Sensors not provided for in B81B2201/0207 - B81B2201/0285

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B81B2201/0292

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BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0292Sensors not provided for in B81B2201/0207 - B81B2201/0285

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacture and assembly of XY flexure mechanism assembly
- Patent number 12,258,263
- Issue date Mar 25, 2025
- The Regents of the University of Michigan
- Shorya Awtar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Force-measuring device assembly for a portable electronic apparatus...
- Patent number 12,066,338
- Issue date Aug 20, 2024
- UltraSense Systems, Inc.
- Sina Akhbari
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Analysis method of a device, performed through a MEMS sensor, and s...
- Patent number 12,054,386
- Issue date Aug 6, 2024
- STMicroelectronics S.r.l.
- Enrico Rosario Alessi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Waterproof MEMS button device, input device comprising the MEMS but...
- Patent number 12,050,102
- Issue date Jul 30, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Capacitance gap measurement
- Patent number 12,017,907
- Issue date Jun 25, 2024
- Invensense, Inc.
- Edoardo Belloni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Passive micromechanical counter
- Patent number 12,008,432
- Issue date Jun 11, 2024
- Ruhr-Universität Bochum
- Philip Schmitt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-range semiconductor load sensor device
- Patent number 11,851,319
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Anna Angela Pomarico
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mass flow control based on micro-electromechanical devices
- Patent number 11,772,958
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Nir Merry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Diagnosis of electrical failures in capacitive sensors
- Patent number 11,733,060
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Dan-Ioan-Dumitru Stoica
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged environmental sensor
- Patent number 11,718,519
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inclination sensor system
- Patent number 11,692,821
- Issue date Jul 4, 2023
- MOBA MOBILE AUTOMATION AG
- Jörg Ruppel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detachable MEMS package top cover
- Patent number 11,673,795
- Issue date Jun 13, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a micro machined channel
- Patent number 11,629,048
- Issue date Apr 18, 2023
- Berkin B.V.
- Yiyuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hydrogen sensor, hydrogen detecting method, and non-transitory comp...
- Patent number 11,624,721
- Issue date Apr 11, 2023
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device with manifold
- Patent number 11,597,646
- Issue date Mar 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photoacoustic sensors and MEMS devices
- Patent number 11,573,204
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D-structured sensors having stretchable multi-functional tactile e...
- Patent number 11,572,270
- Issue date Feb 7, 2023
- Nanyang Technological University
- Zhiyuan Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS gas sensor
- Patent number 11,480,538
- Issue date Oct 25, 2022
- TDK Corporation
- Matthias König
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor and method of manufacturing the same
- Patent number 11,345,590
- Issue date May 31, 2022
- United Microelectronics Corp.
- Chih-Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated sensor apparatus with pressure sensing element and flow...
- Patent number 11,300,535
- Issue date Apr 12, 2022
- Honeywell International Inc.
- Richard Charles Sorenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS gas sensor
- Patent number 11,237,098
- Issue date Feb 1, 2022
- Infineon Technologies AG
- David Tumpold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,201,096
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS ELECTRIC FIELD SENSOR USING RESONANT TORSIONAL SHUTTER AND MET...
- Publication number 20250171296
- Publication date May 29, 2025
- Industry-Academic Cooperation Foundation, Yonsei University
- Jongbaeg KIM
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...
- Publication number 20250128936
- Publication date Apr 24, 2025
- Connaught Electronics Ltd.
- Maurice DORE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL EMITTER, METHOD FOR OPERATING A THERMAL EMITTER AND MEMS GA...
- Publication number 20250133634
- Publication date Apr 24, 2025
- INFINEON TECHNOLOGIES AG
- Tobias Mittereder
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROSCALE FLEXIBLE STRAIN SENSOR
- Publication number 20250122073
- Publication date Apr 17, 2025
- Carnegie Mellon University
- Jay Reddy
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE
- Publication number 20250100872
- Publication date Mar 27, 2025
- MEMSensing Microsystems (Suzhou, China) Co., Ltd.
- Yanzi MENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR
- Publication number 20250083950
- Publication date Mar 13, 2025
- Kabushiki Kaisha Toshiba
- Hiroaki YAMAZAKI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ELECTRICALLY CONNECTED PRECISION MOTION STAGE WITH POSITION SE...
- Publication number 20250083949
- Publication date Mar 13, 2025
- MEMS DRIVE (NANJING) CO., LTD.
- Matthew Ng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFERENTIAL MEASUREMENT OF IR ABSORPTION IN PLASMONIC MEMS SENSORS
- Publication number 20250076190
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jeronimo Segovia Fernandez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20250076135
- Publication date Mar 6, 2025
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR
- Publication number 20250066186
- Publication date Feb 27, 2025
- ROBERT BOSCH GmbH
- David Slogsnat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTROCHEMISTRY MICROSCOPY BIPOLAR REFERENCE ELECTRODE ASSEMBLY
- Publication number 20250027899
- Publication date Jan 23, 2025
- PROTOCHIPS, INC.
- Katherine Marusak Stephens
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME
- Publication number 20250002333
- Publication date Jan 2, 2025
- STMicroelectronics International N.V.
- Eric SAUGIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRAIN SENSOR SWITCH FOR TIMING BASED SENSING
- Publication number 20240400375
- Publication date Dec 5, 2024
- Carnegie Mellon University
- Regan Kubicek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...
- Publication number 20240369506
- Publication date Nov 7, 2024
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF
- Publication number 20240239648
- Publication date Jul 18, 2024
- STMicroelectronics S.r.l.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR, MEMS MICROPHONE, ELECTRONIC CIGARETTE
- Publication number 20240215649
- Publication date Jul 4, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL VOLTAGE MEASURING DEVICE USING AN MICROELECTROMECHANICAL...
- Publication number 20240219431
- Publication date Jul 4, 2024
- Airbus Operations, S.L.U.
- David VICENTE OLIVEROS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS GAS SENSOR AND ARRAY THEREOF, AND GAS DETECTION AND PREPARATIO...
- Publication number 20230341367
- Publication date Oct 26, 2023
- Wiinaa Co., Ltd.
- Lei XU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314193
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Vijay Parkhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20230304879
- Publication date Sep 28, 2023
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...
- Publication number 20230243771
- Publication date Aug 3, 2023
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
- Publication number 20230235664
- Publication date Jul 27, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Remi Robutel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOACOUSTIC SENSORS AND MEMS DEVICES
- Publication number 20230116926
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device with Cover Layer
- Publication number 20220396473
- Publication date Dec 15, 2022
- MEAS France
- Emilien Durupt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE-MEASURING DEVICE ASSEMBLY FOR A PORTABLE ELECTRONIC APPARATUS...
- Publication number 20220364939
- Publication date Nov 17, 2022
- UltraSense Systems, Inc.
- Sina Akhbari
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Passive Micromechanical Counter
- Publication number 20220277185
- Publication date Sep 1, 2022
- RUHR-UNIVERSITÄT BOCHUM
- Philip SCHMITT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL HEATING DEVICE
- Publication number 20220267143
- Publication date Aug 25, 2022
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ming-Fa CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Sensors not provided for in B81B2201/0207 - B81B2201/0285

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacture and assembly of XY flexure mechanism assembly

Reduced light reflection package

Force-measuring device assembly for a portable electronic apparatus...

Analysis method of a device, performed through a MEMS sensor, and s...

Waterproof MEMS button device, input device comprising the MEMS but...

Capacitance gap measurement

Passive micromechanical counter

Sensing module and manufacturing method thereof

Packaged device with die wrapped by a substrate

High-range semiconductor load sensor device

Reduced light reflection package

MEMS device with particle filter and method of manufacture

Mass flow control based on micro-electromechanical devices

Diagnosis of electrical failures in capacitive sensors

Packaged environmental sensor

Inclination sensor system

Detachable MEMS package top cover

Semiconductor structure and manufacturing method thereof

Method of fabricating a micro machined channel

Hydrogen sensor, hydrogen detecting method, and non-transitory comp...

Microfluidic device with manifold

Photoacoustic sensors and MEMS devices

3D-structured sensors having stretchable multi-functional tactile e...

MEMS apparatus with anti-stiction layer

Semiconductor device

MEMS gas sensor

Semiconductor sensor and method of manufacturing the same

Integrated sensor apparatus with pressure sensing element and flow...

MEMS gas sensor

Packaged device with die wrapped by a substrate

Patents Applicationslast 30 patents

MEMS ELECTRIC FIELD SENSOR USING RESONANT TORSIONAL SHUTTER AND MET...

MEMS PACKAGING ENABLING VERTICAL DISPLACEMENT OF SENSOR AND ACTUATO...

THERMAL EMITTER, METHOD FOR OPERATING A THERMAL EMITTER AND MEMS GA...

MICROSCALE FLEXIBLE STRAIN SENSOR

AIRFLOW SENSOR AND AIRFLOW SENSOR PACKAGING STRUCTURE

SENSOR

MEMS ELECTRICALLY CONNECTED PRECISION MOTION STAGE WITH POSITION SE...

DIFFERENTIAL MEASUREMENT OF IR ABSORPTION IN PLASMONIC MEMS SENSORS

SENSING ELEMENT AND RELATED METHODS

ENVIRONMENTAL SENSOR AND METHOD FOR OPERATING AN ENVIRONMENTAL SENSOR

ELECTROCHEMISTRY MICROSCOPY BIPOLAR REFERENCE ELECTRODE ASSEMBLY

WAFER LEVEL PROXIMITY SENSOR AND METHOD OF MAKING SAME

STRAIN SENSOR SWITCH FOR TIMING BASED SENSING

HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...

MEMS DEVICE HAVING AN IMPROVED CAP AND MANUFACTURING PROCESS THEREOF

MEMS SENSOR, MEMS MICROPHONE, ELECTRONIC CIGARETTE

ELECTRICAL VOLTAGE MEASURING DEVICE USING AN MICROELECTROMECHANICAL...

REDUCED LIGHT REFLECTION PACKAGE

MEMS GAS SENSOR AND ARRAY THEREOF, AND GAS DETECTION AND PREPARATIO...

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

SENSING ELEMENT AND RELATED METHODS

HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

PHOTOACOUSTIC SENSORS AND MEMS DEVICES

SENSING MODULE AND MANUFACTURING METHOD THEREOF

Sensor Device with Cover Layer

FORCE-MEASURING DEVICE ASSEMBLY FOR A PORTABLE ELECTRONIC APPARATUS...

Passive Micromechanical Counter

MICROELECTROMECHANICAL HEATING DEVICE