Sensors not provided for in B81B2201/0207 - B81B2201/0285

Industry

CPC
B81B2201/0292

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/0292Sensors not provided for in B81B2201/0207 - B81B2201/0285

Industries

Patents Grantslast 30 patents

Information Patent Grant
Sensing module and manufacturing method thereof
- Patent number 11,894,473
- Issue date Feb 6, 2024
- Ruei Chi Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,887,906
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-range semiconductor load sensor device
- Patent number 11,851,319
- Issue date Dec 26, 2023
- STMicroelectronics S.r.l.
- Anna Angela Pomarico
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Reduced light reflection package
- Patent number 11,800,297
- Issue date Oct 24, 2023
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with particle filter and method of manufacture
- Patent number 11,787,689
- Issue date Oct 17, 2023
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mass flow control based on micro-electromechanical devices
- Patent number 11,772,958
- Issue date Oct 3, 2023
- Applied Materials, Inc.
- Nir Merry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Diagnosis of electrical failures in capacitive sensors
- Patent number 11,733,060
- Issue date Aug 22, 2023
- Infineon Technologies AG
- Dan-Ioan-Dumitru Stoica
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged environmental sensor
- Patent number 11,718,519
- Issue date Aug 8, 2023
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inclination sensor system
- Patent number 11,692,821
- Issue date Jul 4, 2023
- MOBA MOBILE AUTOMATION AG
- Jörg Ruppel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Detachable MEMS package top cover
- Patent number 11,673,795
- Issue date Jun 13, 2023
- BEIJING VOYAGER TECHNOLOGY CO., LTD.
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,661,333
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Wei-Jhih Mao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of fabricating a micro machined channel
- Patent number 11,629,048
- Issue date Apr 18, 2023
- Berkin B.V.
- Yiyuan Zhao
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hydrogen sensor, hydrogen detecting method, and non-transitory comp...
- Patent number 11,624,721
- Issue date Apr 11, 2023
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfluidic device with manifold
- Patent number 11,597,646
- Issue date Mar 7, 2023
- Hewlett-Packard Development Company, L.P.
- Chien-Hua Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Photoacoustic sensors and MEMS devices
- Patent number 11,573,204
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Rainer Markus Schaller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3D-structured sensors having stretchable multi-functional tactile e...
- Patent number 11,572,270
- Issue date Feb 7, 2023
- Nanyang Technological University
- Zhiyuan Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS apparatus with anti-stiction layer
- Patent number 11,542,151
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuei-Sung Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,505,452
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Lawrence Prestousa Natan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS gas sensor
- Patent number 11,480,538
- Issue date Oct 25, 2022
- TDK Corporation
- Matthias König
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor sensor and method of manufacturing the same
- Patent number 11,345,590
- Issue date May 31, 2022
- United Microelectronics Corp.
- Chih-Fan Hu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated sensor apparatus with pressure sensing element and flow...
- Patent number 11,300,535
- Issue date Apr 12, 2022
- Honeywell International Inc.
- Richard Charles Sorenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS gas sensor
- Patent number 11,237,098
- Issue date Feb 1, 2022
- Infineon Technologies AG
- David Tumpold
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged device with die wrapped by a substrate
- Patent number 11,201,096
- Issue date Dec 14, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package level thermal gradient sensing
- Patent number 11,174,153
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ilya Gurin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of producing a semiconductor device
- Patent number 11,167,981
- Issue date Nov 9, 2021
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Sabine Trupp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for suppressing stray radiation
- Patent number 11,136,237
- Issue date Oct 5, 2021
- Infineon Technologies AG
- Werner Simbuerger
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Force sensor having first and second circuit board arrangements
- Patent number 11,105,692
- Issue date Aug 31, 2021
- CORETRONIC MEMS CORPORATION
- Hsi-Wen Tung
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-device transducer modulus, electronic apparatus including the...
- Patent number 11,053,115
- Issue date Jul 6, 2021
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device comprising a micro-electro-mechanical system substrate with...
- Patent number 11,040,871
- Issue date Jun 22, 2021
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Deformable membrane and a compensating structure thereof
- Patent number 11,027,967
- Issue date Jun 8, 2021
- Invensense, Inc.
- Chung-Hsien Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20240015447
- Publication date Jan 11, 2024
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS GAS SENSOR AND ARRAY THEREOF, AND GAS DETECTION AND PREPARATIO...
- Publication number 20230341367
- Publication date Oct 26, 2023
- Wiinaa Co., Ltd.
- Lei XU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314197
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Arvinder Manmohan Singh Chadha
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230314193
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Vijay Parkhe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING ELEMENT AND RELATED METHODS
- Publication number 20230304879
- Publication date Sep 28, 2023
- GENERAL ELECTRIC COMPANY
- Robert James MacDonald
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...
- Publication number 20230243771
- Publication date Aug 3, 2023
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS
- Publication number 20230235664
- Publication date Jul 27, 2023
- SCHLUMBERGER TECHNOLOGY CORPORATION
- Remi Robutel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOACOUSTIC SENSORS AND MEMS DEVICES
- Publication number 20230116926
- Publication date Apr 20, 2023
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20230076715
- Publication date Mar 9, 2023
- CHIP POSITION SYSTEM CO., LTD.
- RUEI CHI CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Device with Cover Layer
- Publication number 20220396473
- Publication date Dec 15, 2022
- MEAS France
- Emilien Durupt
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE-MEASURING DEVICE ASSEMBLY FOR A PORTABLE ELECTRONIC APPARATUS...
- Publication number 20220364939
- Publication date Nov 17, 2022
- UltraSense Systems, Inc.
- Sina Akhbari
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Passive Micromechanical Counter
- Publication number 20220277185
- Publication date Sep 1, 2022
- RUHR-UNIVERSITÄT BOCHUM
- Philip SCHMITT
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL HEATING DEVICE
- Publication number 20220267143
- Publication date Aug 25, 2022
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Ming-Fa CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIAGNOSIS OF ELECTRICAL FAILURES IN CAPACITIVE SENSORS
- Publication number 20220252434
- Publication date Aug 11, 2022
- INFINEON TECHNOLOGIES AG
- Dan-Ioan-Dumitru STOICA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITANCE GAP MEASUREMENT
- Publication number 20220234883
- Publication date Jul 28, 2022
- InvenSense, Inc.
- Edoardo Belloni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE
- Publication number 20220219971
- Publication date Jul 14, 2022
- CAMBRIDGE ENTERPRISE LIMITED
- Ashwin SESHIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCED LIGHT REFLECTION PACKAGE
- Publication number 20220191624
- Publication date Jun 16, 2022
- InvenSense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE FOR TRANSDUCING ACOUSTIC WAVES IN A PROPAGAT...
- Publication number 20220169497
- Publication date Jun 2, 2022
- STMicroelectronics S.r.l.
- Alessandro Stuart SAVOIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DETACHABLE MEMS PACKAGE TOP COVER
- Publication number 20220144626
- Publication date May 12, 2022
- Anan Pan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED MEMS-CMOS ULTRASONIC SENSOR
- Publication number 20220130899
- Publication date Apr 28, 2022
- Shenzhen Goodix Technology Co., Ltd.
- Mostafa SOLIMAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220112074
- Publication date Apr 14, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- WEI-JHIH MAO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL DEVICE FOR USE IN A FLOW CONTROL APPARATUS
- Publication number 20220081282
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Nir Merry
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE
- Publication number 20220077014
- Publication date Mar 10, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DIE WITH SENSOR SECTION LOCATED AT THE EDGE
- Publication number 20220069203
- Publication date Mar 3, 2022
- INFINEON TECHNOLOGIES AG
- Momtchil STAVREV
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRON-RESOLUTION SOFT STRETCHABLE STRAIN AND PRESSURE SENSOR
- Publication number 20220009764
- Publication date Jan 13, 2022
- The Regents of the University of California
- Yongxiao Zhou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFERENTIAL MEASUREMENT OF IR ABORPTION IN PLASMONIC MEMS SENSORS
- Publication number 20210302308
- Publication date Sep 30, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jeronimo Segovia Fernandez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ANALYSIS METHOD OF A DEVICE, PERFORMED THROUGH A MEMS SENSOR, AND S...
- Publication number 20210253419
- Publication date Aug 19, 2021
- STMicroelectronics S.r.l.
- Enrico Rosario ALESSI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PHOTOACOUSTIC SENSORS AND MEMS DEVICES
- Publication number 20210181151
- Publication date Jun 17, 2021
- INFINEON TECHNOLOGIES AG
- Rainer Markus SCHALLER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGED ENVIRONMENTAL SENSOR
- Publication number 20210163283
- Publication date Jun 3, 2021
- STMicroelectronics S.r.l.
- Marco Omar Ghidoni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUT...
- Publication number 20210095949
- Publication date Apr 1, 2021
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Sensors not provided for in B81B2201/0207 - B81B2201/0285

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Sensing module and manufacturing method thereof

Packaged device with die wrapped by a substrate

High-range semiconductor load sensor device

Reduced light reflection package

MEMS device with particle filter and method of manufacture

Mass flow control based on micro-electromechanical devices

Diagnosis of electrical failures in capacitive sensors

Packaged environmental sensor

Inclination sensor system

Detachable MEMS package top cover

Semiconductor structure and manufacturing method thereof

Method of fabricating a micro machined channel

Hydrogen sensor, hydrogen detecting method, and non-transitory comp...

Microfluidic device with manifold

Photoacoustic sensors and MEMS devices

3D-structured sensors having stretchable multi-functional tactile e...

MEMS apparatus with anti-stiction layer

Semiconductor device

MEMS gas sensor

Semiconductor sensor and method of manufacturing the same

Integrated sensor apparatus with pressure sensing element and flow...

MEMS gas sensor

Packaged device with die wrapped by a substrate

Package level thermal gradient sensing

Semiconductor device and method of producing a semiconductor device

Device for suppressing stray radiation

Force sensor having first and second circuit board arrangements

Multi-device transducer modulus, electronic apparatus including the...

Device comprising a micro-electro-mechanical system substrate with...

Deformable membrane and a compensating structure thereof

Patents Applicationslast 30 patents

REDUCED LIGHT REFLECTION PACKAGE

MEMS GAS SENSOR AND ARRAY THEREOF, AND GAS DETECTION AND PREPARATIO...

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

PACKAGING FOR A SENSOR AND METHODS OF MANUFACTURING THEREOF

SENSING ELEMENT AND RELATED METHODS

HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...

ENVIRONMENTAL SYSTEM-IN-PACKAGE FOR HARSH ENVIRONMENTS

PHOTOACOUSTIC SENSORS AND MEMS DEVICES

SENSING MODULE AND MANUFACTURING METHOD THEREOF

Sensor Device with Cover Layer

FORCE-MEASURING DEVICE ASSEMBLY FOR A PORTABLE ELECTRONIC APPARATUS...

Passive Micromechanical Counter

MICROELECTROMECHANICAL HEATING DEVICE

DIAGNOSIS OF ELECTRICAL FAILURES IN CAPACITIVE SENSORS

CAPACITANCE GAP MEASUREMENT

MULTIPLY ENCAPSULATED MICRO ELECTRICAL MECHANICAL SYSTEMS DEVICE

REDUCED LIGHT REFLECTION PACKAGE

MICROMECHANICAL DEVICE FOR TRANSDUCING ACOUSTIC WAVES IN A PROPAGAT...

DETACHABLE MEMS PACKAGE TOP COVER

INTEGRATED MEMS-CMOS ULTRASONIC SENSOR

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

MICRO-ELECTROMECHANICAL DEVICE FOR USE IN A FLOW CONTROL APPARATUS

PACKAGED DEVICE WITH DIE WRAPPED BY A SUBSTRATE

SEMICONDUCTOR DIE WITH SENSOR SECTION LOCATED AT THE EDGE

MICRON-RESOLUTION SOFT STRETCHABLE STRAIN AND PRESSURE SENSOR

DIFFERENTIAL MEASUREMENT OF IR ABORPTION IN PLASMONIC MEMS SENSORS

ANALYSIS METHOD OF A DEVICE, PERFORMED THROUGH A MEMS SENSOR, AND S...

PHOTOACOUSTIC SENSORS AND MEMS DEVICES

PACKAGED ENVIRONMENTAL SENSOR

WATERPROOF MEMS BUTTON DEVICE, INPUT DEVICE COMPRISING THE MEMS BUT...