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H01L2224/75302

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/75302Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Chip bonding apparatus
- Patent number 11,482,505
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Jae-Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding and placement tools for bonding machines, bonding machines...
- Patent number 11,011,493
- Issue date May 18, 2021
- Kulicke and Soffa Industries, Inc.
- Ai Jun Song
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Photoelectric conversion device and manufacturing method and appara...
- Patent number 10,950,391
- Issue date Mar 16, 2021
- Kabushiki Kaisha Toshiba
- Shigehiko Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Jig for bonding a semiconductor chip, apparatus for bonding a semic...
- Patent number 10,410,990
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,616,433
- Issue date Dec 31, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compress bonding
- Patent number 8,556,158
- Issue date Oct 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode bonding method and part mounting apparatus
- Patent number 8,449,712
- Issue date May 28, 2013
- Panasonic Corporation
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compress bonding
- Patent number 8,381,965
- Issue date Feb 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming low stress joints using thermal compress bonding
- Patent number 8,360,303
- Issue date Jan 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal compressive bond head
- Patent number 8,177,862
- Issue date May 15, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien Ling Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Mounting device for electrical component
- Patent number 7,857,028
- Issue date Dec 28, 2010
- Sony Corporation
- Shiyuki Kanisawa
- B30 - PRESSES
Information Patent Grant
Head assembly, disk unit, and bonding method and apparatus
- Patent number 7,347,347
- Issue date Mar 25, 2008
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Underfill fluxing curative
- Patent number 7,213,739
- Issue date May 8, 2007
- Fry's Metals, Inc.
- Mark Wilson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and stacked semiconductor device that can incr...
- Patent number 7,196,418
- Issue date Mar 27, 2007
- Fujitsu Limited
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Head assembly having integrated circuit chip covered by layer which...
- Patent number 6,885,522
- Issue date Apr 26, 2005
- Fujitsu Limited
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and device for frictional connection and holding tool used f...
- Patent number 6,706,130
- Issue date Mar 16, 2004
- Matsushita Electric Industrial Co., Ltd.
- Shozo Minamitani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding method
- Patent number 6,565,687
- Issue date May 20, 2003
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding method and ultrasonic bonding apparatus
- Patent number 6,460,591
- Issue date Oct 8, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip junction nozzle
- Patent number 6,382,495
- Issue date May 7, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip mounting method and apparatus therefor
- Patent number 6,212,768
- Issue date Apr 10, 2001
- NEC Corporation
- Tomoo Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip junction nozzle
- Patent number 6,189,760
- Issue date Feb 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 6,169,330
- Issue date Jan 2, 2001
- Astrulux, Inc.
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for parallel alignment of a chip to substrate
- Patent number 6,146,912
- Issue date Nov 14, 2000
- TRW Inc.
- Thomas S. Tighe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for face-down bonding
- Patent number 6,018,189
- Issue date Jan 25, 2000
- NEC Corporation
- Hideki Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for packaging high temperature solid state ele...
- Patent number 5,930,666
- Issue date Jul 27, 1999
- Astralux, Incorporated
- Jacques Isaac Pankove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a solder drawing layer
- Patent number 5,726,501
- Issue date Mar 10, 1998
- Sharp Kabushiki Kaisha
- Hiroshi Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Individual chip joining machine
- Patent number 4,160,893
- Issue date Jul 10, 1979
- International Business Machines Corporation
- Robert H. Meyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...
- Publication number 20230378123
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...
- Publication number 20200312811
- Publication date Oct 1, 2020
- Samsung Electronics Co., Ltd.
- Jae-Cheol KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Compress Bonding
- Publication number 20130126591
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20130128486
- Publication date May 23, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Compressive Bond Head
- Publication number 20120088362
- Publication date Apr 12, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Low Stress Joints Using Thermal Compress Bonding
- Publication number 20120021183
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuei-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Compress Bonding
- Publication number 20120018494
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bor-Ping Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS
- Publication number 20090145546
- Publication date Jun 11, 2009
- PANASONIC CORPORATION
- Yoshimasa Inamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mounting device for electrical component
- Publication number 20080035274
- Publication date Feb 14, 2008
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Shiyuki Kanisawa
- B30 - PRESSES
Information Patent Application
Underfill fluxing curative
- Publication number 20050218195
- Publication date Oct 6, 2005
- Fry's Metals, Inc.
- Mark Wilson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and stacked semiconductor device that can incr...
- Publication number 20050161793
- Publication date Jul 28, 2005
- Takao Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System to couple integrated circuit die to substrate
- Publication number 20050095744
- Publication date May 5, 2005
- Song-Hua Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Head assembly, disk unit, and bonding method and apparatus
- Publication number 20050057856
- Publication date Mar 17, 2005
- FUJITSU LIMITED
- Hidehiko Kira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Product comprising a substrate and a chip attached to the substrate
- Publication number 20040140122
- Publication date Jul 22, 2004
- Rainer Moll
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Ultrasonic bonding method
- Publication number 20030029543
- Publication date Feb 13, 2003
- TDK Corp.
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Head assembly of a disk apparatus having a head IC chip mounted on...
- Publication number 20020195476
- Publication date Dec 26, 2002
- Fujitsu Limited
- Shunji Baba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip junction nozzle
- Publication number 20010011668
- Publication date Aug 9, 2001
- TDK CORPORATION 13-1, Nihonbashi 1-chome, Chuo-ku, Tokyo, Japan
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Chip bonding apparatus

Bonding and placement tools for bonding machines, bonding machines...

Bonding apparatus, bonding system, bonding method and storage medium

Photoelectric conversion device and manufacturing method and appara...

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Jig for bonding a semiconductor chip, apparatus for bonding a semic...

Forming low stress joints using thermal compress bonding

Thermal compress bonding

Electrode bonding method and part mounting apparatus

Thermal compress bonding

Forming low stress joints using thermal compress bonding

Thermal compressive bond head

Mounting device for electrical component

Head assembly, disk unit, and bonding method and apparatus

Underfill fluxing curative

Semiconductor device and stacked semiconductor device that can incr...

Head assembly having integrated circuit chip covered by layer which...

Method and device for frictional connection and holding tool used f...

Ultrasonic bonding method

Ultrasonic bonding method and ultrasonic bonding apparatus

Chip junction nozzle

Flip chip mounting method and apparatus therefor

Chip junction nozzle

Method and apparatus for packaging high temperature solid state ele...

Method for parallel alignment of a chip to substrate

Lead frame for face-down bonding

Method and apparatus for packaging high temperature solid state ele...

Semiconductor device having a solder drawing layer

Individual chip joining machine

Patents Applicationslast 30 patents

SYSTEMS FOR FLUXLESS BONDING USING AN ATMOSPHERIC PRESSURE PLASMA A...

CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBL...

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

Thermal Compress Bonding

Forming Low Stress Joints Using Thermal Compress Bonding

Thermal Compressive Bond Head

Forming Low Stress Joints Using Thermal Compress Bonding

Thermal Compress Bonding

ELECTRODE BONDING METHOD AND PART MOUNTING APPARATUS

Mounting device for electrical component

Underfill fluxing curative

Semiconductor device and stacked semiconductor device that can incr...

System to couple integrated circuit die to substrate

Head assembly, disk unit, and bonding method and apparatus

Product comprising a substrate and a chip attached to the substrate

Ultrasonic bonding method

Head assembly of a disk apparatus having a head IC chip mounted on...

Chip junction nozzle