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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/1111Shaping

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, method for producing the same, endosco...
- Patent number 11,444,049
- Issue date Sep 13, 2022
- Sony Corporation
- Osamu Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for extreme performance die attach
- Patent number 11,373,976
- Issue date Jun 28, 2022
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cu pillar cylindrical preform for semiconductor connection
- Patent number 11,101,234
- Issue date Aug 24, 2021
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,566,302
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 10,446,520
- Issue date Oct 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures for assembly of semiconductor structures in...
- Patent number 10,396,269
- Issue date Aug 27, 2019
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure and semiconductor structures for assembly of...
- Patent number 10,242,968
- Issue date Mar 26, 2019
- Massachusetts Institute of Technology
- Rabindra N. Das
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 10,170,444
- Issue date Jan 1, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,163,836
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for stud bump formation
- Patent number 10,147,693
- Issue date Dec 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing metal powder
- Patent number 10,130,995
- Issue date Nov 20, 2018
- Alpha Assembly Solutions Inc.
- Nirmalya Kumar Chaki
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Interconnect structures and methods for fabricating interconnect st...
- Patent number 10,121,754
- Issue date Nov 6, 2018
- Massachusetts Institute of Technology
- William D. Oliver
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing micro pins and isolated conductive micro pin
- Patent number 10,115,690
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,103,121
- Issue date Oct 16, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,103,118
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for interconnect simulation and characterization
- Patent number 10,043,720
- Issue date Aug 7, 2018
- Arizona Board of Regents
- Blake Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device package comprising photo sensitive fill between a...
- Patent number 10,037,941
- Issue date Jul 31, 2018
- QUALCOMM Incorporated
- Vladimir Noveski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 9,875,979
- Issue date Jan 23, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding bare chip dies
- Patent number 9,859,247
- Issue date Jan 2, 2018
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Edsger Constant Pieter Smits
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 9,837,367
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor package interposer with die cavity
- Patent number 9,780,072
- Issue date Oct 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...
- Publication number 20240274564
- Publication date Aug 15, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
- Publication number 20240178208
- Publication date May 30, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Hongzhao DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240105652
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Dae Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Extreme Performance Die Attach
- Publication number 20210202433
- Publication date Jul 1, 2021
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20210082852
- Publication date Mar 18, 2021
- Intel Corporation
- Bradon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...
- Publication number 20200219836
- Publication date Jul 9, 2020
- SONY CORPORATION
- Osamu MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20190157238
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shaped Interconnect Bumps in Semiconductor Devices
- Publication number 20190109110
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MICRO PIN
- Publication number 20190074259
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20180166409
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20180108631
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tall and Fine Pitch Interconnects
- Publication number 20180096960
- Publication date Apr 5, 2018
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Semiconductor Package Interposer with Die Cavity
- Publication number 20180026008
- Publication date Jan 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20170323863
- Publication date Nov 9, 2017
- Amkor Technology, Inc.
- Kyoung Yeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION
- Publication number 20170315444
- Publication date Nov 2, 2017
- Tokyo Ohka Kogyo Co., Ltd.
- Makiko IRIE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
- Publication number 20170287861
- Publication date Oct 5, 2017
- NIPPON MICROMETAL CORPORATION
- Takashi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION
- Publication number 20170162454
- Publication date Jun 8, 2017
- Blake Rogers
- G01 - MEASURING TESTING
Information Patent Application
Conductive External Connector Structure and Method of Forming
- Publication number 20170141059
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...
- Publication number 20170133336
- Publication date May 11, 2017
- Massachusetts Institute of Technology
- William D. Oliver
- B82 - NANO-TECHNOLOGY
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20170005067
- Publication date Jan 5, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MICRO PINS AND ISOLATED CONDUCTIVE MICRO PIN
- Publication number 20160254239
- Publication date Sep 1, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Bowl-shaped solder structure
- Publication number 20150303157
- Publication date Oct 22, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Conductive external connector structure and method of forming

Shaped interconnect bumps in semiconductor devices

Electronic component module, method for producing the same, endosco...

System and method for extreme performance die attach

Packages for semiconductor devices, packaged semiconductor devices,...

Leadframes in semiconductor devices

Conductive micro pin

Cu pillar cylindrical preform for semiconductor connection

Pre-molded leadframes in semiconductor devices

Tall and fine pitch interconnects

Fabrication of solder balls with injection molded solder

Conductive external connector structure and method of forming

Fabrication of solder balls with injection molded solder

3D semiconductor package interposer with die cavity

Interconnect structures for assembly of semiconductor structures in...

Interconnect structure and semiconductor structures for assembly of...

Packages for semiconductor devices, packaged semiconductor devices,...

Conductive external connector structure and method of forming

Methods for stud bump formation

Method for manufacturing metal powder

Interconnect structures and methods for fabricating interconnect st...

Method of manufacturing micro pins and isolated conductive micro pin

Tall and fine pitch interconnects

Fabrication of solder balls with injection molded solder

Systems and methods for interconnect simulation and characterization

Integrated device package comprising photo sensitive fill between a...

Conductive external connector structure and method of forming

Method for bonding bare chip dies

Fabrication of solder balls with injection molded solder

3D semiconductor package interposer with die cavity

Patents Applicationslast 30 patents

MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

MANUFACTURING METHOD OF LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METAL PILLAR FOR CONDUCTIVE CONNECTION

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Leadframes in Semiconductor Devices

Pre-Molded Leadframes in Semiconductor Devices

System and Method for Extreme Performance Die Attach

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Shaped Interconnect Bumps in Semiconductor Devices

CONDUCTIVE MICRO PIN

TALL AND FINE PITCH INTERCONNECTS

Conductive External Connector Structure and Method of Forming

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

Tall and Fine Pitch Interconnects

3D Semiconductor Package Interposer with Die Cavity

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CHEMICALLY AMPLIFIED POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION

Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION

SYSTEMS AND METHODS FOR INTERCONNECT SIMULATION AND CHARACTERIZATION

Conductive External Connector Structure and Method of Forming

INTERCONNECT STRUCTURES AND METHODS FOR FABRICATING INTERCONNECT ST...

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

METHOD OF MANUFACTURING MICRO PINS AND ISOLATED CONDUCTIVE MICRO PIN

Bowl-shaped solder structure