Resistive element

Industry

CPC
B41J2/14112

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B41Printing, stamps B41JTYPEWRITERS SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed

Current Industry

B41J2/14112Resistive element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejection head substrate, liquid ejection head, and liquid ej...
- Patent number 12,246,536
- Issue date Mar 11, 2025
- Canon Kabushiki Kaisha
- Yasuo Fujii
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid-ejection element between-chamber fluid recirculation path
- Patent number 11,970,011
- Issue date Apr 30, 2024
- Hewlett-Packard Development Company, L.P.
- Jacob Lum
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electric wiring member and liquid ejection head
- Patent number 11,917,748
- Issue date Feb 27, 2024
- Canon Kabushiki Kaisha
- Takamitsu Tokuda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Cavitation plate to protect a heating component and detect a condition
- Patent number 11,858,269
- Issue date Jan 2, 2024
- Hewlett-Packard Development Company, L.P.
- Eric Thomas Martin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,813,863
- Issue date Nov 14, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Wafer structure
- Patent number 11,738,556
- Issue date Aug 29, 2023
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet chip and thermal bubble inkjet printhead using the same
- Patent number 11,407,225
- Issue date Aug 9, 2022
- International United Technology Co., Ltd.
- Yuan-Liang Lan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead nozzle addressing
- Patent number 11,123,981
- Issue date Sep 21, 2021
- Hewlett-Packard Development Company, L.P.
- Eric T Martin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Thermal inkjet dye sublimation inks
- Patent number 11,066,567
- Issue date Jul 20, 2021
- Hewlett-Packard Development Company, L.P.
- Howard Doumaux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Microfluidic delivery system
- Patent number 11,000,862
- Issue date May 11, 2021
- The Procter & Gamble Company
- Dana Paul Gruenbacher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Liquid ejection head and manufacturing method thereof
- Patent number 10,889,112
- Issue date Jan 12, 2021
- Canon Kabushiki Kaisha
- Kousuke Kubo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Print head driving apparatus and printing apparatus having the same
- Patent number 10,850,503
- Issue date Dec 1, 2020
- WOOSIM SYSTEM INC.
- Il Bok Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Low toxicity ink formulations with improved printhead lifetime
- Patent number 10,696,855
- Issue date Jun 30, 2020
- Memjet Technology Limited
- Jognandan Prashar
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead nozzle addressing
- Patent number 10,562,296
- Issue date Feb 18, 2020
- Hewlett-Packard Development Company, L.P.
- Eric T Martin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid discharge head substrate, liquid discharge head, and method...
- Patent number 10,538,085
- Issue date Jan 21, 2020
- Canon Kabushiki Kaisha
- Yoshinori Misumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid discharge head substrate, liquid discharge head and liquid d...
- Patent number 10,538,086
- Issue date Jan 21, 2020
- Canon Kabushiki Kaisha
- Yasuo Fujii
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejection device
- Patent number 10,449,762
- Issue date Oct 22, 2019
- Hewlett-Packard Development Company, L.P.
- James R. Przybyla
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluidic die
- Patent number 10,232,610
- Issue date Mar 19, 2019
- Hewlett-Packard Development Company, L.P.
- Daryl E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid discharge head and liquid discharge apparatus
- Patent number 10,220,617
- Issue date Mar 5, 2019
- Canon Kabushiki Kaisha
- Takuro Yamazaki
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid containing member
- Patent number 10,173,431
- Issue date Jan 8, 2019
- Seiko Epson Corporation
- Hiroyuki Kawate
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Methods of making an inkjet print head by sawing discontinuous slot...
- Patent number 10,131,147
- Issue date Nov 20, 2018
- STMicroelectronics, Inc.
- Kenneth J. Stewart
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wide array printhead module
- Patent number 10,040,281
- Issue date Aug 7, 2018
- Hewlett-Packard Development Company, L.P.
- Daryl E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid containing member
- Patent number 10,000,063
- Issue date Jun 19, 2018
- Seiko Epson Corporation
- Hiroyuki Kawate
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Inkjet nozzle device having improved lifetime
- Patent number 9,994,017
- Issue date Jun 12, 2018
- Memjet Technology Limited
- Angus John North
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printing apparatus and medium
- Patent number 9,975,340
- Issue date May 22, 2018
- Canon Kabushiki Kaisha
- Seiichiro Karita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejecting head, ejecting element substrate and liquid ejectin...
- Patent number 9,889,650
- Issue date Feb 13, 2018
- Canon Kabushiki Kaisha
- Takuma Kodoi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid ejection head and liquid ejection apparatus
- Patent number 9,884,482
- Issue date Feb 6, 2018
- Canon Kabushiki Kaisha
- Michinari Mizutani
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Fluid ejection apparatus including a parasitic resistor
- Patent number 9,849,672
- Issue date Dec 26, 2017
- Hewlett-Packard Development Company, L.P.
- Ning Ge
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Recording-element substrate, recording head, and recording apparatus
- Patent number 9,833,992
- Issue date Dec 5, 2017
- Canon Kabushiki Kaisha
- Suguru Taniguchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Microfluidic delivery system
- Patent number 9,808,812
- Issue date Nov 7, 2017
- The Procter & Gamble Company
- Dana Paul Gruenbacher
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND LIQUID EJ...
- Publication number 20250187333
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- YASUO FUJII
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
RECORDING ELEMENT SUBSTRATE AND RECORDING APPARATUS
- Publication number 20250162308
- Publication date May 22, 2025
- Canon Kabushiki Kaisha
- RYOHEI YAMADA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD
- Publication number 20250083439
- Publication date Mar 13, 2025
- Canon Kabushiki Kaisha
- TAKAMITSU TOKUDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS
- Publication number 20250074052
- Publication date Mar 6, 2025
- Canon Kabushiki Kaisha
- Ryotaro MURAKAMI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20250033352
- Publication date Jan 30, 2025
- SEIKO EPSON CORPORATION
- Masaki MORI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID DISCHARGE HEAD
- Publication number 20240375406
- Publication date Nov 14, 2024
- Canon Kabushiki Kaisha
- TAKEHO MIYASHITA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKS FOR IMPROVING PRINTHEAD LIFETIME
- Publication number 20240318021
- Publication date Sep 26, 2024
- MEMJET TECHNOLOGY LIMITED
- Ellaine Munton
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
HEAD BOARD, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS
- Publication number 20240227394
- Publication date Jul 11, 2024
- Canon Kabushiki Kaisha
- SEIKO MINAMI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELEMENT SUBSTRATE AND PRINTING APPARATUS
- Publication number 20240208208
- Publication date Jun 27, 2024
- Canon Kabushiki Kaisha
- KENJI FUKADA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, AND LIQUID DISCHARG...
- Publication number 20230398779
- Publication date Dec 14, 2023
- Toshiaki MASUDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FLUID-EJECTION ELEMENT BETWEEN-CHAMBER FLUID RECIRCULATION PATH
- Publication number 20230105703
- Publication date Apr 6, 2023
- Hewlett-Packard Development Company, L.P.
- Jacob Lum
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRIC WIRING MEMBER AND LIQUID EJECTION HEAD
- Publication number 20220304141
- Publication date Sep 22, 2022
- Canon Kabushiki Kaisha
- Takamitsu Tokuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND LIQUID EJ...
- Publication number 20220184952
- Publication date Jun 16, 2022
- Canon Kabushiki Kaisha
- YASUO FUJII
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220161556
- Publication date May 26, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WAFER STRUCTURE
- Publication number 20220161558
- Publication date May 26, 2022
- Microjet Technology Co., Ltd.
- Hao-Jan Mou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION HEAD CIRCUIT BOARD AND LIQUID EJECTION HEAD
- Publication number 20220153027
- Publication date May 19, 2022
- Canon Kabushiki Kaisha
- Kenji Takahashi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
INKJET CHIP AND THERMAL BUBBLE INKJET PRINTHEAD USING THE SAME
- Publication number 20210221135
- Publication date Jul 22, 2021
- INTERNATIONAL UNITED TECHNOLOGY CO., LTD.
- Yuan-Liang Lan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
THERMAL INKJET DYE SUBLIMATION INKS
- Publication number 20200369899
- Publication date Nov 26, 2020
- Hewlett-Packard Development Company, L.P.
- Howard Doumaux
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL BUBBLE INKJET PRINT HEAD CHIP AND MANUFACTURING METHOD THER...
- Publication number 20200164646
- Publication date May 28, 2020
- SHANGHAI AUREFLUIDICS TECHNOLOGY CO., LTD
- Yimin GUAN
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD NOZZLE ADDRESSING
- Publication number 20200164639
- Publication date May 28, 2020
- Hewlett-Packard Development Company, L.P.
- Eric T Martin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
VOLTAGE DROP COMPENSATION FOR INKJET PRINTHEAD
- Publication number 20200086629
- Publication date Mar 19, 2020
- RF Printing Technologies LLC
- Richard Mu
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINT HEAD DRIVING APPARATUS AND PRINTING APPARATUS HAVING THE SAME
- Publication number 20190351675
- Publication date Nov 21, 2019
- WOOSIM SYSTEM INC.
- IL BOK LEE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF
- Publication number 20190255849
- Publication date Aug 22, 2019
- Canon Kabushiki Kaisha
- Kousuke Kubo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID DISCHARGE HEAD SUBSTRATE, LIQUID DISCHARGE HEAD, AND METHOD...
- Publication number 20190105898
- Publication date Apr 11, 2019
- Canon Kabushiki Kaisha
- Yoshinori Misumi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD NOZZLE ADDRESSING
- Publication number 20180272699
- Publication date Sep 27, 2018
- Hewlett-Packard Development Company, L.P.
- Eric T Martin
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONTINUOUSLY REFILLABLE INK-JET CARTRIDGE
- Publication number 20180186153
- Publication date Jul 5, 2018
- SICPA Holding S.A.
- Silvano TORI
- B67 - OPENING, CLOSING OR CLEANING BOTTLES, JARS OR SIMILAR CONTAINERS LIQUID...
Information Patent Application
MICROFLUIDIC DELIVERY SYSTEM
- Publication number 20180078954
- Publication date Mar 22, 2018
- The Procter & Gamble Company
- Dana Paul GRUENBACHER
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
FLUIDIC DIE
- Publication number 20170355188
- Publication date Dec 14, 2017
- Hewlett-Packard Development Company, L.P.
- Daryl E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID EJECTING APPARATUS
- Publication number 20170253038
- Publication date Sep 7, 2017
- SEIKO EPSON CORPORATION
- Hiromichi TAKANASHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIDE ARRAY PRINTHEAD MODULE
- Publication number 20170232734
- Publication date Aug 17, 2017
- Hewlett-Packard Development Company, L.P.
- Daryl E Anderson
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Resistive element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Liquid ejection head substrate, liquid ejection head, and liquid ej...

Fluid-ejection element between-chamber fluid recirculation path

Electric wiring member and liquid ejection head

Cavitation plate to protect a heating component and detect a condition

Wafer structure

Wafer structure

Inkjet chip and thermal bubble inkjet printhead using the same

Printhead nozzle addressing

Thermal inkjet dye sublimation inks

Microfluidic delivery system

Liquid ejection head and manufacturing method thereof

Print head driving apparatus and printing apparatus having the same

Low toxicity ink formulations with improved printhead lifetime

Printhead nozzle addressing

Liquid discharge head substrate, liquid discharge head, and method...

Liquid discharge head substrate, liquid discharge head and liquid d...

Fluid ejection device

Fluidic die

Liquid discharge head and liquid discharge apparatus

Liquid containing member

Methods of making an inkjet print head by sawing discontinuous slot...

Wide array printhead module

Liquid containing member

Inkjet nozzle device having improved lifetime

Printing apparatus and medium

Liquid ejecting head, ejecting element substrate and liquid ejectin...

Liquid ejection head and liquid ejection apparatus

Fluid ejection apparatus including a parasitic resistor

Recording-element substrate, recording head, and recording apparatus

Microfluidic delivery system

Patents Applicationslast 30 patents

LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND LIQUID EJ...

RECORDING ELEMENT SUBSTRATE AND RECORDING APPARATUS

LIQUID EJECTION HEAD AND METHOD FOR MANUFACTURING LIQUID EJECTION HEAD

LIQUID EJECTION HEAD AND LIQUID EJECTION APPARATUS

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

LIQUID DISCHARGE HEAD

INKS FOR IMPROVING PRINTHEAD LIFETIME

HEAD BOARD, LIQUID DISCHARGE HEAD, AND LIQUID DISCHARGE APPARATUS

ELEMENT SUBSTRATE AND PRINTING APPARATUS

LIQUID DISCHARGE HEAD, LIQUID DISCHARGE DEVICE, AND LIQUID DISCHARG...

FLUID-EJECTION ELEMENT BETWEEN-CHAMBER FLUID RECIRCULATION PATH

ELECTRIC WIRING MEMBER AND LIQUID EJECTION HEAD

LIQUID EJECTION HEAD SUBSTRATE, LIQUID EJECTION HEAD, AND LIQUID EJ...

WAFER STRUCTURE

WAFER STRUCTURE

LIQUID EJECTION HEAD CIRCUIT BOARD AND LIQUID EJECTION HEAD

INKJET CHIP AND THERMAL BUBBLE INKJET PRINTHEAD USING THE SAME

THERMAL INKJET DYE SUBLIMATION INKS

THERMAL BUBBLE INKJET PRINT HEAD CHIP AND MANUFACTURING METHOD THER...

PRINTHEAD NOZZLE ADDRESSING

VOLTAGE DROP COMPENSATION FOR INKJET PRINTHEAD

PRINT HEAD DRIVING APPARATUS AND PRINTING APPARATUS HAVING THE SAME

LIQUID EJECTION HEAD AND MANUFACTURING METHOD THEREOF

LIQUID DISCHARGE HEAD SUBSTRATE, LIQUID DISCHARGE HEAD, AND METHOD...

PRINTHEAD NOZZLE ADDRESSING

CONTINUOUSLY REFILLABLE INK-JET CARTRIDGE

MICROFLUIDIC DELIVERY SYSTEM

FLUIDIC DIE

LIQUID EJECTING APPARATUS

WIDE ARRAY PRINTHEAD MODULE