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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/80123Shape or position of the body

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Patents Grantslast 30 patents

Information Patent Grant
Wafer bonding apparatus and method
- Patent number 11,955,454
- Issue date Apr 9, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system
- Patent number 10,840,213
- Issue date Nov 17, 2020
- Tokyo Electron Limited
- Masataka Matsunaga
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor device manufacturing method and manufacturing apparatus
- Patent number 9,123,717
- Issue date Sep 1, 2015
- Kabushiki Kaisha Toshiba
- Kenro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor circuit substrate
- Patent number 8,471,377
- Issue date Jun 25, 2013
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING
- Publication number 20240347501
- Publication date Oct 17, 2024
- Haris Khan Niazi
- G05 - CONTROLLING REGULATING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...
- Publication number 20240312820
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Yoshio MIZUTA
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20240194637
- Publication date Jun 13, 2024
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME
- Publication number 20230343743
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING APPARATUS AND METHOD
- Publication number 20230131499
- Publication date Apr 27, 2023
- Yangtze Memory Technologies Co., Ltd.
- Guoliang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK AND PLACE METHOD AND APPARATUS THEREOF
- Publication number 20230025157
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20140242779
- Publication date Aug 28, 2014
- Kabushiki Kaisha Toshiba
- Kenro NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...
- Publication number 20120032296
- Publication date Feb 9, 2012
- Mitsubishi Electric Corporation
- Naoki Kosaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Shape or position of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer bonding apparatus and method

Bonding system

Semiconductor device manufacturing method and manufacturing apparatus

Semiconductor device and semiconductor circuit substrate

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR DIE-SHAPE MODIFICATION BONDING

SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING S...

WAFER BONDING APPARATUS AND METHOD

FLIP-CHIP BONDING APPARATUS AND METHOD OF USING THE SAME

WAFER BONDING APPARATUS AND METHOD

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

PICK AND PLACE METHOD AND APPARATUS THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CIRCUIT SUBSTRATE, AND METHOD O...