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H01L2924/01045
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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H01L2924/01045
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Patents Grants
last 30 patents
Information
Patent Grant
Protective surface layer on under bump metallurgy for solder joining
Patent number
11,682,640
Issue date
Jun 20, 2023
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
Patent number
11,380,641
Issue date
Jul 5, 2022
International Business Machines Corporation
Joseph F. Maniscalco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar integrated circuit package interconnects
Patent number
11,276,630
Issue date
Mar 15, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Designs and methods for conductive bumps
Patent number
11,201,129
Issue date
Dec 14, 2021
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coated wire
Patent number
10,960,498
Issue date
Mar 30, 2021
Heraeus Materials Singapore Pte., Ltd.
Il Tae Kang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal bonding pads for packaging applications
Patent number
10,825,792
Issue date
Nov 3, 2020
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device
Patent number
10,818,620
Issue date
Oct 27, 2020
Renesas Electronics Corporation
Hiromi Shigihara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar integrated circuit package interconnects
Patent number
10,651,116
Issue date
May 12, 2020
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bonding pads for packaging applications
Patent number
10,381,323
Issue date
Aug 13, 2019
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transfer substrate for forming metal wiring and method for forming...
Patent number
10,256,113
Issue date
Apr 9, 2019
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Designs and methods for conductive bumps
Patent number
10,249,588
Issue date
Apr 2, 2019
Intel Corporation
Valery M. Dubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device and method for manufacturing light emitting d...
Patent number
10,230,034
Issue date
Mar 12, 2019
Nichia Corporation
Motokazu Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having polyimide layer
Patent number
10,211,143
Issue date
Feb 19, 2019
Intel Corporation
Ravindra V. Tanikella
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Method of filling probe indentations in contact pads
Patent number
10,186,463
Issue date
Jan 22, 2019
STMicroelectronics S.r.l.
Alberto Pagani
G01 - MEASURING TESTING
Information
Patent Grant
Electronic component
Patent number
10,186,494
Issue date
Jan 22, 2019
E I du Pont de Nemours and Company
Akira Inaba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,163,850
Issue date
Dec 25, 2018
Rohm Co., Ltd.
Motoharu Haga
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding wire for semiconductor device
Patent number
10,032,741
Issue date
Jul 24, 2018
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal bonding pads for packaging applications
Patent number
10,020,281
Issue date
Jul 10, 2018
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive sheet for semiconductor, and dicing tape integrated adhesi...
Patent number
9,969,909
Issue date
May 15, 2018
Hitachi Chemical Company, Ltd.
Masaki Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
Patent number
9,966,517
Issue date
May 8, 2018
Dai Nippon Printing Co., Ltd.
Kazunori Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D bonded semiconductor structure with an embedded capacitor
Patent number
9,947,655
Issue date
Apr 17, 2018
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device and method for manufacturing light emitting d...
Patent number
9,887,329
Issue date
Feb 6, 2018
Nichia Corporation
Motokazu Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
Patent number
9,887,331
Issue date
Feb 6, 2018
Dai Nippon Printing Co., Ltd.
Kazunori Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with conductive clip
Patent number
9,799,623
Issue date
Oct 24, 2017
Infineon Technologies Americas Corp.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,780,069
Issue date
Oct 3, 2017
Rohm Co., Ltd.
Motoharu Haga
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Film for semiconductor device production, method for producing film...
Patent number
9,761,475
Issue date
Sep 12, 2017
Nitto Denko Corporation
Naohide Takamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
Patent number
9,735,076
Issue date
Aug 15, 2017
Samsung SDI Co., Ltd.
Yoon Man Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D bonded semiconductor structure with an embedded capacitor
Patent number
9,716,088
Issue date
Jul 25, 2017
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit chip using top post-passivation technology and b...
Patent number
9,612,615
Issue date
Apr 4, 2017
QUALCOMM Incorporated
Mou-Shiung Lin
G11 - INFORMATION STORAGE
Information
Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
Patent number
9,562,179
Issue date
Feb 7, 2017
Lintec Corporation
Naoya Saiki
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230018430
Publication date
Jan 19, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
Publication number
20220165691
Publication date
May 26, 2022
International Business Machines Corporation
Mukta Ghate Farooq
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
Publication number
20220139858
Publication date
May 5, 2022
International Business Machines Corporation
Joseph F. Maniscalco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
Publication number
20220059484
Publication date
Feb 24, 2022
Intel Corporation
Valery M. DUBIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20200312808
Publication date
Oct 1, 2020
NIPPON MICROMETAL CORPORATION
Daizo ODA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20190304948
Publication date
Oct 3, 2019
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
Publication number
20190198472
Publication date
Jun 27, 2019
Intel Corporation
Valery M. DUBIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COATED WIRE
Publication number
20180345421
Publication date
Dec 6, 2018
HERAEUS MATERIALS SINGAPORE PTE., LTD.
Il Tae Kang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20180269177
Publication date
Sep 20, 2018
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
Publication number
20180123006
Publication date
May 3, 2018
Nichia Corporation.
Motokazu YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
Publication number
20180061804
Publication date
Mar 1, 2018
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
Publication number
20180012859
Publication date
Jan 11, 2018
Infineon Technologies Americas Corp.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
Publication number
20180005928
Publication date
Jan 4, 2018
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR
Publication number
20180006022
Publication date
Jan 4, 2018
International Business Machines Corporation
Daniel C. Edelstein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20180005981
Publication date
Jan 4, 2018
Rohm Co., Ltd.
Motoharu HAGA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
Publication number
20170323864
Publication date
Nov 9, 2017
Nippon Micrometal Corporation
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT
Publication number
20170309591
Publication date
Oct 26, 2017
E I DU PONT DE NEMOURS AND COMPANY
AKIRA INABA
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
Publication number
20160351461
Publication date
Dec 1, 2016
Samsung SDI Co., Ltd.
Yoon Man LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENT
Publication number
20160276303
Publication date
Sep 22, 2016
E I DU PONT DE NEMOURS AND COMPANY
AKIRA INABA
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information
Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
Publication number
20140312101
Publication date
Oct 23, 2014
RAVINDRA V. TANIKELLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
Publication number
20140262003
Publication date
Sep 18, 2014
Tanaka Kikinzoku Kogyo K.K.
Toshinori Ogashiwa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Insulating Resin Film, Bonded Structure Using Insulating Resin Film...
Publication number
20140251537
Publication date
Sep 11, 2014
DEXERIALS CORPORATION
Daisuke SATO
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH
Publication number
20140239458
Publication date
Aug 28, 2014
International Business Machines Corporation
Mukta G. Farooq
B32 - LAYERED PRODUCTS
Information
Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
Publication number
20140175677
Publication date
Jun 26, 2014
Nitto Denko Corporation
Naohide TAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20140141550
Publication date
May 22, 2014
Nichia Corporation.
Masafumi KURAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
Publication number
20140110740
Publication date
Apr 24, 2014
Nichia Corporation.
Masafumi KURAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DICING DIE BOND FILM
Publication number
20140057100
Publication date
Feb 27, 2014
Nitto Denko Corporation
Yasuhiro Amano
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
Publication number
20140048940
Publication date
Feb 20, 2014
INFINEON TECHNOLOGIES AG
Roland Hampp
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20140035115
Publication date
Feb 6, 2014
SUMITOMO BAKELITE CO., LTD.
Shin-ichi Zenbutsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
Publication number
20130324641
Publication date
Dec 5, 2013
SUMITOMO BAKELITE CO., LTD.
Kenzou MAEJIMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...