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H01L2224/8093

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/8093Reshaping

Industries

Patents Grantslast 30 patents

Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 12,142,629
- Issue date Nov 12, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 11,843,023
- Issue date Dec 12, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,830,838
- Issue date Nov 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method of manufacturing semiconductor device,...
- Patent number 11,742,374
- Issue date Aug 29, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yoshiya Hagimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 11,569,123
- Issue date Jan 31, 2023
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 11,545,519
- Issue date Jan 3, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly by direct bonding between two elements, each ele...
- Patent number 11,305,372
- Issue date Apr 19, 2022
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Lea Di Cioccio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive barrier direct hybrid bonding
- Patent number 11,264,345
- Issue date Mar 1, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and connecting substrates
- Patent number 11,107,855
- Issue date Aug 31, 2021
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, fabrication method for a semiconductor device...
- Patent number 10,985,102
- Issue date Apr 20, 2021
- Sony Corporation
- Yoshihisa Kagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus and method for preparing the same
- Patent number 10,923,455
- Issue date Feb 16, 2021
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 10,840,205
- Issue date Nov 17, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing a semiconductor apparatus
- Patent number 10,825,794
- Issue date Nov 3, 2020
- Nanya Technology Corporation
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multiple substrates electrically connecte...
- Patent number 10,707,258
- Issue date Jul 7, 2020
- Sony Corporation
- Nobutoshi Fujii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Member for solid-state image pickup device and method for manufactu...
- Patent number 10,651,231
- Issue date May 12, 2020
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased contact alignment tolerance for direct bonding
- Patent number 10,607,937
- Issue date Mar 31, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 8,742,595
- Issue date Jun 3, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS devices and methods of forming same
- Patent number 8,497,148
- Issue date Jul 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C. S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING
- Publication number 20240276735
- Publication date Aug 15, 2024
- Kepler Computing Inc.
- Biswajeet Guha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20240243085
- Publication date Jul 18, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20240088196
- Publication date Mar 14, 2024
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20230361145
- Publication date Nov 9, 2023
- Sony Semiconductor Solutions Corporation
- YOSHIYA HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20230268308
- Publication date Aug 24, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20230075728
- Publication date Mar 9, 2023
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20220254746
- Publication date Aug 11, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. ENQUIST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20210391369
- Publication date Dec 16, 2021
- Sony Semiconductor Solutions Corporation
- YOSHIYA HAGIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20210366958
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20210066233
- Publication date Mar 4, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Gaius Gillman FOUNTAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...
- Publication number 20200243584
- Publication date Jul 30, 2020
- Canon Kabushiki Kaisha
- Nobuyuki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICES AND METHODS OF FORMING SAME
- Publication number 20140151823
- Publication date Jun 5, 2014
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Devices and Methods of Forming Same
- Publication number 20130020718
- Publication date Jan 24, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bruce C.S. Chou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Member for solid-state image pickup device and method for manufactu...

Member for solid-state image pickup device and method for manufactu...

Conductive barrier direct hybrid bonding

Semiconductor device, method of manufacturing semiconductor device,...

Semiconductor device, fabrication method for a semiconductor device...

Chemical mechanical polishing for hybrid bonding

Member for solid-state image pickup device and method for manufactu...

Method of assembly by direct bonding between two elements, each ele...

Conductive barrier direct hybrid bonding

Method for bonding and connecting substrates

Semiconductor device, fabrication method for a semiconductor device...

Semiconductor apparatus and method for preparing the same

Chemical mechanical polishing for hybrid bonding

Method for preparing a semiconductor apparatus

Semiconductor device with multiple substrates electrically connecte...

Member for solid-state image pickup device and method for manufactu...

Increased contact alignment tolerance for direct bonding

MEMS devices and methods of forming same

MEMS devices and methods of forming same

Patents Applicationslast 30 patents

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

METHOD OF FORMING CAPACITORS THROUGH WAFER BONDING

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

MEMBER FOR SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTU...

MEMS DEVICES AND METHODS OF FORMING SAME

MEMS Devices and Methods of Forming Same