Shape of solder

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CPC
H05K2203/0465

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0465Shape of solder

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component mounting substrate and manufacturing method th...
- Patent number 11,516,923
- Issue date Nov 29, 2022
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- F21 - LIGHTING
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,304,307
- Issue date Apr 12, 2022
- Ibiden Co., Ltd.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead free solder columns and methods for making same
- Patent number 10,937,752
- Issue date Mar 2, 2021
- TOPLINE CORPORATION
- Martin B. Hart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrates with ultra fine pitch flip chip bumps
- Patent number 10,779,417
- Issue date Sep 15, 2020
- Zhuhai ACCESS Semiconductor Co., Ltd.
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic board and mounting sheet
- Patent number 10,660,216
- Issue date May 19, 2020
- Lenovo (Singapore) Pte. Ltd.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic part, circuit substrate, and image fo...
- Patent number 10,492,304
- Issue date Nov 26, 2019
- Canon Kabushiki Kaisha
- Masayuki Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder columns and methods for making same
- Patent number 10,477,698
- Issue date Nov 12, 2019
- TOPLINE CORPORATION
- Martin B. Hart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure mounted with electronic component
- Patent number 10,342,130
- Issue date Jul 2, 2019
- Murata Manufacturing Co., Ltd.
- Kiyoyuki Nakagawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Connection structure and image pickup apparatus
- Patent number 10,327,335
- Issue date Jun 18, 2019
- Olympus Corporation
- Takahiro Shimohata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable terminal and a component mounting method
- Patent number 10,257,332
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- Manho Kim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,229,790
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 10,076,042
- Issue date Sep 11, 2018
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor component, semiconductor-mounted product including th...
- Patent number 9,925,612
- Issue date Mar 27, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yasuo Fukuhara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate
- Patent number 9,918,381
- Issue date Mar 13, 2018
- Murata Manufacturing Co., Ltd.
- Satoru Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buttoned soldering pad for use with fine-pitch hot bar soldering
- Patent number 9,900,982
- Issue date Feb 20, 2018
- Finisar Corporation
- Henry Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,837,369
- Issue date Dec 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu Shimote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-mounted structure
- Patent number 9,756,728
- Issue date Sep 5, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting member, electronic component, and method for manufacturing...
- Patent number 9,673,141
- Issue date Jun 6, 2017
- Canon Kabushiki Kaisha
- Ichiro Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 9,505,613
- Issue date Nov 29, 2016
- NUVOTRONICS, INC.
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Printed wiring board, printed circuit board, and method for manufac...
- Patent number 9,474,166
- Issue date Oct 18, 2016
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor and board having the same mounted thereon
- Patent number 9,384,893
- Issue date Jul 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jong Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of mounting components on the prin...
- Patent number 9,345,133
- Issue date May 17, 2016
- Canon Kabushiki Kaisha
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 9,018,761
- Issue date Apr 28, 2015
- Panasonic Corporation
- Kouji Oomori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing electronic device having contact elements with a spec...
- Patent number 8,871,630
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for solder flow control in three-dimensional mi...
- Patent number 8,866,300
- Issue date Oct 21, 2014
- Nuvotronics, LLC
- David W. Sherrer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Ceramic circuit board and process for producing same
- Patent number 8,785,785
- Issue date Jul 22, 2014
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level chip scale package
- Patent number 8,710,664
- Issue date Apr 29, 2014
- Volterra Semiconductor Corporation
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic component
- Patent number 8,607,446
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Fukuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a substrate, substrate, device provided wit...
- Patent number 8,309,859
- Issue date Nov 13, 2012
- Renesas Electronics Corporation
- Chiho Ogihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Generating Spray Patterns, Electronic Device,...
- Publication number 20240244759
- Publication date Jul 18, 2024
- VAYO (SHANGHAI) TECHNOLOGY CO., LTD.
- Yongjian QU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...
- Publication number 20240147624
- Publication date May 2, 2024
- Canon Kabushiki Kaisha
- NORITAKE TSUBOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...
- Publication number 20230134246
- Publication date May 4, 2023
- Shinko Electric Industries Co., Ltd.
- Hikaru Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20210037660
- Publication date Feb 4, 2021
- IBIDEN CO., LTD.
- Satoru Kawai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...
- Publication number 20200367365
- Publication date Nov 19, 2020
- Koito Manufacturing Co., Ltd.
- Shinya Kusazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET
- Publication number 20200163227
- Publication date May 21, 2020
- LENOVO (SINGAPORE) PTE. LTD.
- Tadashi Kosuga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180047695
- Publication date Feb 15, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshikazu SHIMOTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Ultra Fine Pitch Flip Chip Bumps
- Publication number 20170374747
- Publication date Dec 28, 2017
- Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies C...
- Dror Hurwitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...
- Publication number 20140318850
- Publication date Oct 30, 2014
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20140291385
- Publication date Oct 2, 2014
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING INTEGRATED CIRCUIT PAC...
- Publication number 20140284080
- Publication date Sep 25, 2014
- Tech-Front (Shanghai) Computer Co. Ltd.
- Jing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISK HAVING AN ELECTRIC CONNECTING ELEMENT
- Publication number 20140182932
- Publication date Jul 3, 2014
- SAINT-GOBAIN GLASS FRANCE
- Harald Cholewa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...
- Publication number 20140174795
- Publication date Jun 26, 2014
- Canon Kabushiki Kaisha
- Keigo Nakazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE MODULE
- Publication number 20130062111
- Publication date Mar 14, 2013
- UNIVERSAL GLOBAL SCIENTIFIC INDUSTRIAL CO., LTD.
- HSUN-FA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Chip Scale Package
- Publication number 20130026638
- Publication date Jan 31, 2013
- Efren M. Lacap
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20120168209
- Publication date Jul 5, 2012
- Toshiba Materials Co., Ltd.
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED BOARD AND ELECTRONIC EQUIPMENT INCORPORATING THE PRINTED BOARD
- Publication number 20110279990
- Publication date Nov 17, 2011
- Makoto Hirano
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE...
- Publication number 20110269306
- Publication date Nov 3, 2011
- KENJI FUKUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...
- Publication number 20110057309
- Publication date Mar 10, 2011
- Junichi KASAI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100181669
- Publication date Jul 22, 2010
- Yasuhiko Tanaka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit module and process for producing the same
- Publication number 20100126008
- Publication date May 27, 2010
- MITSUBISHI ELECTRIC CORPORATION
- Yoichi Kitamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100123231
- Publication date May 20, 2010
- NEC Electronics Corporation
- Kouhei TAKAHASHI
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP
- Publication number 20100044416
- Publication date Feb 25, 2010
- NEC Corporation
- Kenta OGAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BOARD UNIT AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20100038123
- Publication date Feb 18, 2010
- FUJITSU LIMITED
- Takahiro KITAGAWA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing a substrate, substrate, device provided wit...
- Publication number 20100035021
- Publication date Feb 11, 2010
- NEC Electronics Corporation
- Chiho Ogihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BGA PACKAGE
- Publication number 20100007008
- Publication date Jan 14, 2010
- AKIHIRO SANO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...
- Publication number 20090289359
- Publication date Nov 26, 2009
- Samsung Electronics Co., Ltd.
- Chul-Yong Jang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device
- Publication number 20090267217
- Publication date Oct 29, 2009
- Panasonic Corporation
- Kimihito Kuwabara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Shape of solder

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component mounting substrate and manufacturing method th...

Printed wiring board and method for manufacturing printed wiring board

Lead free solder columns and methods for making same

Substrates with ultra fine pitch flip chip bumps

Method of manufacturing electronic board and mounting sheet

Method of mounting electronic part, circuit substrate, and image fo...

Solder columns and methods for making same

Structure mounted with electronic component

Connection structure and image pickup apparatus

Portable terminal and a component mounting method

Composite electronic component and board having the same

Devices and methods for solder flow control in three-dimensional mi...

Semiconductor component, semiconductor-mounted product including th...

Component-embedded substrate

Buttoned soldering pad for use with fine-pitch hot bar soldering

Semiconductor device and manufacturing method thereof

Component-mounted structure

Mounting member, electronic component, and method for manufacturing...

Substrate

Devices and methods for solder flow control in three-dimensional mi...

Printed wiring board, printed circuit board, and method for manufac...

Multilayer ceramic capacitor and board having the same mounted thereon

Printed circuit board and method of mounting components on the prin...

Semiconductor device

Manufacturing electronic device having contact elements with a spec...

Devices and methods for solder flow control in three-dimensional mi...

Ceramic circuit board and process for producing same

Wafer-level chip scale package

Method of manufacturing an electronic component

Method of manufacturing a substrate, substrate, device provided wit...

Patents Applicationslast 30 patents

Method and System for Generating Spray Patterns, Electronic Device,...

ELECTRONIC MODULE, ELECTRONIC APPARATUS, AND METHOD OF MANUFACTURIN...

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING CI...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD TH...

METHOD OF MANUFACTURING ELECTRONIC BOARD AND MOUNTING SHEET

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Substrates with Ultra Fine Pitch Flip Chip Bumps

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING INTEGRATED CIRCUIT PAC...

DISK HAVING AN ELECTRIC CONNECTING ELEMENT

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFAC...

STACKED SUBSTRATE MODULE

Wafer-Level Chip Scale Package

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

PRINTED BOARD AND ELECTRONIC EQUIPMENT INCORPORATING THE PRINTED BOARD

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE...

STRUCTURE, METHOD AND SYSTEM FOR ASSESSING BONDING OF ELECTRODES IN...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Circuit module and process for producing the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING ELECTRONIC COMPONENTS HAVING BUMP

BOARD UNIT AND MANUFACTURING METHOD FOR THE SAME

Method of manufacturing a substrate, substrate, device provided wit...

BGA PACKAGE

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SEMICONDUCTO...

Semiconductor device