2928931

Information

• Patent Grant
• 2928931

• References
• Source

• Patent Number

  2,928,931

• Date Filed

  Not available

• Date Issued

  Tuesday, March 15, 1960
  65 years ago

• CPC

  • H01L24/85 - using a wire connector
  • B25J7/00 - Micromanipulators
  • H01L24/05 - of an individual bonding area
  • H01L24/48 - of an individual wire connector
  • H01L24/78 - Apparatus for connecting with wire connectors
  • H01L2224/04042 - Bonding areas specifically adapted for wire connectors
  • H01L2224/05 - of an individual bonding area
  • H01L2224/48091 - Arched
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/48464 - the other connecting portion not on the bonding area also being a ball bond
  • H01L2224/78301 - Capillary
  • H01L2224/85365 - Shape
  • H01L2224/8593 - Reshaping
  • H01L2924/00014 - the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
  • H01L2924/01005 - Boron [B]
  • H01L2924/01006 - Carbon [C]
  • H01L2924/01013 - Aluminum [Al]
  • H01L2924/01015 - Phosphorus [P]
  • H01L2924/01019 - Potassium [K]
  • H01L2924/01021 - Scandium [Sc]
  • H01L2924/01023 - Vanadium [V]
  • H01L2924/01027 - Cobalt [Co]
  • H01L2924/01028 - Nickel [Ni]
  • H01L2924/01029 - Copper [Cu]
  • H01L2924/01033 - Arsenic [As]
  • H01L2924/01039 - Yttrium [Y]
  • H01L2924/01057 - Lanthanum [La]
  • H01L2924/01074 - Tungsten [W]
  • H01L2924/01075 - Rhenium [Re]
  • H01L2924/01078 - Platinum [Pt]
  • H01L2924/01082 - Lead [Pb]
  • H01L2924/014 - Solder alloys
  • Y10T29/532 - Conductor

• US Classifications

  • 219 - Electric heating
  • 029 - Metal working
  • 140 - Wireworking
  • 228 - Metal fusion bonding