Rhodium [Rh]

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CPC
H01L2924/01045

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01045Rhodium [Rh]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 10,651,116
- Issue date May 12, 2020
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 10,230,034
- Issue date Mar 12, 2019
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having polyimide layer
- Patent number 10,211,143
- Issue date Feb 19, 2019
- Intel Corporation
- Ravindra V. Tanikella
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method of filling probe indentations in contact pads
- Patent number 10,186,463
- Issue date Jan 22, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component
- Patent number 10,186,494
- Issue date Jan 22, 2019
- E I du Pont de Nemours and Company
- Akira Inaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,163,850
- Issue date Dec 25, 2018
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 10,032,741
- Issue date Jul 24, 2018
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive sheet for semiconductor, and dicing tape integrated adhesi...
- Patent number 9,969,909
- Issue date May 15, 2018
- Hitachi Chemical Company, Ltd.
- Masaki Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,966,517
- Issue date May 8, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bonded semiconductor structure with an embedded capacitor
- Patent number 9,947,655
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method for manufacturing light emitting d...
- Patent number 9,887,329
- Issue date Feb 6, 2018
- Nichia Corporation
- Motokazu Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED leadframe or LED substrate, semiconductor device, and method fo...
- Patent number 9,887,331
- Issue date Feb 6, 2018
- Dai Nippon Printing Co., Ltd.
- Kazunori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with conductive clip
- Patent number 9,799,623
- Issue date Oct 24, 2017
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,780,069
- Issue date Oct 3, 2017
- Rohm Co., Ltd.
- Motoharu Haga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film for semiconductor device production, method for producing film...
- Patent number 9,761,475
- Issue date Sep 12, 2017
- Nitto Denko Corporation
- Naohide Takamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bonded semiconductor structure with an embedded capacitor
- Patent number 9,716,088
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,562,179
- Issue date Feb 7, 2017
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20230018430
- Publication date Jan 19, 2023
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
- Publication number 20220139858
- Publication date May 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20200312808
- Publication date Oct 1, 2020
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE
- Publication number 20180345421
- Publication date Dec 6, 2018
- HERAEUS MATERIALS SINGAPORE PTE., LTD.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...
- Publication number 20180123006
- Publication date May 3, 2018
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
- Publication number 20180012859
- Publication date Jan 11, 2018
- Infineon Technologies Americas Corp.
- Martin Standing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20180005928
- Publication date Jan 4, 2018
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR
- Publication number 20180006022
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180005981
- Publication date Jan 4, 2018
- Rohm Co., Ltd.
- Motoharu HAGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20170323864
- Publication date Nov 9, 2017
- Nippon Micrometal Corporation
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170309591
- Publication date Oct 26, 2017
- E I DU PONT DE NEMOURS AND COMPANY
- AKIRA INABA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20160276303
- Publication date Sep 22, 2016
- E I DU PONT DE NEMOURS AND COMPANY
- AKIRA INABA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING
- Publication number 20140312101
- Publication date Oct 23, 2014
- RAVINDRA V. TANIKELLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...
- Publication number 20140262003
- Publication date Sep 18, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulating Resin Film, Bonded Structure Using Insulating Resin Film...
- Publication number 20140251537
- Publication date Sep 11, 2014
- DEXERIALS CORPORATION
- Daisuke SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH
- Publication number 20140239458
- Publication date Aug 28, 2014
- International Business Machines Corporation
- Mukta G. Farooq
- B32 - LAYERED PRODUCTS
Information Patent Application
DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE
- Publication number 20140175677
- Publication date Jun 26, 2014
- Nitto Denko Corporation
- Naohide TAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140141550
- Publication date May 22, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR
- Publication number 20140110740
- Publication date Apr 24, 2014
- Nichia Corporation.
- Masafumi KURAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE BOND FILM
- Publication number 20140057100
- Publication date Feb 27, 2014
- Nitto Denko Corporation
- Yasuhiro Amano
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Conductive Lines and Pads and Method of Manufacturing Thereof
- Publication number 20140048940
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Roland Hampp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140035115
- Publication date Feb 6, 2014
- SUMITOMO BAKELITE CO., LTD.
- Shin-ichi Zenbutsu
- H01 - BASIC ELECTRIC ELEMENTS

Rhodium [Rh]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Protective surface layer on under bump metallurgy for solder joining

Pillar bump with noble metal seed layer for advanced heterogeneous...

Planar integrated circuit package interconnects

Designs and methods for conductive bumps

Coated wire

Metal bonding pads for packaging applications

Semiconductor integrated circuit device

Planar integrated circuit package interconnects

Metal bonding pads for packaging applications

Transfer substrate for forming metal wiring and method for forming...

Designs and methods for conductive bumps

Light emitting device and method for manufacturing light emitting d...

Semiconductor device having polyimide layer

Method of filling probe indentations in contact pads

Electronic component

Semiconductor device

Bonding wire for semiconductor device

Metal bonding pads for packaging applications

Adhesive sheet for semiconductor, and dicing tape integrated adhesi...

LED leadframe or LED substrate, semiconductor device, and method fo...

3D bonded semiconductor structure with an embedded capacitor

Light emitting device and method for manufacturing light emitting d...

LED leadframe or LED substrate, semiconductor device, and method fo...

Semiconductor package with conductive clip

Semiconductor device

Film for semiconductor device production, method for producing film...

Epoxy resin composition for encapsulating semiconductor device and...

3D bonded semiconductor structure with an embedded capacitor

Integrated circuit chip using top post-passivation technology and b...

Adhesive composition, adhesive sheet and production process for sem...

Patents Applicationslast 30 patents

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES

METAL BONDING PADS FOR PACKAGING APPLICATIONS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

COATED WIRE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LIGHT EMITTING D...

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR

SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICE

ELECTRONIC COMPONENT

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

ELECTRONIC COMPONENT

MATERIALS, STRUCTURES AND METHODS FOR MICROELECTRONIC PACKAGING

TRANSFER SUBSTRATE FOR FORMING METAL WIRING LINE AND METHOD FOR FOR...

Insulating Resin Film, Bonded Structure Using Insulating Resin Film...

BONDED STRUCTURE WITH ENHANCED ADHESION STRENGTH

DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR

DICING DIE BOND FILM

Conductive Lines and Pads and Method of Manufacturing Thereof

SEMICONDUCTOR DEVICE