Resistance welding electrodes

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CPC
H01L2224/7528

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/7528Resistance welding electrodes

Industries

Patents Grantslast 30 patents

Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 12,142,594
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for forming a package structure
- Patent number 11,961,817
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai Jun Zhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for and method for aligning dipoles and method of fabrica...
- Patent number 11,728,196
- Issue date Aug 15, 2023
- Samsung Display Co., Ltd.
- Won Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat assisted flip chip bonding apparatus
- Patent number 11,682,650
- Issue date Jun 20, 2023
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Uniform pressure gang bonding method
- Patent number 11,637,082
- Issue date Apr 25, 2023
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Batch processing oven and method
- Patent number 11,444,053
- Issue date Sep 13, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for processing semiconductor devices
- Patent number 11,355,471
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder reflow oven for batch processing
- Patent number 11,335,662
- Issue date May 17, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing oven
- Patent number 11,296,049
- Issue date Apr 5, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Christopher Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for uniform pressure gang bonding
- Patent number 11,152,328
- Issue date Oct 19, 2021
- eLux, Inc.
- Wei-Yuan Ma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing an integral join and automatic placement machine
- Patent number 11,081,464
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Nicolas Heuck
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor chip mounting apparatus and semiconductor chip mounti...
- Patent number 10,978,420
- Issue date Apr 13, 2021
- Shinkawa Ltd.
- Yoshihito Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for manufacturing semiconductor devices
- Patent number 10,971,471
- Issue date Apr 6, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,903,187
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for improved delamination characteristics in a...
- Patent number 10,763,130
- Issue date Sep 1, 2020
- Microchip Technology Incorporated
- Taweesak Laevohan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extrusion-based additive manufacturing system for 3D structural ele...
- Patent number 10,748,867
- Issue date Aug 18, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Curing a heat-curable material in an embedded curing zone
- Patent number 10,717,236
- Issue date Jul 21, 2020
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Jeroen van den Brand
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum-processing device and control method therefor, and vacuum so...
- Patent number 10,307,849
- Issue date Jun 4, 2019
- Senju Metal Industry Co., Ltd.
- Tomotake Kagaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 10,262,970
- Issue date Apr 16, 2019
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for heating a substrate during die bonding
- Patent number 10,199,350
- Issue date Feb 5, 2019
- ASM Technology Singapore Pte. Ltd.
- Ming Yeung Luke Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tools and systems for processing semiconductor devices, and methods...
- Patent number 10,109,612
- Issue date Oct 23, 2018
- Taiwan Semiconductor Manufacturing Company
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer tool manipulator assembly
- Patent number 10,022,859
- Issue date Jul 17, 2018
- Apple Inc.
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective area heating for 3D chip stack
- Patent number 9,860,996
- Issue date Jan 2, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of transferring and bonding an array of micro devices
- Patent number 9,773,750
- Issue date Sep 26, 2017
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...
- Publication number 20240313153
- Publication date Sep 19, 2024
- SAMSUNG DISPLAY CO., LTD.
- Futoshi YOSHIDA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20240222312
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20230386878
- Publication date Nov 30, 2023
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT ASSISTED FLIP CHIP BONDING APPARATUS
- Publication number 20220384383
- Publication date Dec 1, 2022
- National Pingtung University of Science and Technology
- Wei-Hua Lu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20220302079
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE
- Publication number 20220278071
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai Jun ZHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20220254751
- Publication date Aug 11, 2022
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...
- Publication number 20220005719
- Publication date Jan 6, 2022
- SAMSUNG DISPLAY CO., LTD.
- Won Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH PROCESSING OVEN AND METHOD
- Publication number 20210265301
- Publication date Aug 26, 2021
- Yield Engineering Systems, Inc.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...
- Publication number 20200251441
- Publication date Aug 6, 2020
- SHINKAWA LTD.
- Yoshihito HAGIWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20200243477
- Publication date Jul 30, 2020
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20200212001
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20180358325
- Publication date Dec 13, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20180084649
- Publication date Mar 22, 2018
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING APPARATUS AND DIE BONDING METHOD
- Publication number 20170365578
- Publication date Dec 21, 2017
- FURUKAWA ELECTRIC CO., LTD.
- Teruyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...
- Publication number 20170243851
- Publication date Aug 24, 2017
- ATV TECHNOLOGIE GMBH
- Ventzeslav RANGELOV
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20170141075
- Publication date May 18, 2017
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ken Osawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20160329218
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Process and Tool
- Publication number 20150249062
- Publication date Sep 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ai-Tee Ang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Tools and Systems for Processing Semiconductor Devices, and Methods...
- Publication number 20150171051
- Publication date Jun 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BONDING METHOD
- Publication number 20140263581
- Publication date Sep 18, 2014
- ALPHA DESIGN CO., LTD.
- Toshiyuki SHIRATORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AREA HEATING FOR 3D CHIP STACK
- Publication number 20140256090
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Mario J. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mass Transfer Tool Manipulator Assembly
- Publication number 20140241843
- Publication date Aug 28, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Dariusz Golda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Bonding Head With A Heatable And Coolable Suction Member
- Publication number 20140202636
- Publication date Jul 24, 2014
- Besi Switzerland AG
- Andreas Mayr
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY
- Publication number 20140159067
- Publication date Jun 12, 2014
- LUXVUE TECHNOLOGY CORPORATION
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS
- Publication number 20130340943
- Publication date Dec 26, 2013
- Tadashi YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING
- Publication number 20130316294
- Publication date Nov 28, 2013
- Ming Yeung Luke WAN
- H01 - BASIC ELECTRIC ELEMENTS

Resistance welding electrodes

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Tools and systems for processing semiconductor devices, and methods...

Method for transferring electronic device

Apparatus and method for forming a package structure

Method of using processing oven

Apparatus for and method for aligning dipoles and method of fabrica...

Heat assisted flip chip bonding apparatus

Uniform pressure gang bonding method

Method of using processing oven

Method of using a processing oven

Batch processing oven and method

System for processing semiconductor devices

Solder reflow oven for batch processing

Processing oven

System and method for uniform pressure gang bonding

Method for producing an integral join and automatic placement machine

Semiconductor chip mounting apparatus and semiconductor chip mounti...

Methods and systems for manufacturing semiconductor devices

Selective area heating for 3D chip stack

Systems and methods for improved delamination characteristics in a...

Extrusion-based additive manufacturing system for 3D structural ele...

Curing a heat-curable material in an embedded curing zone

Semiconductor chip package with resilient conductive paste post and...

Vacuum-processing device and control method therefor, and vacuum so...

Selective area heating for 3D chip stack

Apparatus for heating a substrate during die bonding

Tools and systems for processing semiconductor devices, and methods...

Mass transfer tool manipulator assembly

Thermo-compression bonding system, subsystems, and methods of use

Selective area heating for 3D chip stack

Method of transferring and bonding an array of micro devices

Patents Applicationslast 30 patents

PRESSURE DETECTION METHOD, PRESSURE DETECTION METHOD OF BONDING DEV...

METHOD FOR FORMING A PACKAGE STRUCTURE

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

MOUNTING HEAD

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

HEAT ASSISTED FLIP CHIP BONDING APPARATUS

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

Tools and Systems for Processing Semiconductor Devices, and Methods...

APPARATUS AND METHOD FOR FORMING A PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

APPARATUS FOR AND METHOD FOR ALIGNING DIPOLES AND METHOD OF FABRICA...

BATCH PROCESSING OVEN AND METHOD

SEMICONDUCTOR CHIP MOUNTING APPARATUS AND SEMICONDUCTOR CHIP MOUNTI...

DIE BONDING APPARATUS AND DIE BONDING METHOD

METHODS AND SYSTEMS FOR MANUFACTURING SEMICONDUCTOR DEVICES

Tools and Systems for Processing Semiconductor Devices, and Methods...

SELECTIVE AREA HEATING FOR 3D CHIP STACK

DIE BONDING APPARATUS AND DIE BONDING METHOD

APPARATUS FOR ESPECIALLY THERMALLY JOINING MICRO-ELECTROMECHANICAL...

PROCESS OF FORMING SEMICONDUCTOR DEVICE

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Reflow Process and Tool

Tools and Systems for Processing Semiconductor Devices, and Methods...

ELECTRONIC COMPONENT BONDING METHOD

SELECTIVE AREA HEATING FOR 3D CHIP STACK

Mass Transfer Tool Manipulator Assembly

Bonding Head With A Heatable And Coolable Suction Member

ACTIVE MATRIX EMISSIVE MICRO LED DISPLAY

BONDING APPARATUS

APPARATUS FOR HEATING A SUBSTRATE DURING DIE BONDING