Self-assembly

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CPC
H01L2224/1152

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1152Self-assembly

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Bump structure of the semiconductor package
- Patent number 11,362,055
- Issue date Jun 14, 2022
- Powertech Technology Inc.
- Chih-Yen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 11,158,605
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,872,863
- Issue date Dec 22, 2020
- Samsung Electronics Co. Ltd.
- Joo Young Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method
- Patent number 9,799,631
- Issue date Oct 24, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow film, solder bump formation method, solder joint formation m...
- Patent number 9,656,353
- Issue date May 23, 2017
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic contacts
- Patent number 9,601,468
- Issue date Mar 21, 2017
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 9,462,736
- Issue date Oct 4, 2016
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic contacts
- Patent number 9,343,389
- Issue date May 17, 2016
- Intel Corporation
- Michael P. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip mounting resin composition and bump forming resin composi...
- Patent number 8,709,293
- Issue date Apr 29, 2014
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition and methods of forming solder bump and flip chip using...
- Patent number 8,420,722
- Issue date Apr 16, 2013
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal nanoink and process for producing the metal nanoink, and die...
- Patent number 8,328,928
- Issue date Dec 11, 2012
- Shinkawa Ltd.
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bump forming method using self-assembling resin and a wall surface
- Patent number 8,297,488
- Issue date Oct 30, 2012
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 8,283,246
- Issue date Oct 9, 2012
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for bonding flip chip
- Patent number 8,211,745
- Issue date Jul 3, 2012
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package
- Patent number 8,030,200
- Issue date Oct 4, 2011
- Electronics and Telecommunications Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 8,012,801
- Issue date Sep 6, 2011
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic components, method for forming bum...
- Patent number 7,963,310
- Issue date Jun 21, 2011
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,951,700
- Issue date May 31, 2011
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particles-dispersed composition and flip chip mounting proces...
- Patent number 7,910,403
- Issue date Mar 22, 2011
- Panasonic Corporation
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming method and bump forming apparatus
- Patent number 7,905,011
- Issue date Mar 15, 2011
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting electronic components, method for forming bum...
- Patent number 7,850,803
- Issue date Dec 14, 2010
- Panasonic Corporation
- Tsukasa Shiraishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming bumps and solder bump
- Patent number 7,799,607
- Issue date Sep 21, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and flip chip assembly
- Patent number 7,759,162
- Issue date Jul 20, 2010
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting body and method for mounting such flip chip moun...
- Patent number 7,754,529
- Issue date Jul 13, 2010
- Panasonic Corporation
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting process and bump-forming process using electrica...
- Patent number 7,726,545
- Issue date Jun 1, 2010
- Panasonic Corporation
- Takashi Ichiryu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing metal chips by plasma from a layer compris...
- Patent number 7,691,735
- Issue date Apr 6, 2010
- Commissariat a l'Energie Atomique
- Laurent Grenouillet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,638,883
- Issue date Dec 29, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bump and method for mounting semiconducto...
- Patent number 7,611,040
- Issue date Nov 3, 2009
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip mounting method and bump forming method
- Patent number 7,531,387
- Issue date May 12, 2009
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE OF THE SEMICONDUCTOR PACKAGE
- Publication number 20220037274
- Publication date Feb 3, 2022
- Powertech Technology Inc.
- Chih-Yen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ON MOLD COMPOUND IN FAN-OUT WAFER-LEVEL PACKAGING OF INTEGRAT...
- Publication number 20210125906
- Publication date Apr 29, 2021
- Semiconductor Components Industries, LLC
- Chia Hao KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200075492
- Publication date Mar 5, 2020
- Samsung Electronics Co., Ltd.
- Joo Young CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20180047708
- Publication date Feb 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Structure and Method
- Publication number 20170179083
- Publication date Jun 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANU...
- Publication number 20160126202
- Publication date May 5, 2016
- International Business Machines Corporation
- Thomas J. Brunschwiler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150200173
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317915
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20140317918
- Publication date Oct 30, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHODS OF FORMING BUMP AND SEMICONDUCTOR DEVICE WITH THE SAME
- Publication number 20140287556
- Publication date Sep 25, 2014
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...
- Publication number 20140252607
- Publication date Sep 11, 2014
- Hitachi Chemical Company, Ltd.
- Kazuhiro Miyauchi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDI...
- Publication number 20140117070
- Publication date May 1, 2014
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20130200135
- Publication date Aug 8, 2013
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B82 - NANO-TECHNOLOGY
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20130001280
- Publication date Jan 3, 2013
- SHINKAWA LTD.
- Toru MAEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...
- Publication number 20120319268
- Publication date Dec 20, 2012
- Tomohiro Kagimoto
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...
- Publication number 20120261174
- Publication date Oct 18, 2012
- Toshiaki Chuma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PROD...
- Publication number 20110207048
- Publication date Aug 25, 2011
- Yuki ITOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD
- Publication number 20110201195
- Publication date Aug 18, 2011
- PANASONIC CORPORATION
- Takashi KITAE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...
- Publication number 20110133137
- Publication date Jun 9, 2011
- Koichi Hirano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...
- Publication number 20110114708
- Publication date May 19, 2011
- SHINKAWAL LTD
- Toru Maeda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD AND STRUCTURE FOR BONDING FLIP CHIP
- Publication number 20110089577
- Publication date Apr 21, 2011
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...
- Publication number 20110049218
- Publication date Mar 3, 2011
- PANASONIC CORPORATION
- Tsukasa SHIRAISHI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method for manufacturing semiconductor device, and semiconductor ma...
- Publication number 20110014785
- Publication date Jan 20, 2011
- NEC ELECTRONICS CORPORATION
- Yuji Shimizu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACK...
- Publication number 20100320596
- Publication date Dec 23, 2010
- Electronics and Telecommunication Research Institute
- Yong Sung Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY
- Publication number 20100148376
- Publication date Jun 17, 2010
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP
- Publication number 20100044091
- Publication date Feb 25, 2010
- PANASONIC CORPORATION
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...
- Publication number 20100011572
- Publication date Jan 21, 2010
- Takashi Kitae
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...
- Publication number 20100006625
- Publication date Jan 14, 2010
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Yong Sung EOM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090229120
- Publication date Sep 17, 2009
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Self-assembly

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bump structure of the semiconductor package

Semiconductor packaging structure and method

Semiconductor package

Semiconductor packaging structure and method

Reflow film, solder bump formation method, solder joint formation m...

Magnetic contacts

Composition and methods of forming solder bump and flip chip using...

Magnetic contacts

Flip-chip mounting resin composition and bump forming resin composi...

Composition and methods of forming solder bump and flip chip using...

Metal nanoink and process for producing the metal nanoink, and die...

Bump forming method using self-assembling resin and a wall surface

Flip chip mounting method and bump forming method

Method and structure for bonding flip chip

Method for fabricating a semiconductor package

Flip chip mounting process and flip chip assembly

Method for connecting electronic components, method for forming bum...

Flip chip mounting method and bump forming method

Method for mutually connecting substrates, flip chip mounting body,...

Metal particles-dispersed composition and flip chip mounting proces...

Bump forming method and bump forming apparatus

Method for connecting electronic components, method for forming bum...

Process for forming bumps and solder bump

Flip chip mounting process and flip chip assembly

Flip chip mounting body and method for mounting such flip chip moun...

Flip chip mounting process and bump-forming process using electrica...

Method for manufacturing metal chips by plasma from a layer compris...

Flip chip mounting method and bump forming method

Method for forming solder bump and method for mounting semiconducto...

Flip chip mounting method and bump forming method

Patents Applicationslast 30 patents

BUMP STRUCTURE OF THE SEMICONDUCTOR PACKAGE

METAL ON MOLD COMPOUND IN FAN-OUT WAFER-LEVEL PACKAGING OF INTEGRAT...

SEMICONDUCTOR PACKAGE

Semiconductor Packaging Structure and Method

Semiconductor Packaging Structure and Method

BRIDGING ARRANGEMENT, MICROELECTRONIC COMPONENT AND METHOD FOR MANU...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

METHODS OF FORMING BUMP AND SEMICONDUCTOR DEVICE WITH THE SAME

REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION M...

METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDI...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METH...

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR PRODUCING ELECTRONIC COM...

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PROD...

FLIP CHIP MOUNTING METHOD AND BUMP FORMING METHOD

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCES...

METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE...

METHOD AND STRUCTURE FOR BONDING FLIP CHIP

METHOD FOR CONNECTING ELECTRONIC COMPONENTS, METHOD FOR FORMING BUM...

Method for manufacturing semiconductor device, and semiconductor ma...

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACK...

FLIP CHIP MOUNTING PROCESS AND FLIP CHIP ASSEMBLY

ELECTRODE STRUCTURE AND METHOD FOR FORMING BUMP

ELECTRONIC COMPONENT ASSEMBLY, ELECTRIC COMPONENT WITH SOLDER BUMP...

COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

BUMP FORMING METHOD AND BUMP FORMING APPARATUS