Shape

Industry

CPC
H01L2224/78314

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78314Shape

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing wire bonding structure, wire bonding struc...
- Patent number 10,115,699
- Issue date Oct 30, 2018
- Rohm Co., Ltd.
- Kazuya Ikoma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure of semiconductor device and wire bonding method
- Patent number 9,379,085
- Issue date Jun 28, 2016
- Rohm Co., Ltd.
- Ryuji Tsubaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting blade for a wire bonding system
- Patent number 8,141,765
- Issue date Mar 27, 2012
- Orthodyne Electronics Corporation
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser bonding tool with improved bonding accuracy
- Patent number 7,872,208
- Issue date Jan 18, 2011
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,717,100
- Issue date Apr 6, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for laser welding of ribbons
- Patent number 6,501,043
- Issue date Dec 31, 2002
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test and tear-away bond pad design
- Patent number 5,891,745
- Issue date Apr 6, 1999
- Honeywell Inc.
- Thomas J. Dunaway
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch capillary/wedge bonding tool
- Patent number 5,558,270
- Issue date Sep 24, 1996
- Kulicke & Soffa Investments, Inc.
- Beni Nachon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wedge bump bonding apparatus and method
- Patent number 5,364,004
- Issue date Nov 15, 1994
- Hughes Aircraft Company
- R. Paul Davidson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testable ribbon bonding method and wedge bonding tool for microcirc...
- Patent number 5,007,576
- Issue date Apr 16, 1991
- Hughes Aircraft Company
- Helen Congleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3627192
- Patent number 3,627,192
- Issue date Dec 14, 1971
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20130119111
- Publication date May 16, 2013
- Orthodyne Electronics Corporation
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chip Mounting Structure and Flip-chip Mounting Method
- Publication number 20120273942
- Publication date Nov 1, 2012
- Japan Aviation Electronics Industry ,Limited
- Daisuke Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIBBON BONDING TOOLS AND METHODS OF USING THE SAME
- Publication number 20110290859
- Publication date Dec 1, 2011
- Orthodyne Electronics Corporation
- Mark A. Delsman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING BLADE FOR A WIRE BONDING SYSTEM
- Publication number 20110266331
- Publication date Nov 3, 2011
- Orthodyne Electronics Corporation
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD
- Publication number 20110241224
- Publication date Oct 6, 2011
- ROHM CO., LTD.
- Ryuji TSUBAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION
- Publication number 20090127317
- Publication date May 21, 2009
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser bonding tool with improved bonding accuracy
- Publication number 20060219672
- Publication date Oct 5, 2006
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for laser welding of ribbons for electrical co...
- Publication number 20040256367
- Publication date Dec 23, 2004
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for laser welding of ribbons
- Publication number 20030127434
- Publication date Jul 10, 2003
- Medtronic, Inc.
- David A. Ruben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing wire bonding structure, wire bonding struc...

Wire bonding structure of semiconductor device and wire bonding method

Cutting blade for a wire bonding system

Laser bonding tool with improved bonding accuracy

Apparatus and method for laser welding of ribbons

Apparatus and method for laser welding of ribbons

Test and tear-away bond pad design

Fine pitch capillary/wedge bonding tool

Wedge bump bonding apparatus and method

Testable ribbon bonding method and wedge bonding tool for microcirc...

3627192

Patents Applicationslast 30 patents

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

Flip-chip Mounting Structure and Flip-chip Mounting Method

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

CUTTING BLADE FOR A WIRE BONDING SYSTEM

WIRE BONDING STRUCTURE OF SEMICONDUCTOR DEVICE AND WIRE BONDING METHOD

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Laser bonding tool with improved bonding accuracy

Apparatus and method for laser welding of ribbons for electrical co...

Apparatus and method for laser welding of ribbons