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Rhodium [Rh] as principal constituent
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H01L2224/13173
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/13173
Rhodium [Rh] as principal constituent
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Patents Grants
last 30 patents
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Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
Patent number
11,810,882
Issue date
Nov 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film scheme for bumping
Patent number
11,302,663
Issue date
Apr 12, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yao-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film scheme for bumping
Patent number
11,164,836
Issue date
Nov 2, 2021
Taiwan Semiconductor Manufacturing Company, Ltd
Yao-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Film scheme for bumping
Patent number
10,658,318
Issue date
May 19, 2020
Taiwan Semiconductor Manufacturing Co., Ltd.
Yao-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer substrate for forming metal wiring and method for forming...
Patent number
10,256,113
Issue date
Apr 9, 2019
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Immersion interconnections for semiconductor devices and methods of...
Patent number
10,229,901
Issue date
Mar 12, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing metal ball, joining material, and metal ball
Patent number
10,150,185
Issue date
Dec 11, 2018
Senju Metal Industry Co., Ltd.
Hiroyoshi Kawasaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for bonding wafers and structure of bonding part
Patent number
9,136,232
Issue date
Sep 15, 2015
Omron Corporation
Takeshi Fujiwara
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Chip package and method for fabricating the same
Patent number
8,836,146
Issue date
Sep 16, 2014
QUALCOMM Incorporated
Chien-Kang Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Voltage regulator integrated with semiconductor chip
Patent number
8,749,021
Issue date
Jun 10, 2014
Megit Acquisition Corp.
Mou-Shiung Lin
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Semiconductor chip structure
Patent number
8,421,227
Issue date
Apr 16, 2013
Megica Corporation
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
Patent number
8,319,354
Issue date
Nov 27, 2012
Megica Corporation
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding pad on IC substrate and method for making the same
Patent number
8,148,822
Issue date
Apr 3, 2012
Megica Corporation
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
Patent number
8,004,092
Issue date
Aug 23, 2011
Megica Corporation
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Variable width resilient conductive contact structures
Patent number
7,435,108
Issue date
Oct 14, 2008
FormFactor, Inc.
Benjamin N. Eldridge
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
Patent number
7,397,121
Issue date
Jul 8, 2008
Megica Corporation
Chiu-Ming Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
Patent number
7,174,629
Issue date
Feb 13, 2007
Fujitsu Limited
Shigeyuki Maruyama
G01 - MEASURING TESTING
Information
Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
Patent number
6,555,764
Issue date
Apr 29, 2003
Fujitsu Limited
Shigeyuki Maruyama
G01 - MEASURING TESTING
Patents Applications
last 30 patents
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20240071973
Publication date
Feb 29, 2024
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTENDED BOND PAD FOR SEMICONDUCTOR DEVICE ASSEMBLIES
Publication number
20240071990
Publication date
Feb 29, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
Publication number
20230282605
Publication date
Sep 7, 2023
Micron Technology, Inc.
Wei Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
Publication number
20230154885
Publication date
May 18, 2023
Samsung Electronics Co., LTD
Jinyoung Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Temporary Chip Assembly, Display Panel, and Manufacturing Methods o...
Publication number
20230005878
Publication date
Jan 5, 2023
CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD.
Feng ZHAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FILM SCHEME FOR BUMPING
Publication number
20200243469
Publication date
Jul 30, 2020
Taiwan Semiconductor Manufacturing Co., LTD
Yao-Wen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE THEREOF
Publication number
20170373050
Publication date
Dec 28, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Tung-Liang Shao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
Publication number
20140339710
Publication date
Nov 20, 2014
Takeshi Fujiwara
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
Publication number
20140262003
Publication date
Sep 18, 2014
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Electrical Interconnections of Semiconductor Devices and Methods fo...
Publication number
20130313707
Publication date
Nov 28, 2013
Samsung Electronics Co., Ltd.
Ju-il Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
Publication number
20130196504
Publication date
Aug 1, 2013
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
Publication number
20110266669
Publication date
Nov 3, 2011
MEGICA CORPORATION
Chiu-Ming Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECT ASSEMBLIES AND METHODS
Publication number
20090035959
Publication date
Feb 5, 2009
FormFactor, Inc.
Benjamin N. Eldridge
G01 - MEASURING TESTING
Information
Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
Publication number
20080265413
Publication date
Oct 30, 2008
MEGICA CORPORATION
Chiu-Ming Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Voltage Regulator Integrated with Semiconductor Chip
Publication number
20080150623
Publication date
Jun 26, 2008
MEGICA CORPORATION
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip structure
Publication number
20080042280
Publication date
Feb 21, 2008
MEGICA CORPORATION
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20070205520
Publication date
Sep 6, 2007
MEGICA CORPORATION
Chien-Kang Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor chip with post-passivation scheme formed over passiva...
Publication number
20070096313
Publication date
May 3, 2007
MEGIC Corporation
Chiu-Ming Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING PAD ON IC SUBSTRATE AND METHOD FOR MAKING THE SAME
Publication number
20070023919
Publication date
Feb 1, 2007
Mou-Shiung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit contactor, and method and apparatus for producti...
Publication number
20030132027
Publication date
Jul 17, 2003
FUJITSU LIMITED
Shigeyuki Maruyama
G01 - MEASURING TESTING