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H01L2224/85385

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/85385Shape

Industries

Patents Grantslast 30 patents

Information Patent Grant
Multirow gull-wing package for microelectronic devices
- Patent number 11,335,570
- Issue date May 17, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,504,869
- Issue date Dec 10, 2019
- Renesas Electronics Corporation
- Shoji Hashizume
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial mark for chip bonding
- Patent number 10,438,897
- Issue date Oct 8, 2019
- 3M Innovative Properties Company
- Siang Sin Foo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Solid-state device including a conductive bump connected to a metal...
- Patent number 9,966,332
- Issue date May 8, 2018
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,536,859
- Issue date Jan 3, 2017
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming articles including metal structures having maxim...
- Patent number 9,468,986
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES, INC.
- Ernesto Gene de la Garza
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,320,153
- Issue date Apr 19, 2016
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packaging having plurality of wires bonding to...
- Patent number 9,070,682
- Issue date Jun 30, 2015
- Rohm Co., Ltd.
- Hiroyuki Kaneda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the wafer-level integration of shape memory alloy wires
- Patent number 9,054,224
- Issue date Jun 9, 2015
- Senseair AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 9,006,874
- Issue date Apr 14, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed wiring board
- Patent number 8,935,850
- Issue date Jan 20, 2015
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,739,401
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Circuit member, manufacturing method for circuit members, semicondu...
- Patent number 8,742,554
- Issue date Jun 3, 2014
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame with grooved lead finger
- Patent number 8,643,159
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Brace for wire bond
- Patent number 8,524,529
- Issue date Sep 3, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package including a cavity with a plurality of...
- Patent number 8,471,285
- Issue date Jun 25, 2013
- Lextar Electronics Corp.
- Chin-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit member, manufacturing method of the circuit member, and sem...
- Patent number 8,420,446
- Issue date Apr 16, 2013
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,410,376
- Issue date Apr 2, 2013
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 8,378,230
- Issue date Feb 19, 2013
- Ibiden Co., Ltd.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding structure and method that eliminates special wire bond...
- Patent number 8,269,356
- Issue date Sep 18, 2012
- Stats Chippac Ltd.
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,178,955
- Issue date May 15, 2012
- Panasonic Corporation
- Kenichi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking
- Patent number 8,174,127
- Issue date May 8, 2012
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated-type LED and manufacturing method thereof
- Patent number 8,143,641
- Issue date Mar 27, 2012
- Chiu-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing device stacking and met...
- Patent number 8,120,187
- Issue date Feb 21, 2012
- Stats Chippac Ltd.
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode package with roughened surface portions of the...
- Patent number 8,030,674
- Issue date Oct 4, 2011
- Lextar Electronics Corp.
- Chin-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct via wire bonding and method of assembling the same
- Patent number 8,021,931
- Issue date Sep 20, 2011
- Stats Chippac, Inc.
- Dario S. Filoteo, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of manufacturing same
- Patent number 7,964,448
- Issue date Jun 21, 2011
- Infineon Technologies AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device
- Patent number 7,939,933
- Issue date May 10, 2011
- Panasonic Corporation
- Kenichi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming shielding along a profil...
- Patent number 7,880,275
- Issue date Feb 1, 2011
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20220277965
- Publication date Sep 1, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
- Publication number 20200203184
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
LEADFRAME WITH LEAD OF VARYING THICKNESS
- Publication number 20140367838
- Publication date Dec 18, 2014
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20140120664
- Publication date May 1, 2014
- Wai Keong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING
- Publication number 20140091465
- Publication date Apr 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- KAZUNORI HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130334687
- Publication date Dec 19, 2013
- Hiroyuki KANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES
- Publication number 20130292856
- Publication date Nov 7, 2013
- SENSEAIR AB
- Stefan Braun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME WITH GROOVED LEAD FINGER
- Publication number 20130264693
- Publication date Oct 10, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wai Keong WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130248916
- Publication date Sep 26, 2013
- Toyoda Gosei Co., Ltd.
- Yoshinobu Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Including a Plurality of Stacked Semiconduct...
- Publication number 20130200530
- Publication date Aug 8, 2013
- Samsung Electronics Co., Ltd.
- In-sang Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130164440
- Publication date Jun 27, 2013
- IBIDEN CO., LTD.
- Masahiro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRACE FOR WIRE BOND
- Publication number 20120077316
- Publication date Mar 29, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20120077313
- Publication date Mar 29, 2012
- Kabushiki Kaisha Toshiba
- Soichi HOMMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE
- Publication number 20110233594
- Publication date Sep 29, 2011
- LEXTAR ELECTRONICS CORP.
- Chin-Chang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110177657
- Publication date Jul 21, 2011
- PANASONIC CORPORATION
- Kenichi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING
- Publication number 20110147899
- Publication date Jun 23, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...
- Publication number 20110117704
- Publication date May 19, 2011
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...
- Publication number 20110089566
- Publication date Apr 21, 2011
- Rajendra D. Pendse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110067913
- Publication date Mar 24, 2011
- IBIDEN CO., LTD.
- Masahiro KANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110048773
- Publication date Mar 3, 2011
- IBIDEN CO., LTD.
- Masahiro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND MET...
- Publication number 20110012270
- Publication date Jan 20, 2011
- Frederick Rodriguez Dahilig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...
- Publication number 20100325885
- Publication date Dec 30, 2010
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Manufacturing Same
- Publication number 20100065961
- Publication date Mar 18, 2010
- Klaus ELIAN
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Device and Method of Forming Shielding Along a Profil...
- Publication number 20100019359
- Publication date Jan 28, 2010
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100013083
- Publication date Jan 21, 2010
- Samsung Electronics Co., Ltd.
- Kyung-Man KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090294950
- Publication date Dec 3, 2009
- PANASONIC CORPORATION
- Kenichi Itou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE
- Publication number 20090267104
- Publication date Oct 29, 2009
- LIGHTHOUSE TECHNOLOGY CO., LTD
- Chin-Chang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING DIE ATTACH PAD WITH DELAMINATION AND CRACK-ARRESTI...
- Publication number 20090152691
- Publication date Jun 18, 2009
- National Semiconductor Corporation
- Luu T. Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...
- Publication number 20090146280
- Publication date Jun 11, 2009
- Dai Nippon Printing Co., Ltd.
- Yo Shimazaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Multirow gull-wing package for microelectronic devices

Semiconductor device

Fiducial mark for chip bonding

Method for bonding a hermetic module to an electrode array

Solid-state device including a conductive bump connected to a metal...

Semiconductor device packaging having plurality of wires bonding to...

Methods of forming articles including metal structures having maxim...

Printed wiring board and method for manufacturing the same

Semiconductor device packaging having plurality of wires bonding to...

Method for the wafer-level integration of shape memory alloy wires

Lead frame with grooved lead finger

Method of manufacturing printed wiring board

Circuit member, manufacturing method for circuit members, semicondu...

Circuit member, manufacturing method for circuit members, semicondu...

Lead frame with grooved lead finger

Brace for wire bond

Light-emitting diode package including a cavity with a plurality of...

Circuit member, manufacturing method of the circuit member, and sem...

Printed wiring board and method for manufacturing the same

Printed wiring board and method for manufacturing the same

Wire bonding structure and method that eliminates special wire bond...

Semiconductor device

Integrated circuit package system employing device stacking

Integrated-type LED and manufacturing method thereof

Integrated circuit package system employing device stacking and met...

Light-emitting diode package with roughened surface portions of the...

Direct via wire bonding and method of assembling the same

Electronic device and method of manufacturing same

Semiconductor device

Semiconductor device and method of forming shielding along a profil...

Patents Applicationslast 30 patents

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

LEADFRAME WITH LEAD OF VARYING THICKNESS

LEAD FRAME WITH GROOVED LEAD FINGER

LEADFRAME HAVING SLOPED METAL TERMINALS FOR WIREBONDING

SEMICONDUCTOR DEVICE

METHOD FOR THE WAFER-LEVEL INTEGRATION OF SHAPE MEMORY ALLOY WIRES

LEAD FRAME WITH GROOVED LEAD FINGER

SOLID-STATE DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Packages Including a Plurality of Stacked Semiconduct...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

BRACE FOR WIRE BOND

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LIGHT-EMITTING DIODE PACKAGE

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...

WIRE BONDING STRUCTURE AND METHOD THAT ELIMINATES SPECIAL WIRE BOND...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND MET...

CIRCUIT MEMBER, MANUFACTURING METHOD FOR CIRCUIT MEMBERS, SEMICONDU...

Electronic Device and Method of Manufacturing Same

Semiconductor Device and Method of Forming Shielding Along a Profil...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

LIGHT-EMITTING DIODE PACKAGE

LEADFRAME HAVING DIE ATTACH PAD WITH DELAMINATION AND CRACK-ARRESTI...

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEM...