Sacrificial means

Industry

CPC
H05K2203/308

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/308Sacrificial means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 12,150,254
- Issue date Nov 19, 2024
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring circuit board assembly sheet
- Patent number 12,120,829
- Issue date Oct 15, 2024
- Nitto Denko Corporation
- Shusaku Shibata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a packaged circuit structure
- Patent number 11,683,888
- Issue date Jun 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co, Ltd.
- Chun-Chieh Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate
- Patent number 11,375,611
- Issue date Jun 28, 2022
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible printed circuit board
- Patent number 11,140,785
- Issue date Oct 5, 2021
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Xian-Qin Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed, flexible integrated circuits and methods for making hig...
- Patent number 11,109,486
- Issue date Aug 31, 2021
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor device having printed circuit board substrate with built-in...
- Patent number 11,089,688
- Issue date Aug 10, 2021
- TT ELECTRONICS PLC
- Brent Hans Larson
- G01 - MEASURING TESTING
Information Patent Grant
Printable 3D electronic structure
- Patent number 11,064,609
- Issue date Jul 13, 2021
- X Display Company Technology Limited
- Ronald S. Cok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,952,332
- Issue date Mar 16, 2021
- Second Sight Medical Products, Inc.
- Jerry Ok
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board assembly
- Patent number 10,856,419
- Issue date Dec 1, 2020
- ZF Friedrichshafen AG
- Josef Loibl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dummy core restrict resin process and structure
- Patent number 10,772,220
- Issue date Sep 8, 2020
- Multek Technologies Limited
- J L Zhou
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a laminate structure having a plated through-hole...
- Patent number 10,757,819
- Issue date Aug 25, 2020
- Sanmina Corporation
- Shinichi Iketani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Component-embedded substrate, method of manufacturing the same, and...
- Patent number 10,707,172
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Hiroshi Somada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing flexible printed circuit boards
- Patent number 10,617,012
- Issue date Apr 7, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas Zluc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing flexible electronic circuits having conform...
- Patent number 10,595,417
- Issue date Mar 17, 2020
- VERILY LIFE SCIENCES LLC
- Brian Marc Pepin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing coil component
- Patent number 10,515,758
- Issue date Dec 24, 2019
- Murata Manufacturing Co., Ltd.
- Akinori Hamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible conductive track arrangement and manufacturing method
- Patent number 10,492,701
- Issue date Dec 3, 2019
- Koninklijke Philips N.V.
- Franciscus Theodorus Agricola
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,486,965
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stretchable electronic assembly
- Patent number 10,477,688
- Issue date Nov 12, 2019
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,442,687
- Issue date Oct 15, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Polymer frame for a chip, such that the frame comprises at least on...
- Patent number 10,446,335
- Issue date Oct 15, 2019
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated electronic components and methods of formation thereof
- Patent number 10,431,521
- Issue date Oct 1, 2019
- Cubic Corporation
- Jean-Marc Rollin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Wiring board desmear treatment method
- Patent number 10,420,221
- Issue date Sep 17, 2019
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,407,302
- Issue date Sep 10, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 10,398,038
- Issue date Aug 27, 2019
- Ibiden Co., Ltd.
- Kazuki Kajihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for providing hermetic electrical feedthrough
- Patent number 10,390,441
- Issue date Aug 20, 2019
- Second Sight Medical Products, Inc.
- Jerry Ok
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming an interference shield on a substrate
- Patent number 10,375,832
- Issue date Aug 6, 2019
- Intel Corporation
- Digvijay A. Raorane
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,364,146
- Issue date Jul 30, 2019
- Qorvo US, Inc.
- Jan Edward Vandemeer
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230232527
- Publication date Jul 20, 2023
- Murata Manufacturing Co., Ltd.
- Tadashi NOMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED CIRCUIT STRUCTURE
- Publication number 20230232537
- Publication date Jul 20, 2023
- Leading Interconnect Semiconductor Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Magnetic Element and a Manufacturing Method
- Publication number 20220377896
- Publication date Nov 24, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Ivan SALKOVIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20220330432
- Publication date Oct 13, 2022
- IBIDEN CO., LTD.
- Hirotaka TANIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220240385
- Publication date Jul 28, 2022
- Qi Ding Technology Qinhuangdao Co., Ltd.
- CHUN-CHIEH HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...
- Publication number 20210014980
- Publication date Jan 14, 2021
- Sanmina Corporation
- Shinichi Iketani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200305289
- Publication date Sep 24, 2020
- PHOENIX & CORPORATION
- Chun-Hsien Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RECIPROCAL PCB MANUFACTURING PROCESS
- Publication number 20200120808
- Publication date Apr 16, 2020
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20200113064
- Publication date Apr 9, 2020
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- XIAN-QIN HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIG...
- Publication number 20200084891
- Publication date Mar 12, 2020
- Wisconsin Alumni Research Foundation
- Zhenqiang Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20190394874
- Publication date Dec 26, 2019
- Murata Manufacturing Co., Ltd.
- Masaaki Hanao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...
- Publication number 20180146559
- Publication date May 24, 2018
- Bridge Semiconductor Corporation
- Charles W.C. LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE
- Publication number 20180092215
- Publication date Mar 29, 2018
- Omron Corporation
- Wakahiro KAWAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
- Publication number 20180082923
- Publication date Mar 22, 2018
- Nuvotronics, INC
- Jean-Marc Rollin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Ceramic Substrates with Via Studs
- Publication number 20170338127
- Publication date Nov 23, 2017
- Ananda H. Kumar
- G01 - MEASURING TESTING
Information Patent Application
Methods of Manufacturing Flexible Electronic Devices
- Publication number 20170231098
- Publication date Aug 10, 2017
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Andreas ZLUC
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Assembly With Air Dielectric
- Publication number 20170034904
- Publication date Feb 2, 2017
- Massachusetts Institute of Technology
- Glenn A. Brigham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Circuit Board
- Publication number 20160353566
- Publication date Dec 1, 2016
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gregor LANGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...
- Publication number 20150282395
- Publication date Oct 1, 2015
- Digvijay A. RAORANE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING TOUCH PANEL
- Publication number 20150181715
- Publication date Jun 25, 2015
- HON HAI PRECISION INDUSTRY CO., LTD.
- TEN-HSING JAW
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140353007
- Publication date Dec 4, 2014
- Nitto Denko Corporation
- Kouji ICHINOSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140220257
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING A SUBSTRATE
- Publication number 20140216677
- Publication date Aug 7, 2014
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- B82 - NANO-TECHNOLOGY
Information Patent Application
PROCESS FOR THE PRODUCTION OF A PLUG AND A PLUG
- Publication number 20140162500
- Publication date Jun 12, 2014
- SENNHEISER ELECTRONIC GMBH & CO. KG
- Lars Heine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING AND INKJET...
- Publication number 20140141155
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Yong-wan JIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS FOR LIQUID TRANSER COATING OF THREE-DIMENSIONAL SUBSTRATES
- Publication number 20140127834
- Publication date May 8, 2014
- SOLEXEL, INC.
- David Xuan-Qi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140124474
- Publication date May 8, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Sun You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED ARCHITECTURE USING RESIN COATED COPPER
- Publication number 20140090879
- Publication date Apr 3, 2014
- Dilan SENEVIRATNE
- H01 - BASIC ELECTRIC ELEMENTS

Sacrificial means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming a laminate structure having a plated through-hole...

Wiring circuit board assembly sheet

Reciprocal PCB manufacturing process

Structure for embedding and packaging multiple devices by layer and...

Method for manufacturing a packaged circuit structure

Multilayer substrate

Flexible printed circuit board

High-speed, flexible integrated circuits and methods for making hig...

Sensor device having printed circuit board substrate with built-in...

Printable 3D electronic structure

Method for providing hermetic electrical feedthrough

Printed circuit board assembly

Dummy core restrict resin process and structure

Method of forming a laminate structure having a plated through-hole...

Component-embedded substrate, method of manufacturing the same, and...

Methods of manufacturing flexible printed circuit boards

Method of manufacturing flexible electronic circuits having conform...

Method of manufacturing coil component

Flexible conductive track arrangement and manufacturing method

Wafer-level package with enhanced performance

Stretchable electronic assembly

Wafer-level package with enhanced performance

Polymer frame for a chip, such that the frame comprises at least on...

Integrated electronic components and methods of formation thereof

Wiring board desmear treatment method

Wafer-level package with enhanced performance

Printed wiring board and method for manufacturing printed wiring board

Method for providing hermetic electrical feedthrough

Method of forming an interference shield on a substrate

Wafer-level package with enhanced performance

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME

PACKAGED CIRCUIT STRUCTURE

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

Component Carrier With a Magnetic Element and a Manufacturing Method

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

PACKAGED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FORMING A LAMINATE STRUCTURE HAVING A PLATED THROUGH-HOLE...

FLEXIBLE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

RECIPROCAL PCB MANUFACTURING PROCESS

FLEXIBLE PRINTED CIRCUIT BOARD

HIGH-SPEED, FLEXIBLE INTEGRATED CIRCUITS AND METHODS FOR MAKING HIG...

MULTILAYER SUBSTRATE

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONEN...

CIRCUIT STRUCTURE

INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF

Methods for Forming Ceramic Substrates with Via Studs

Methods of Manufacturing Flexible Electronic Devices

Printed Circuit Board Assembly With Air Dielectric

Method for Producing a Circuit Board

THIN FILM BASED ELECTROMAGNETIC INTERFERENCE SHIELDING WITH BBUL/CO...

METHOD FOR MANUFACTURING TOUCH PANEL

WIRED CIRCUIT BOARD

METHOD OF PROCESSING A SUBSTRATE

METHOD OF PROCESSING A SUBSTRATE

PROCESS FOR THE PRODUCTION OF A PLUG AND A PLUG

METHOD OF FORMING ELECTRIC WIRING USING INKJET PRINTING AND INKJET...

METHODS FOR LIQUID TRANSER COATING OF THREE-DIMENSIONAL SUBSTRATES

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

EMBEDDED ARCHITECTURE USING RESIN COATED COPPER