Resistor

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H01L2924/1207

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1207Resistor

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 12,062,623
- Issue date Aug 13, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of forming
- Patent number 12,034,033
- Issue date Jul 9, 2024
- GE Aviation Systems LLC
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 12,009,335
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,002,794
- Issue date Jun 4, 2024
- Rohm Co., Ltd.
- Takumi Kanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Integrated passive device (IPD) components and a package and proces...
- Patent number 11,935,879
- Issue date Mar 19, 2024
- Wolfspeed, Inc.
- Eng Wah Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,923,313
- Issue date Mar 5, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated circuit package
- Patent number 11,876,026
- Issue date Jan 16, 2024
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF device without silicon handle substrate for enhanced thermal and...
- Patent number 11,710,704
- Issue date Jul 25, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package utilizing molded interposer
- Patent number 11,710,693
- Issue date Jul 25, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,610,873
- Issue date Mar 21, 2023
- Mitsubishi Electric Corporation
- Ryo Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,605,613
- Issue date Mar 14, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,569,178
- Issue date Jan 31, 2023
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 11,515,845
- Issue date Nov 29, 2022
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,387,157
- Issue date Jul 12, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,373,969
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming a joint assembly
- Patent number 11,355,468
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,355,405
- Issue date Jun 7, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,322,420
- Issue date May 3, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having integrated inductor, resistor an...
- Patent number 11,309,233
- Issue date Apr 19, 2022
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,289,392
- Issue date Mar 29, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 11,270,920
- Issue date Mar 8, 2022
- Medtronic, Inc.
- Chunho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 11,257,731
- Issue date Feb 22, 2022
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etch process landing on metal oxide etch stop layer over metal...
- Patent number 11,195,725
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Sebastian Meier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion device for reducing an inductance difference betwe...
- Patent number 11,127,695
- Issue date Sep 21, 2021
- Hitachi Automotive Systems, Ltd.
- Akihiro Namba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and method for manufacturing power module
- Patent number 11,114,355
- Issue date Sep 7, 2021
- Murata Manufacturing Co., Ltd.
- Takahiro Hayakawa
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...
- Publication number 20240421051
- Publication date Dec 19, 2024
- Deca Technologies USA, Inc.
- Timothy L. OLSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...
- Publication number 20240405007
- Publication date Dec 5, 2024
- Huawei Technologies Co., Ltd
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240332271
- Publication date Oct 3, 2024
- ROHM CO., LTD.
- Hiroto SAKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...
- Publication number 20240304534
- Publication date Sep 12, 2024
- MEDIATEK INC.
- Shu-Wei HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...
- Publication number 20240290766
- Publication date Aug 29, 2024
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20240282743
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...
- Publication number 20240213184
- Publication date Jun 27, 2024
- Wolfspeed, Inc.
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240203849
- Publication date Jun 20, 2024
- ROHM CO., LTD.
- Ryosuke FUKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240145322
- Publication date May 2, 2024
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20240047376
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369319
- Publication date Nov 16, 2023
- WAVEPIA CO., LTD.
- Sang Hun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF DEVICE WITHOUT SILICON HANDLE SUBSTRATE FOR ENHANCED THERMAL AND...
- Publication number 20230260921
- Publication date Aug 17, 2023
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING
- Publication number 20230238423
- Publication date Jul 27, 2023
- GE AVIATION SYSTEMS LLC
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230207541
- Publication date Jun 29, 2023
- FLOSFIA INC.
- Hideaki YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230014848
- Publication date Jan 19, 2023
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...
- Publication number 20220399318
- Publication date Dec 15, 2022
- Cree, Inc.
- Eng Wah WOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method of Forming a Joint Assembly
- Publication number 20220302069
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Ju Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220262752
- Publication date Aug 18, 2022
- UNITED MICROELECTRONICS CORPORATION
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220165719
- Publication date May 26, 2022
- Rohm Co., Ltd.
- Takumi KANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20220157676
- Publication date May 19, 2022
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage-Controlled Switching Device with Resistive Path
- Publication number 20220102478
- Publication date Mar 31, 2022
- Infineon Technologies Dresden GmbH & Co. KG
- Christian Philipp Sandow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210351161
- Publication date Nov 11, 2021
- Kabushiki Kaisha Toshiba
- Tomohiro Iguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES
- Publication number 20210335718
- Publication date Oct 28, 2021
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20210272909
- Publication date Sep 2, 2021
- Medtronic, Inc.
- Chunho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210249389
- Publication date Aug 12, 2021
- Mitsubishi Electric Corporation
- Ryo GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER
- Publication number 20210090985
- Publication date Mar 25, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...
- Publication number 20210082793
- Publication date Mar 18, 2021
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method to Minimize Stress on Stack Via
- Publication number 20200402855
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing an electronic device

Semiconductor device and method to minimize stress on stack via

RF device without silicon handle substrate for enhanced thermal and...

Semiconductor device package and method of forming

Structure and method of forming a joint assembly

Semiconductor device

Multiple plated via arrays of different wire heights on a same subs...

Integrated passive device (IPD) components and a package and proces...

RF device without silicon handle substrate for enhanced thermal and...

Method of forming integrated circuit package

Wire bond wires for interference shielding

RF device without silicon handle substrate for enhanced thermal and...

Wafer level package utilizing molded interposer

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device

Integrated circuit package and method of forming same

Direct substrate to solder bump connection for thermal management i...

Wire bond wires for interference shielding

RF devices with enhanced performance and methods of forming the same

Semiconductor package and method of forming the same

Structure and method of forming a joint assembly

RF devices with enhanced performance and methods of forming the same

RF devices with enhanced performance and methods of forming the same

Power semiconductor package having integrated inductor, resistor an...

RF devices with enhanced performance and methods of forming the same

Integrated circuit package and method of forming same

RF devices with enhanced performance and methods of forming the same

Dry etch process landing on metal oxide etch stop layer over metal...

Power conversion device for reducing an inductance difference betwe...

Power module and method for manufacturing power module

Patents Applicationslast 30 patents

MULTI-CHIP OR MULTI-CHIPLET FAN-OUT DEVICE FOR LAMINATE AND LEADFRA...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SYSTEM-IN PACKAGE COMPONENT, ELECTRONIC DEVICE, AND SYSTEM-IN PACKA...

SEMICONDUCTOR DEVICE

THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH TH...

INTEGRATED RADIO FREQUENCY POWERED LIGHT EMITTING DIODE CHIPS AND F...

Structure and Method of Forming a Joint Assembly

INTEGRATED PASSIVE DEVICES (IPD) HAVING A BASEBAND DAMPING RESISTOR...

SEMICONDUCTOR DEVICE AND MOUNTING STRUCTURE FOR SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE

RF DEVICE WITHOUT SILICON HANDLE SUBSTRATE FOR ENHANCED THERMAL AND...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING

SEMICONDUCTOR DEVICE

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE

INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCES...

Structure and Method of Forming a Joint Assembly

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

Voltage-Controlled Switching Device with Resistive Path

SEMICONDUCTOR DEVICE

OPOSSUM REDISTRIBUTION FRAME FOR CONFIGURABLE MEMORY DEVICES

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE UTILIZING MOLDED INTERPOSER

POWER SEMICONDUCTOR PACKAGE HAVING INTEGRATED INDUCTOR, RESISTOR AN...

Semiconductor Device and Method to Minimize Stress on Stack Via