Ruthenium (Ru) as principal constituent

Industry

CPC
H01L2224/45176

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45176Ruthenium (Ru) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Segmented bond pads and methods of fabrication thereof
- Patent number 9,543,260
- Issue date Jan 10, 2017
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 8,558,383
- Issue date Oct 15, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor device
- Patent number 7,952,028
- Issue date May 31, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuitry component and method for forming the same
- Patent number 7,582,556
- Issue date Sep 1, 2009
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation structure for a semiconductor device and packaging...
- Patent number 7,468,545
- Issue date Dec 23, 2008
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resilient contact structures formed and then attached to a substrate
- Patent number 7,225,538
- Issue date Jun 5, 2007
- FormFactor, Inc.
- Benjamin Niles Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structures and methods for making same
- Patent number 7,082,682
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...
- Patent number 6,835,898
- Issue date Dec 28, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,818,840
- Issue date Nov 16, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,538,214
- Issue date Mar 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising a substrate and a plurality of sprin...
- Patent number 6,252,175
- Issue date Jun 26, 2001
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,215,670
- Issue date Apr 10, 2001
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting free-standing resilient electrical contact struc...
- Patent number 6,049,976
- Issue date Apr 18, 2000
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making raised contacts on electronic components
- Patent number 5,852,871
- Issue date Dec 29, 1998
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electrical contacts, using a sacrificial me...
- Patent number 5,476,211
- Issue date Dec 19, 1995
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICE
- Publication number 20100282495
- Publication date Nov 11, 2010
- NIPPON STEEL MATERIALS CO., LTD
- Tomohiro Uno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20090309224
- Publication date Dec 17, 2009
- MEGICA CORPPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...
- Publication number 20090057895
- Publication date Mar 5, 2009
- MEGICA CORPORATION
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME
- Publication number 20060292851
- Publication date Dec 28, 2006
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post passivation structure for a semiconductor device and packaging...
- Publication number 20060291029
- Publication date Dec 28, 2006
- MEGIC Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures Comprising A Core Structure And An Overcoat
- Publication number 20060286828
- Publication date Dec 21, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact structures and methods for making same
- Publication number 20050028363
- Publication date Feb 10, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing raised electrical contact pattern of contr...
- Publication number 20030062398
- Publication date Apr 3, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Resilient contact structures formed and then attached to a substrate
- Publication number 20020117330
- Publication date Aug 29, 2002
- FormFactor, Inc.
- Benjamin Niles Eldridge
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing raised electrical contact patten of contro...
- Publication number 20020023773
- Publication date Feb 28, 2002
- FormFactor, Inc.
- Igor Yan Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrical contact structures formed by configuring a flexible wire...
- Publication number 20010020546
- Publication date Sep 13, 2001
- FormFactor, Inc.
- Benjamin N. Eldridge
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Ruthenium (Ru) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Segmented bond pads and methods of fabrication thereof

Post passivation structure for a semiconductor device and packaging...

Bonding wire for semiconductor device

Circuitry component and method for forming the same

Post passivation structure for a semiconductor device and packaging...

Resilient contact structures formed and then attached to a substrate

Contact structures and methods for making same

ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...

Method for manufacturing raised electrical contact pattern of contr...

Method for manufacturing raised electrical contact pattern of contr...

Electronic assembly comprising a substrate and a plurality of sprin...

Method for manufacturing raised electrical contact pattern of contr...

Method of mounting free-standing resilient electrical contact struc...

Method of making raised contacts on electronic components

Method of manufacturing electrical contacts, using a sacrificial me...

Patents Applicationslast 30 patents

BONDING WIRE FOR SEMICONDUCTOR DEVICE

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

POST PASSIVATION STRUCTURE FOR A SEMICONDUCTOR DEVICE AND PACKAGING...

CIRCUITRY COMPONENT AND METHOD FOR FORMING THE SAME

Post passivation structure for a semiconductor device and packaging...

Contact Structures Comprising A Core Structure And An Overcoat

Contact structures and methods for making same

Method for manufacturing raised electrical contact pattern of contr...

Resilient contact structures formed and then attached to a substrate

Method for manufacturing raised electrical contact patten of contro...

Electrical contact structures formed by configuring a flexible wire...