Interconnect Apparatus and Method

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

DIE STACK WITH CASCADE AND VERTICAL CONNECTIONS

Circuit board structure and method for manufacturing a circuit boar...

System on Integrated Chips and Methods of Forming Same

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

Semiconductor Package and Method of Manufacturing a Semiconductor P...

SEMICONDUCTOR DEVICE WITH THROUGH SILICON VIA STRUCTURE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

POWER INTEGRATED MODULE

Stacked Integrated Circuits with Redistribution Lines

SEMICONDUCTOR STRUCTURE

Semiconductor Structure and Method of Forming

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH SILICON...

WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE...

PLATING INTERCONNECT FOR SILICON CHIP

3D STACKED-CHIP PACKAGE

Stacked Integrated Circuits with Redistribution Lines

PACKAGE STRUCTURE AND METHOD THEREOF

Circuit Board Structure

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

3DIC Interconnect Apparatus and Method