Rhodium (Rh) as principal constituent

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H01L2224/45173

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45173Rhodium (Rh) as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding wire for semiconductor device
- Patent number 11,373,934
- Issue date Jun 28, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,342,299
- Issue date May 24, 2022
- Nippon Micrometal Corporation
- Daizo Oda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,737,356
- Issue date Aug 11, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,610,976
- Issue date Apr 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,525,555
- Issue date Jan 7, 2020
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,414,002
- Issue date Sep 17, 2019
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silver bonding wire for semiconductor device containing indium, gal...
- Patent number 10,381,320
- Issue date Aug 13, 2019
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tetsuya Oyamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus
- Patent number 10,374,136
- Issue date Aug 6, 2019
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,137,534
- Issue date Nov 27, 2018
- Nippon Micrometal Corporation
- Takashi Yamada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 10,115,876
- Issue date Oct 30, 2018
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device mount, leadframe, and light emitting apparatus
- Patent number 9,583,688
- Issue date Feb 28, 2017
- Nichia Corporation
- Ryohei Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 9,117,550
- Issue date Aug 25, 2015
- Bao Q. Tran
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nano memory, light, energy, antenna and strand-based systems and me...
- Patent number 7,671,398
- Issue date Mar 2, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuitry component and method for forming the same
- Patent number 7,582,556
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with redistribution traces
- Patent number 7,425,767
- Issue date Sep 16, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
NANO IC packaging
- Patent number 7,375,417
- Issue date May 20, 2008
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Resilient contact structures formed and then attached to a substrate
- Patent number 7,225,538
- Issue date Jun 5, 2007
- FormFactor, Inc.
- Benjamin Niles Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 7,174,629
- Issue date Feb 13, 2007
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Contact structures and methods for making same
- Patent number 7,082,682
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical contact and connector and method of manufacture
- Patent number 7,029,288
- Issue date Apr 18, 2006
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Grant
NANO IC packaging
- Patent number 7,019,391
- Issue date Mar 28, 2006
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...
- Patent number 6,835,898
- Issue date Dec 28, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,818,840
- Issue date Nov 16, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit contactor, and method and apparatus for producti...
- Patent number 6,555,764
- Issue date Apr 29, 2003
- Fujitsu Limited
- Shigeyuki Maruyama
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,538,214
- Issue date Mar 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising a substrate and a plurality of sprin...
- Patent number 6,252,175
- Issue date Jun 26, 2001
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230148306
- Publication date May 11, 2023
- NIPPON MICROMETAL CORPORATION
- Motoki ETO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER BONDING WIRE
- Publication number 20230105851
- Publication date Apr 6, 2023
- NIPPON MICROMETAL CORPORATION
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20220108971
- Publication date Apr 7, 2022
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20200373226
- Publication date Nov 26, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS
- Publication number 20190027667
- Publication date Jan 24, 2019
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20180374816
- Publication date Dec 27, 2018
- Nippon Micrometal Corporation
- Daizo ODA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20180133843
- Publication date May 17, 2018
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170216974
- Publication date Aug 3, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170110430
- Publication date Apr 20, 2017
- NIPPON STEEL & SUMIKIN MATERIALS CO., LTD.
- Tetsuya OYAMADA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...
- Publication number 20140264426
- Publication date Sep 18, 2014
- Nichia Corporation.
- Ryohei YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
- Publication number 20120299175
- Publication date Nov 29, 2012
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...
- Publication number 20100155692
- Publication date Jun 24, 2010
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE
- Publication number 20090309115
- Publication date Dec 17, 2009
- Sanken Electric Co., Ltd
- Masanori HOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20090309224
- Publication date Dec 17, 2009
- MEGICA CORPPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH REDISTRIBUTION TRACES
- Publication number 20080012132
- Publication date Jan 17, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20060292851
- Publication date Dec 28, 2006
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post passivation structure for a semiconductor device and packaging...
- Publication number 20060291029
- Publication date Dec 28, 2006
- MEGIC Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures Comprising A Core Structure And An Overcoat
- Publication number 20060286828
- Publication date Dec 21, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANO IC
- Publication number 20060260674
- Publication date Nov 23, 2006
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Nano memory, light, energy, antenna and strand-based systems and me...
- Publication number 20060198209
- Publication date Sep 7, 2006
- Bao Q. Tran
- G11 - INFORMATION STORAGE
Information Patent Application
NANO IC packaging
- Publication number 20060145326
- Publication date Jul 6, 2006
- AVAILABLE FOR LICENSING
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Electrical contact and connector and method of manufacture
- Publication number 20060141814
- Publication date Jun 29, 2006
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Application
NANO IC packaging
- Publication number 20050230822
- Publication date Oct 20, 2005
- AvailableIP.com
- Bao Tran
- G11 - INFORMATION STORAGE
Information Patent Application
Electrical contact and connector and method of manufacture
- Publication number 20050048807
- Publication date Mar 3, 2005
- Che-Yu Li
- G01 - MEASURING TESTING
Information Patent Application
Contact structures and methods for making same
- Publication number 20050028363
- Publication date Feb 10, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Rhodium (Rh) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding wire for semiconductor device

Bonding wire for semiconductor devices

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Bonding wire for semiconductor device

Silver bonding wire for semiconductor device containing indium, gal...

Light emitting apparatus

Bonding wire for semiconductor device

Light emitting device mount, leadframe, and light emitting apparatus

Light emitting device mount, leadframe, and light emitting apparatus

Nano memory, light, energy, antenna and strand-based systems and me...

Apparatus with a multi-layer coating and method of forming the same

Post passivation structure for a semiconductor device and packaging...

Bonding wire for semiconductor device

Nano memory, light, energy, antenna and strand-based systems and me...

Circuitry component and method for forming the same

Post passivation structure for a semiconductor device and packaging...

Chip structure with redistribution traces

NANO IC packaging

Resilient contact structures formed and then attached to a substrate

Integrated circuit contactor, and method and apparatus for producti...

Contact structures and methods for making same

Electrical contact and connector and method of manufacture

NANO IC packaging

ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...

Method for manufacturing raised electrical contact pattern of contr...

Integrated circuit contactor, and method and apparatus for producti...

Method for manufacturing raised electrical contact pattern of contr...

Electronic assembly comprising a substrate and a plurality of sprin...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICES

COPPER BONDING WIRE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

LIGHT EMITTING APPARATUS

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

LIGHT EMITTING DEVICE MOUNT, LIGHT EMITTING APPARATUS INCLUDING THE...

SYSTEMS AND METHODS TO COOL SEMICONDUCTOR

Apparatus with a Multi-Layer Coating and Method of Forming the Same

BONDING WIRE FOR SEMICONDUCTOR DEVICE

NANO MEMORY, LIGHT, ENERGY, ANTENNA AND STRAND-BASED SYSTEMS AND ME...

SEMICONDUCTOR LIGHT EMITTING DEVICE

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...

CHIP STRUCTURE WITH REDISTRIBUTION TRACES

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

Post passivation structure for a semiconductor device and packaging...

Contact Structures Comprising A Core Structure And An Overcoat

NANO IC

Nano memory, light, energy, antenna and strand-based systems and me...

NANO IC packaging

Electrical contact and connector and method of manufacture

NANO IC packaging

Electrical contact and connector and method of manufacture

Contact structures and methods for making same