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H01L2224/3305

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/3305Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive film sheet and semiconductor package including the same
- Patent number 12,062,633
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and display device using the same
- Patent number 12,021,056
- Issue date Jun 25, 2024
- LG Display Co., Ltd.
- Chang Hyun Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,955,453
- Issue date Apr 9, 2024
- Ultra Display Technology Corp.
- Hsien-Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,705,423
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and methods of manufacturing the same
- Patent number 11,658,170
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,387,209
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,854,581
- Issue date Dec 1, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing 3DIC structure
- Patent number 10,797,015
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack assembly using an edge separation structure for connectiv...
- Patent number 10,734,362
- Issue date Aug 4, 2020
- Littelfuse, Inc.
- Elmar Wisotzki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC structure and method of manufacturing the same
- Patent number 10,475,762
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer board and electronic device
- Patent number 10,354,939
- Issue date Jul 16, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board element and method for producing a printed ci...
- Patent number 10,121,737
- Issue date Nov 6, 2018
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,773,527
- Issue date Sep 26, 2017
- TOSHIBA MEMORY CORPORATION
- Itaru Yamaguchi
- G11 - INFORMATION STORAGE
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with direct bond copper substrate
- Patent number 9,287,231
- Issue date Mar 15, 2016
- DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Voidlessly encapsulated semiconductor die package
- Patent number 9,153,516
- Issue date Oct 6, 2015
- Microsemi Corporation
- Cecil Kent Walters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating a flip chip package for dram with two underf...
- Patent number 8,951,845
- Issue date Feb 10, 2015
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill layers
- Patent number 8,816,509
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and electronic device
- Patent number 8,787,033
- Issue date Jul 22, 2014
- Aisin Aw Co., Ltd.
- Hitoshi Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package for DRAM with two underfill materials
- Patent number 8,637,992
- Issue date Jan 28, 2014
- Invensas Corporation
- Kazuo Sakuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit connector apparatus and method therefor
- Patent number 8,508,035
- Issue date Aug 13, 2013
- NXP B.V.
- Roelf Anco Jacob Groenhuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting structure
- Patent number 8,497,432
- Issue date Jul 30, 2013
- Seiko Epson Corporation
- Nobuaki Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked semiconductor package
- Patent number 8,399,975
- Issue date Mar 19, 2013
- SK Hynix Inc.
- Jong Hyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic components
- Patent number 8,230,590
- Issue date Jul 31, 2012
- Fujitsu Semiconductor Limited
- Takao Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321808
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Kazuki MATSUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20240312945
- Publication date Sep 19, 2024
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240170360
- Publication date May 23, 2024
- MEDIATEK INC.
- Chun-Yin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES
- Publication number 20240079371
- Publication date Mar 7, 2024
- GLOBALFOUNDRIES U.S. Inc.
- John C. MALINOWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055413
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Gunho CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055398
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047331
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...
- Publication number 20240047333
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Liquid Metal as Heat-Dissipation Media and Method For...
- Publication number 20240038627
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...
- Publication number 20230411235
- Publication date Dec 21, 2023
- STATS ChipPac Semiconductor (Jiangyin) Co., LTD.
- MAN BAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361073
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230307410
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230197553
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- KYUNGDON MUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS
- Publication number 20230098993
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Jooyoung Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Multiple Types of Underfill and Method Forming The Same
- Publication number 20220367413
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20220352130
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- JEONG HYUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20220310576
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- Wei Tsung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220302070
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package on Package Structure, Packaging Method Thereof, and El...
- Publication number 20220262751
- Publication date Aug 18, 2022
- Huawei Technologies Co., Ltd
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189902
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Joungphil Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
- Publication number 20210398933
- Publication date Dec 23, 2021
- LG Display Co., Ltd.
- Chang Hyun SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI LAYER THERMAL INTERFACE MATERIAL
- Publication number 20200411411
- Publication date Dec 31, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with multiple types of underfill and method forming the same

Non-conductive film sheet and semiconductor package including the same

Electronic device and display device using the same

Package

Electronic device

Package structure

Semiconductor package structure and methods of manufacturing the same

Package structure

Multi layer thermal interface material

Die stack assembly using an edge separation structure for connectiv...

Method of manufacturing 3DIC structure

Die stack assembly using an edge separation structure for connectiv...

3DIC structure and method of manufacturing the same

Multilayer board and electronic device

Printed circuit board element and method for producing a printed ci...

Semiconductor device

Solder fatigue arrest for wafer level package

Package structure with direct bond copper substrate

Voidlessly encapsulated semiconductor die package

Methods of fabricating a flip chip package for dram with two underf...

Semiconductor package including underfill layers

Electronic component and electronic device

Flip chip package for DRAM with two underfill materials

Circuit connector apparatus and method therefor

Electronic component mounting structure

Stacked semiconductor package

Method for mounting electronic components

Patents Applicationslast 30 patents

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

THERMAL PERFORMANCE FOR RADIO FREQUENCY (RF) CHIP PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

WINDOW BALL GRID ARRAY (WBGA) PACKAGE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

Packages with Liquid Metal as Heat-Dissipation Media and Method For...

ELASTIC HEAT SPREADER FOR CHIP PACKAGE, PACKAGE STRUCTURE AND PACKA...

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING ADHESIVE MEMBERS

Packages With Multiple Types of Underfill and Method Forming The Same

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHODS OF MANUFACTURING THE SAME

PACKAGE STRUCTURE

Chip Package on Package Structure, Packaging Method Thereof, and El...

NON-CONDUCTIVE FILM SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME

MULTI LAYER THERMAL INTERFACE MATERIAL