Ruthenium [Ru]

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H01L2924/01044

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/01044Ruthenium [Ru]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Methods of forming stacked integrated circuits using selective ther...
- Patent number 12,027,488
- Issue date Jul 2, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with slanted conductive...
- Patent number 11,935,850
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,810,881
- Issue date Nov 7, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective surface layer on under bump metallurgy for solder joining
- Patent number 11,682,640
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 11,569,185
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,545,454
- Issue date Jan 3, 2023
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanted conductive layers and method for...
- Patent number 11,398,441
- Issue date Jul 26, 2022
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar bump with noble metal seed layer for advanced heterogeneous...
- Patent number 11,380,641
- Issue date Jul 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 11,201,129
- Issue date Dec 14, 2021
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,011,489
- Issue date May 18, 2021
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated wire
- Patent number 10,960,498
- Issue date Mar 30, 2021
- Heraeus Materials Singapore Pte., Ltd.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible hermetic membranes with electrically conducting vias
- Patent number 10,857,368
- Issue date Dec 8, 2020
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Seed layers for copper interconnects
- Patent number 10,847,463
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,825,792
- Issue date Nov 3, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,651,144
- Issue date May 12, 2020
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching solution for copper or copper alloy
- Patent number 10,570,522
- Issue date Feb 25, 2020
- Entegris, Inc.
- Yutaka Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 10,461,053
- Issue date Oct 29, 2019
- Renesas Electronics Corporation
- Shinya Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,453,816
- Issue date Oct 22, 2019
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,381,323
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer substrate for forming metal wiring and method for forming...
- Patent number 10,256,113
- Issue date Apr 9, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Toshinori Ogashiwa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 10,249,588
- Issue date Apr 2, 2019
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposers, semiconductor devices, method for manufacturing interp...
- Patent number 10,056,322
- Issue date Aug 21, 2018
- Toppan Printing Co., Ltd.
- Koji Imayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bonding pads for packaging applications
- Patent number 10,020,281
- Issue date Jul 10, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bonded semiconductor structure with an embedded capacitor
- Patent number 9,947,655
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy resin composition for encapsulating semiconductor device and...
- Patent number 9,735,076
- Issue date Aug 15, 2017
- Samsung SDI Co., Ltd.
- Yoon Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D bonded semiconductor structure with an embedded capacitor
- Patent number 9,716,088
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,659,926
- Issue date May 23, 2017
- Renesas Electronics Corporation
- Shinya Suzuki
- G02 - OPTICS
Information Patent Grant
Integrated circuit chip using top post-passivation technology and b...
- Patent number 9,612,615
- Issue date Apr 4, 2017
- QUALCOMM Incorporated
- Mou-Shiung Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Designs and methods for conductive bumps
- Patent number 9,543,261
- Issue date Jan 10, 2017
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor structure element and method for producing a conductor st...
- Patent number 9,456,500
- Issue date Sep 27, 2016
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20240347502
- Publication date Oct 17, 2024
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...
- Publication number 20240321804
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Dowan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240014159
- Publication date Jan 11, 2024
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230102799
- Publication date Mar 30, 2023
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING
- Publication number 20220165691
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...
- Publication number 20220139858
- Publication date May 5, 2022
- International Business Machines Corporation
- Joseph F. Maniscalco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220122930
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...
- Publication number 20220093545
- Publication date Mar 24, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...
- Publication number 20220084967
- Publication date Mar 17, 2022
- NANYA TECHNOLOGY CORPORATION
- KUO-HUI SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...
- Publication number 20220077104
- Publication date Mar 10, 2022
- The Regents of the University of California
- Mike Breeden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20220059484
- Publication date Feb 24, 2022
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233882
- Publication date Jul 29, 2021
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200235064
- Publication date Jul 23, 2020
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190393177
- Publication date Dec 26, 2019
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20190304948
- Publication date Oct 3, 2019
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
- Publication number 20190198472
- Publication date Jun 27, 2019
- Intel Corporation
- Valery M. DUBIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190027455
- Publication date Jan 24, 2019
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED WIRE
- Publication number 20180345421
- Publication date Dec 6, 2018
- HERAEUS MATERIALS SINGAPORE PTE., LTD.
- Il Tae Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS
- Publication number 20180272137
- Publication date Sep 27, 2018
- Greatbatch Ltd.
- Keith W. Seitz
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180269177
- Publication date Sep 20, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180090461
- Publication date Mar 29, 2018
- Rohm Co., Ltd.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING PADS FOR PACKAGING APPLICATIONS
- Publication number 20180061804
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR
- Publication number 20180006022
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20170133307
- Publication date May 11, 2017
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20160351473
- Publication date Dec 1, 2016
- Kabushiki Kaisha Toshiba
- Kengo UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...
- Publication number 20160351461
- Publication date Dec 1, 2016
- Samsung SDI Co., Ltd.
- Yoon Man LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160315078
- Publication date Oct 27, 2016
- RENESAS ELECTRONICS CORPORATION
- SHINYA SUZUKI
- G02 - OPTICS
Information Patent Application
Bond Pad Having Ruthenium Covering Passivation Sidewall
- Publication number 20160148883
- Publication date May 26, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Brian ZINN
- H01 - BASIC ELECTRIC ELEMENTS

Ruthenium [Ru]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming stacked integrated circuits using selective ther...

Method for fabricating semiconductor device with slanted conductive...

Semiconductor device

Protective surface layer on under bump metallurgy for solder joining

Semiconductor device and method of forming the same

Semiconductor device

Semiconductor device with slanted conductive layers and method for...

Pillar bump with noble metal seed layer for advanced heterogeneous...

Designs and methods for conductive bumps

Semiconductor device

Coated wire

Flexible hermetic membranes with electrically conducting vias

Seed layers for copper interconnects

Metal bonding pads for packaging applications

Semiconductor device

Etching solution for copper or copper alloy

Semiconductor device

Semiconductor device

Metal bonding pads for packaging applications

Transfer substrate for forming metal wiring and method for forming...

Designs and methods for conductive bumps

Interposers, semiconductor devices, method for manufacturing interp...

Metal bonding pads for packaging applications

3D bonded semiconductor structure with an embedded capacitor

Epoxy resin composition for encapsulating semiconductor device and...

3D bonded semiconductor structure with an embedded capacitor

Semiconductor device

Integrated circuit chip using top post-passivation technology and b...

Designs and methods for conductive bumps

Conductor structure element and method for producing a conductor st...

Patents Applicationslast 30 patents

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION STRUCTURE AND METHOD...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROTECTIVE SURFACE LAYER ON UNDER BUMP METALLURGY FOR SOLDER JOINING

PILLAR BUMP WITH NOBLE METAL SEED LAYER FOR ADVANCED HETEROGENEOUS...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE...

SEMICONDUCTOR DEVICE WITH SLANTED CONDUCTIVE LAYERS AND METHOD FOR...

METHODS OF FORMING STACKED INTEGRATED CIRCUITS USING SELECTIVE THER...

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

SEMICONDUCTOR DEVICE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

DESIGNS AND METHODS FOR CONDUCTIVE BUMPS

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

SEMICONDUCTOR DEVICE

COATED WIRE

FLEXIBLE HERMETIC MEMBRANES WITH ELECTRICALLY CONDUCTING VIAS

METAL BONDING PADS FOR PACKAGING APPLICATIONS

SEMICONDUCTOR DEVICE

METAL BONDING PADS FOR PACKAGING APPLICATIONS

3D BONDED SEMICONDUCTOR STRUCTURE WITH AN EMBEDDED CAPACITOR

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND...

SEMICONDUCTOR DEVICE

Bond Pad Having Ruthenium Covering Passivation Sidewall