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H01L2224/8593

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/8593Reshaping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module and method for manufacturing the same
- Patent number 10,643,969
- Issue date May 5, 2020
- Mitsubishi Electric Corporation
- Yusaku Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 10,283,482
- Issue date May 7, 2019
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heavy-wire bond arrangement and method for producing same
- Patent number 9,992,861
- Issue date Jun 5, 2018
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and systems incorporating metal nanoparticles
- Patent number 9,881,895
- Issue date Jan 30, 2018
- Lockheed Martin Corporation
- Randall Mark Stoltenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat isolation structures for high bandwidth interconnects
- Patent number 9,859,188
- Issue date Jan 2, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die packaging with fully or partially fused dielectric leads
- Patent number 9,812,420
- Issue date Nov 7, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining a bonding connection in a component arrangem...
- Patent number 9,793,179
- Issue date Oct 17, 2017
- Technische Universitat Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method of forming the same
- Patent number 8,945,990
- Issue date Feb 3, 2015
- Infineon Technologies AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,153,517
- Issue date Apr 10, 2012
- TEREPAC Corporation
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes and structures for IC fabrication
- Patent number 8,124,452
- Issue date Feb 28, 2012
- TEREPAC Corporation
- Jayna Sheats
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic component with wire bonds in low modulus fill encapsulant
- Patent number 8,063,318
- Issue date Nov 22, 2011
- Silverbrook Research Pty Ltd
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly of electronic components
- Patent number 8,039,974
- Issue date Oct 18, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling satellite drops from an encapsulant jetter
- Patent number 7,915,091
- Issue date Mar 29, 2011
- Silverbrook Research Pty Ltd
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adhering wire bond loops to reduce loop height
- Patent number 7,875,504
- Issue date Jan 25, 2011
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of wire bonding an integrated circuit die and a printed circ...
- Patent number 7,802,715
- Issue date Sep 28, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with wire bonds adhered between integrated circui...
- Patent number 7,741,720
- Issue date Jun 22, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming low profile wire bonds between integrated circuit...
- Patent number 7,669,751
- Issue date Mar 2, 2010
- Silverbrook Research Pty Ltd
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectric packages having deformed bonded leads and methods the...
- Patent number 6,848,173
- Issue date Feb 1, 2005
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
2928931
- Patent number 2,928,931
- Issue date Mar 15, 1960
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190043827
- Publication date Feb 7, 2019
- MITSUBISHI ELECTRIC CORPORATION
- Yusaku ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20180138143
- Publication date May 17, 2018
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES
- Publication number 20170053895
- Publication date Feb 23, 2017
- Lockheed Martin Corporation
- Randall Mark STOLTENBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130277813
- Publication date Oct 24, 2013
- INFINEON TECHNOLOGIES AG
- Holger Torwesten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME
- Publication number 20130220673
- Publication date Aug 29, 2013
- Technische Universitaet Berlin
- Andreas Middendorf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
- Publication number 20120048185
- Publication date Mar 1, 2012
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS
- Publication number 20120018905
- Publication date Jan 26, 2012
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20110062596
- Publication date Mar 17, 2011
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100313413
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes and structures for IC fabrication
- Publication number 20100314735
- Publication date Dec 16, 2010
- TEREPAC
- Jayna Sheats
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY OF ELECTRONIC COMPONENTS
- Publication number 20100244282
- Publication date Sep 30, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...
- Publication number 20100133323
- Publication date Jun 3, 2010
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CONTROLLING SATELLITE DROPS FROM AN ENCAPSULANT JETTER
- Publication number 20100075025
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING VOIDS IN ENCAPSULANT
- Publication number 20100075465
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD
- Publication number 20100075446
- Publication date Mar 25, 2010
- SILVERBROOK RESEARCH PTY LTD
- Nadine Lee-Yen Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090135569
- Publication date May 28, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WIRE BONDS ADHERED BETWEEN INTEGRATED CIRCUI...
- Publication number 20090079081
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUIT...
- Publication number 20090078744
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT
- Publication number 20090081829
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Kia Silverbrook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090079097
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of making microelectronic assemblies
- Publication number 20050155223
- Publication date Jul 21, 2005
- Tessera, Inc.
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packages having deformed bonded leads and methods t...
- Publication number 20020068426
- Publication date Jun 6, 2002
- Joseph Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor module and method for manufacturing the same

Mixed impedance leads for die packages and method of making the same

Wire bonding methods and systems incorporating metal nanoparticles

Heavy-wire bond arrangement and method for producing same

Wire bonding methods and systems incorporating metal nanoparticles

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Method for determining a bonding connection in a component arrangem...

Substrate less die package having wires with dielectric and metal c...

Electronic device having a lead with selectively modified electrica...

Chip package and method of forming the same

Processes and structures for IC fabrication

Processes and structures for IC fabrication

Electronic component with wire bonds in low modulus fill encapsulant

Assembly of electronic components

Method of controlling satellite drops from an encapsulant jetter

Method of adhering wire bond loops to reduce loop height

Method of wire bonding an integrated circuit die and a printed circ...

Electronic device with wire bonds adhered between integrated circui...

Method of forming low profile wire bonds between integrated circuit...

Microelectric packages having deformed bonded leads and methods the...

2928931

Patents Applicationslast 30 patents

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES

CHIP PACKAGE AND METHOD OF FORMING THE SAME

HEAVY-WIRE BOND ARRANGEMENT AND METHOD FOR PRODUCING SAME

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

ELECTRONIC COMPONENT ASSEMBLY HAVING PROFILED ENCAPSULATED BONDS

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Processes and structures for IC fabrication

Processes and structures for IC fabrication

ASSEMBLY OF ELECTRONIC COMPONENTS

METHOD OF WIRE BONDING AN INTEGRATED CIRCUIT DIE AND A PRINTED CIRC...

METHOD OF CONTROLLING SATELLITE DROPS FROM AN ENCAPSULANT JETTER

METHOD OF REDUCING VOIDS IN ENCAPSULANT

METHOD OF FORMING ASSYMETRICAL ENCAPSULANT BEAD

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

ELECTRONIC DEVICE WITH WIRE BONDS ADHERED BETWEEN INTEGRATED CIRCUI...

METHOD OF FORMING LOW PROFILE WIRE BONDS BETWEEN INTEGRATED CIRCUIT...

METHOD OF ADHERING WIRE BOND LOOPS TO REDUCE LOOP HEIGHT

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

Methods of making microelectronic assemblies

Microelectronic packages having deformed bonded leads and methods t...