Sensors

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B81B2201/02

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B2201/00Specific applications of micro-electromechanical systems

Current Industry

B81B2201/02Sensors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Microphone assembly with disturbance compensation
- Patent number 12,156,003
- Issue date Nov 26, 2024
- Knowles Electronics, LLC
- Jakob Kenn Toft
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method of equalizing low frequency roll off for wearable...
- Patent number 12,151,934
- Issue date Nov 26, 2024
- xMEMS Labs, Inc.
- Yanchen Lu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical component for a sensor device or microphone device
- Patent number 12,151,936
- Issue date Nov 26, 2024
- Robert Bosch GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3-axis angular accelerometer
- Patent number 12,153,065
- Issue date Nov 26, 2024
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrates comprising nano-patterning surfaces and methods of prepa...
- Patent number 12,151,460
- Issue date Nov 26, 2024
- Illumina, Inc.
- M. Shane Bowen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS optical microphone
- Patent number 12,155,997
- Issue date Nov 26, 2024
- AAC Acoustic Technologies (Shenzhen) Co., Ltd.
- Taimoor Ali
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS sensor as well as method for operating a mems sensor
- Patent number 12,145,840
- Issue date Nov 19, 2024
- Robert Bosch GmbH
- Arne Dannenberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMUT transducer with motion-stopping structure and CMUT transducer...
- Patent number 12,145,838
- Issue date Nov 19, 2024
- Vermon S.A.
- Cyril Meynier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multiple layer electrode transducers
- Patent number 12,139,394
- Issue date Nov 12, 2024
- Soundskrit Inc.
- Wan-Thai Hsu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Selective self-assembled monolayer patterning with sacrificial laye...
- Patent number 12,139,397
- Issue date Nov 12, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical sensor device with improved stability to stress
- Patent number 12,139,396
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Francesco Rizzini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensor with high stability
- Patent number 12,139,398
- Issue date Nov 12, 2024
- Invensense, Inc.
- Weng Shen Su
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor device and sensor
- Patent number 12,140,430
- Issue date Nov 12, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideki Ueda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure for CMOS-MEMS thin film encapsulation
- Patent number 12,134,555
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Chia Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Triple-membrane MEMS device
- Patent number 12,133,060
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems device, electronic apparatus, and vehicle
- Patent number 12,130,303
- Issue date Oct 29, 2024
- Seiko Epson Corporation
- Fumiya Ito
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduced light reflection package
- Patent number 12,133,049
- Issue date Oct 29, 2024
- Invensense, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device for sensing a motion of a deflective surface
- Patent number 12,133,050
- Issue date Oct 29, 2024
- Infineon Technologies AG
- Darragh Francis Corrigan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inertia measurement device, vehicle, and electronic device
- Patent number 12,130,305
- Issue date Oct 29, 2024
- Seiko Epson Corporation
- Yusuke Kinoshita
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Interlocking proof mass for mems inertial sensing device
- Patent number 12,129,167
- Issue date Oct 29, 2024
- National Technology & Engineering Solutions of Sandia, LLC
- Paul J. Resnick
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system device using a metallic movable part...
- Patent number 12,122,665
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tao-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical microphone having a robust backplate
- Patent number 12,116,269
- Issue date Oct 15, 2024
- TDK Corporation
- Anton Leidl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for micro-vibrator and method of manufacturing in...
- Patent number 12,104,904
- Issue date Oct 1, 2024
- Denso Corporation
- Teruhisa Akashi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for fabricating MEMS havi...
- Patent number 12,103,845
- Issue date Oct 1, 2024
- United Microelectronics Corp.
- Jung-Hao Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Multi-transducer chip ultrasound device
- Patent number 12,099,150
- Issue date Sep 24, 2024
- EXO IMAGING, INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor and package assembly thereof
- Patent number 12,091,312
- Issue date Sep 17, 2024
- Robert Bosch GmbH
- Ken Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mems structure
- Patent number 12,096,183
- Issue date Sep 17, 2024
- FORTEMEDIA, INC.
- Chih-Yuan Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Silicon MEMS gyroscopes with upper and lower sense plates
- Patent number 12,092,460
- Issue date Sep 17, 2024
- The Charles Stark Draper Laboratory, Inc.
- Eugene H. Cook
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Barometric pressure sensor arrays for detecting presence and motion...
- Patent number 12,092,834
- Issue date Sep 17, 2024
- Sony Interactive Entertainment Inc.
- Dennis Castleman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Acoustic devices with feedback control of acoustic resistance
- Patent number 12,081,941
- Issue date Sep 3, 2024
- Skyworks Solutions, Inc.
- Siarhei Dmitrievich Barsukou
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF
- Publication number 20240391761
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kai-Lan CHANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS COMPONENT WITH UPSIDE-DOWN CHIP
- Publication number 20240391759
- Publication date Nov 28, 2024
- Murata Manufacturing Co., Ltd.
- Sami NURMI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD FOR FORMING THE SAME
- Publication number 20240391756
- Publication date Nov 28, 2024
- AAC TECHNOLOGIES PTE. LTD
- ZaiXiang Pua
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ACCELEROMETER WITH FORCE FEEDBACK LOOP
- Publication number 20240391757
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Marco GARBARINO
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS
- Publication number 20240391760
- Publication date Nov 28, 2024
- STMicroelectronics International N.V.
- Silvia NICOLI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES
- Publication number 20240391758
- Publication date Nov 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Ting-Ta YEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE
- Publication number 20240383742
- Publication date Nov 21, 2024
- Zhunmao (Hangzhou) Technology Co.
- Haitao Ding
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240383005
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kang-Yi Lien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL COMPONENT
- Publication number 20240383745
- Publication date Nov 21, 2024
- ROBERT BOSCH GmbH
- Heribert Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING IMPROVED SIGNAL DISTOR...
- Publication number 20240375938
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD
- Publication number 20240375940
- Publication date Nov 14, 2024
- Murata Manufacturing Co., Ltd.
- Masakazu FUKUMITSU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP NOTCH SLIT PROFILE FOR MEMS DEVICE
- Publication number 20240381034
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FORCE SENSOR WITH AN INCREASED OPERATING RANGE
- Publication number 20240377431
- Publication date Nov 14, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Theo MIANI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Device and Fabrication Process with Reduced Z-Axis Stiction
- Publication number 20240375937
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Lianjun Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...
- Publication number 20240369506
- Publication date Nov 7, 2024
- Kabushiki Kaisha Toshiba
- Hiroaki Yamazaki
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART...
- Publication number 20240359969
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Tao-Cheng LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOUND PRODUCING PACKAGE AND COVERING STRUCTURE
- Publication number 20240365048
- Publication date Oct 31, 2024
- xMEMS Labs, Inc.
- Chao-Yu Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VIBRATION DEVICE, SPEAKER UNIT, AND METHOD FOR MANUFACTURING VIBRAT...
- Publication number 20240359970
- Publication date Oct 31, 2024
- MITSUMI ELECTRIC CO., LTD.
- Hisanori AGA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIFFERENTIAL DRIVE OF A SOUND TRANSDUCER SYSTEM
- Publication number 20240359971
- Publication date Oct 31, 2024
- ROBERT BOSCH GmbH
- Raik Fiedler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR
- Publication number 20240359972
- Publication date Oct 31, 2024
- BEIJING BOE SENSOR TECHNOLOGY CO., LTD.
- Lihui WANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI-LEVEL MEMS PROCESS
- Publication number 20240351864
- Publication date Oct 24, 2024
- InvenSense, Inc.
- Roberto Martini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL COMPONENT
- Publication number 20240343554
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...
- Publication number 20240343555
- Publication date Oct 17, 2024
- Infineon Technologies Dresden GmbH & Co. KG
- Dirk MEINHOLD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROELECTROMECHANICAL ACOUSTIC COMPONENT
- Publication number 20240343552
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Christoph SCHELLING
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE
- Publication number 20240343558
- Publication date Oct 17, 2024
- Murata Manufacturing Co., Ltd.
- Petteri KILPINEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE
- Publication number 20240343551
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chuan TENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DIAPHRAGM SYSTEM
- Publication number 20240343557
- Publication date Oct 17, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240336474
- Publication date Oct 10, 2024
- AAC TECHNOLOGIES PTE. LTD
- Houming Chong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
RESONANT SENSOR SYSTEM AND METHOD FOR OPERATING A RESONANT SENSOR S...
- Publication number 20240337491
- Publication date Oct 10, 2024
- ROBERT BOSCH GmbH
- Antonios Nikas
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIRECTIONAL MEMS MICROPHONE
- Publication number 20240327204
- Publication date Oct 3, 2024
- Merry Electronics(Shenzhen) Co., Ltd.
- Yueh-Kang Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Microphone assembly with disturbance compensation

Device and method of equalizing low frequency roll off for wearable...

Micromechanical component for a sensor device or microphone device

3-axis angular accelerometer

Substrates comprising nano-patterning surfaces and methods of prepa...

MEMS optical microphone

MEMS sensor as well as method for operating a mems sensor

CMUT transducer with motion-stopping structure and CMUT transducer...

Multiple layer electrode transducers

Selective self-assembled monolayer patterning with sacrificial laye...

Microelectromechanical sensor device with improved stability to stress

Pressure sensor with high stability

Sensor device and sensor

Method and structure for CMOS-MEMS thin film encapsulation

Triple-membrane MEMS device

Mems device, electronic apparatus, and vehicle

Reduced light reflection package

Device for sensing a motion of a deflective surface

Inertia measurement device, vehicle, and electronic device

Interlocking proof mass for mems inertial sensing device

Micro-electromechanical system device using a metallic movable part...

Microelectromechanical microphone having a robust backplate

Support structure for micro-vibrator and method of manufacturing in...

Micro-electromechanical system and method for fabricating MEMS havi...

Multi-transducer chip ultrasound device

Sensor and package assembly thereof

Mems structure

Silicon MEMS gyroscopes with upper and lower sense plates

Barometric pressure sensor arrays for detecting presence and motion...

Acoustic devices with feedback control of acoustic resistance

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND FORMATION THEREOF

MEMS COMPONENT WITH UPSIDE-DOWN CHIP

MEMS SENSOR AND METHOD FOR FORMING THE SAME

MICROELECTROMECHANICAL ACCELEROMETER WITH FORCE FEEDBACK LOOP

CAPACITIVE MEMS PRESSURE TRANSDUCER AND RELATED MANUFACTURING PROCESS

STRESS ISOLATION USING THREE-DIMENSIONAL TRENCHES

MEMS DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

MICROMECHANICAL COMPONENT

MICROELECTROMECHANICAL SYSTEMS DEVICE HAVING IMPROVED SIGNAL DISTOR...

RESONANCE DEVICE AND RESONANCE DEVICE MANUFACTURING METHOD

TOP NOTCH SLIT PROFILE FOR MEMS DEVICE

FORCE SENSOR WITH AN INCREASED OPERATING RANGE

MEMS Device and Fabrication Process with Reduced Z-Axis Stiction

HYDROGEN SENSOR, HYDROGEN DETECTING METHOD, AND NON-TRANSITORY COMP...

MICRO-ELECTROMECHANICAL SYSTEM DEVICE USING A METALLIC MOVABLE PART...

SOUND PRODUCING PACKAGE AND COVERING STRUCTURE

VIBRATION DEVICE, SPEAKER UNIT, AND METHOD FOR MANUFACTURING VIBRAT...

DIFFERENTIAL DRIVE OF A SOUND TRANSDUCER SYSTEM

PACKAGE STRUCTURE AND METHOD FOR PREPARING SAME, AND SENSOR

MULTI-LEVEL MEMS PROCESS

MICROELECTROMECHANICAL COMPONENT

SENSOR SYSTEM WITH A MICROELECTROMECHANICAL SENSOR ELEMENT AND METH...

MICROELECTROMECHANICAL ACOUSTIC COMPONENT

DOUBLE LAYER MEMS DEVICES AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH MOVABLE MEMBRANE

MICROMECHANICAL DIAPHRAGM SYSTEM

MEMS DEVICE AND MANUFACTURING METHOD THEREOF

RESONANT SENSOR SYSTEM AND METHOD FOR OPERATING A RESONANT SENSOR S...

DIRECTIONAL MEMS MICROPHONE