Rhodium [Rh] as principal constituent

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H01L2224/13173

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13173Rhodium [Rh] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,302,663
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 11,164,836
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film scheme for bumping
- Patent number 10,658,318
- Issue date May 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Immersion interconnections for semiconductor devices and methods of...
- Patent number 10,229,901
- Issue date Mar 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,836,146
- Issue date Sep 16, 2014
- QUALCOMM Incorporated
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor chip structure
- Patent number 8,421,227
- Issue date Apr 16, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad on IC substrate and method for making the same
- Patent number 8,148,822
- Issue date Apr 3, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable width resilient conductive contact structures
- Patent number 7,435,108
- Issue date Oct 14, 2008
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 7,397,121
- Issue date Jul 8, 2008
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 7,174,629
- Issue date Feb 13, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 6,555,764
- Issue date Apr 29, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20240071990
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
- Publication number 20230005878
- Publication date Jan 5, 2023
- CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
- Feng ZHAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM SCHEME FOR BUMPING
- Publication number 20200243469
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yao-Wen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20170373050
- Publication date Dec 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical Interconnections of Semiconductor Devices and Methods fo...
- Publication number 20130313707
- Publication date Nov 28, 2013
- Samsung Electronics Co., Ltd.
- Ju-il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ASSEMBLIES AND METHODS
- Publication number 20090035959
- Publication date Feb 5, 2009
- FormFactor, Inc.
- Benjamin N. Eldridge
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20080265413
- Publication date Oct 30, 2008
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Regulator Integrated with Semiconductor Chip
- Publication number 20080150623
- Publication date Jun 26, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip structure
- Publication number 20080042280
- Publication date Feb 21, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20070205520
- Publication date Sep 6, 2007
- MEGICA CORPORATION
- Chien-Kang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip with post-passivation scheme formed over passiva...
- Publication number 20070096313
- Publication date May 3, 2007
- MEGIC Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD ON IC SUBSTRATE AND METHOD FOR MAKING THE SAME
- Publication number 20070023919
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit contactor, and method and apparatus for producti...
- Publication number 20030132027
- Publication date Jul 17, 2003
- FUJITSU LIMITED
- Shigeyuki Maruyama
- G01 - MEASURING TESTING

Rhodium [Rh] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Film scheme for bumping

Film scheme for bumping

Film scheme for bumping

Transfer substrate for forming metal wiring and method for forming...

Immersion interconnections for semiconductor devices and methods of...

Method for producing metal ball, joining material, and metal ball

Method for bonding wafers and structure of bonding part

Chip package and method for fabricating the same

Voltage regulator integrated with semiconductor chip

Semiconductor chip structure

Semiconductor chip with post-passivation scheme formed over passiva...

Bonding pad on IC substrate and method for making the same

Semiconductor chip with post-passivation scheme formed over passiva...

Variable width resilient conductive contact structures

Semiconductor chip with post-passivation scheme formed over passiva...

Integrated circuit contactor, and method and apparatus for producti...

Integrated circuit contactor, and method and apparatus for producti...

Patents Applicationslast 30 patents

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...

FILM SCHEME FOR BUMPING

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

Electrical Interconnections of Semiconductor Devices and Methods fo...

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

INTERCONNECT ASSEMBLIES AND METHODS

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

Voltage Regulator Integrated with Semiconductor Chip

Semiconductor chip structure

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor chip with post-passivation scheme formed over passiva...

BONDING PAD ON IC SUBSTRATE AND METHOD FOR MAKING THE SAME

Integrated circuit contactor, and method and apparatus for producti...