Rhodium [Rh] as principal constituent

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H01L2224/05673

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05673Rhodium [Rh] as principal constituent

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,735,699
- Issue date Aug 22, 2023
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,488,930
- Issue date Nov 1, 2022
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 11,257,996
- Issue date Feb 22, 2022
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 10,910,341
- Issue date Feb 2, 2021
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 10,522,727
- Issue date Dec 31, 2019
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronic device and method for producing an electronic device
- Patent number 10,147,696
- Issue date Dec 4, 2018
- Osram Opto Semiconductors GmbH
- Andreas Ploessl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting apparatus and method for producing the same
- Patent number 9,853,194
- Issue date Dec 26, 2017
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrode connection structure and electrode connection method
- Patent number 9,601,448
- Issue date Mar 21, 2017
- Waseda University
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging containing sintering die-attach material
- Patent number 9,583,453
- Issue date Feb 28, 2017
- Ormet Circuits, Inc.
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emmiting diode chip
- Patent number 9,490,409
- Issue date Nov 8, 2016
- Formosa Epitaxy Incorporation
- Chih-Hsuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 8,912,088
- Issue date Dec 16, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator integrated with semiconductor chip
- Patent number 8,749,021
- Issue date Jun 10, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Carbon nanotube circuit component structure
- Patent number 8,692,374
- Issue date Apr 8, 2014
- Megit Acquisition Corp.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus, method of manufacturing the same, and meth...
- Patent number 8,586,477
- Issue date Nov 19, 2013
- Samsung Electronics Co., Ltd.
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gold-tin etch using combination of halogen plasma and wet etch
- Patent number 8,513,120
- Issue date Aug 20, 2013
- Medtronic, Inc.
- Bruce C Fleischhauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method for preventing polymer cracking
- Patent number 8,344,524
- Issue date Jan 1, 2013
- Megica Corporation
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,319,354
- Issue date Nov 27, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and method for fabricating the same
- Patent number 8,168,527
- Issue date May 1, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure
- Patent number 8,159,074
- Issue date Apr 17, 2012
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with post-passivation scheme formed over passiva...
- Patent number 8,004,092
- Issue date Aug 23, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carbon nanotube circuit component structure
- Patent number 7,990,037
- Issue date Aug 2, 2011
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153900
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE
- Publication number 20240153902
- Publication date May 9, 2024
- NANYA TECHNOLOGY CORPORATION
- Sheng-Fu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...
- Publication number 20240014165
- Publication date Jan 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...
- Publication number 20230154885
- Publication date May 18, 2023
- Samsung Electronics Co., LTD
- Jinyoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20220140212
- Publication date May 5, 2022
- Nichia Corporation.
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20180069164
- Publication date Mar 8, 2018
- Nichia Corporation.
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20170365567
- Publication date Dec 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yun Bog KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
- Publication number 20140131898
- Publication date May 15, 2014
- Catherine Shearer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...
- Publication number 20130196504
- Publication date Aug 1, 2013
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...
- Publication number 20120028412
- Publication date Feb 2, 2012
- Se-young Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE
- Publication number 20110266680
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GOLD-TIN ETCH USING COMBINATION OF HALOGEN PLASMA AND WET ETCH
- Publication number 20110269311
- Publication date Nov 3, 2011
- Medtronic, Inc.
- Bruce C. Fleischhauer
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20110266669
- Publication date Nov 3, 2011
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110204510
- Publication date Aug 25, 2011
- MEGICA Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating highly compliant thermal bonds that withstand r...
- Publication number 20110114707
- Publication date May 19, 2011
- Santa Barbara Infrared
- Gregory P. Matis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME
- Publication number 20100320479
- Publication date Dec 23, 2010
- Nichia Corporation
- Shunsuke Minato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE
- Publication number 20100252855
- Publication date Oct 7, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING...
- Publication number 20100237382
- Publication date Sep 23, 2010
- Hidenori Kamei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME
- Publication number 20090291554
- Publication date Nov 26, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND LIGH...
- Publication number 20090224278
- Publication date Sep 10, 2009
- Matsushita Electric Industrial Co., Ltd.
- Hideo Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090108453
- Publication date Apr 30, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...
- Publication number 20080265413
- Publication date Oct 30, 2008
- MEGICA CORPORATION
- Chiu-Ming Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Voltage Regulator Integrated with Semiconductor Chip
- Publication number 20080150623
- Publication date Jun 26, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FABRICATION THE SAME
- Publication number 20080146018
- Publication date Jun 19, 2008
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION
- Publication number 20080067072
- Publication date Mar 20, 2008
- Semitool, Inc.
- Bioh Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Rhodium [Rh] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding process with inhibited oxide formation

Light emitting apparatus and method for producing the same

Protective surface layer on under bump metallurgy for solder joining

Bonding process with inhibited oxide formation

Light emitting apparatus and method for producing the same

Bonding process with inhibited oxide formation

Bump bonded cryogenic chip carrier

Bump bonded cryogenic chip carrier

Two-component bump metallization

Two-component bump metallization

Light emitting apparatus and method for producing the same

Transfer substrate for forming metal wiring and method for forming...

Electronic device and method for producing an electronic device

Light emitting apparatus and method for producing the same

Integrated circuit chip using top post-passivation technology and b...

Electrode connection structure and electrode connection method

Semiconductor packaging containing sintering die-attach material

Light emmiting diode chip

Transfer substrate for forming metal wiring and method for forming...

Voltage regulator integrated with semiconductor chip

Carbon nanotube circuit component structure

Semiconductor apparatus, method of manufacturing the same, and meth...

Gold-tin etch using combination of halogen plasma and wet etch

Metal pad or metal bump over pad exposed by passivation layer

Wire bonding method for preventing polymer cracking

Semiconductor chip with post-passivation scheme formed over passiva...

Semiconductor chip and method for fabricating the same

Chip structure

Semiconductor chip with post-passivation scheme formed over passiva...

Carbon nanotube circuit component structure

Patents Applicationslast 30 patents

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE INCLUDING A BONDING STRUCTURE

SEMICONDUCTOR DEVICE WITH FIXING FEATURE ON WHICH BONDING WIRE IS D...

SEMICONDUCTOR PACKAGE INCLUDING UNDERFILL AND METHOD OF FORMING THE...

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

BUMP BONDED CRYOGENIC CHIP CARRIER

BUMP BONDED CRYOGENIC CHIP CARRIER

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL

TRANSFER SUBSTRATE FOR FORMING METAL WIRING AND METHOD FOR FORMING...

SEMICONDUCTOR APPARATUS, METHOD OF MANUFACTURING THE SAME, AND METH...

CARBON NANOTUBE CIRCUIT COMPONENT STRUCTURE

GOLD-TIN ETCH USING COMBINATION OF HALOGEN PLASMA AND WET ETCH

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

CHIP STRUCTURE AND METHOD FOR FABRICATING THE SAME

Method for creating highly compliant thermal bonds that withstand r...

LIGHT EMITTING APPARATUS AND METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR LIGHT-EMITTING DEVICE

SEMICONDUCTOR LIGHT EMITTING ELEMENT, SEMICONDUCTOR LIGHT EMITTING...

SEMICONDUCTOR CHIP AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHT-EMITTING MODULE AND LIGH...

CHIP STRUCTURE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR CHIP WITH POST-PASSIVATION SCHEME FORMED OVER PASSIVA...

Voltage Regulator Integrated with Semiconductor Chip

CHIP STRUCTURE AND METHOD FOR FABRICATION THE SAME

METHOD AND SYSTEM FOR DEPOSITING ALLOY COMPOSITION