Silver [Ag] as principal constituent

Industry

CPC
H01L2224/05639

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05639Silver [Ag] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Display substrate and preparation method thereof, and display appar...
- Patent number 12,199,081
- Issue date Jan 14, 2025
- BOE Technology Group Co., Ltd.
- Wenqu Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 12,191,267
- Issue date Jan 7, 2025
- Adeia Semiconductor Technologies, LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,183,715
- Issue date Dec 31, 2024
- NANYA TECHNOLOGY CORPORATION
- Ting-Cih Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device
- Patent number 12,173,207
- Issue date Dec 24, 2024
- Celanese Mercury Holdings Inc.
- Yumi Matsuura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,107,060
- Issue date Oct 1, 2024
- Intel Corproation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing same
- Patent number 12,100,680
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Luguang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor structure and method
- Patent number 12,068,287
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with inductors in direct bonding regions
- Patent number 12,062,631
- Issue date Aug 13, 2024
- Intel Corporation
- Adel A Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxidation and corrosion prevention in semiconductor devices and sem...
- Patent number 12,051,661
- Issue date Jul 30, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy Yeduru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting substrate, method of manufacturing light-emitting su...
- Patent number 12,046,591
- Issue date Jul 23, 2024
- BOE Technology Group Co., Ltd.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a dual material redistribution line
- Patent number 12,027,447
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Anhao Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for low temperature bonding using nanoparticles
- Patent number 12,027,487
- Issue date Jul 2, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste-based conductive device and manufacturing method t...
- Patent number 12,009,334
- Issue date Jun 11, 2024
- Shenzhen Guangshe Zhaoming Technology Co., LTD
- Jianwei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaged die and RDL with bonding structures therebetween
- Patent number 11,996,401
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 11,990,435
- Issue date May 21, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,973,016
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Elvir Kahrimanovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for low temperature bonding using nanoparticles
- Patent number 11,973,056
- Issue date Apr 30, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silver sintering preparation and the use thereof for the connecting...
- Patent number 11,938,543
- Issue date Mar 26, 2024
- Heraeus Deutschland GmbH & Co. KG
- Ly M. Chew
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Display device
- Patent number 11,917,875
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Ki Kyung Youk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-metal contact structure
- Patent number 11,894,326
- Issue date Feb 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a metallization structure
- Patent number 11,876,041
- Issue date Jan 16, 2024
- Infineon Technologies Austria AG
- Oliver Blank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding process with inhibited oxide formation
- Patent number 11,869,870
- Issue date Jan 9, 2024
- SiTime Corporation
- Paul M. Hagelin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE
- Publication number 20250006779
- Publication date Jan 2, 2025
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Nathaniel P. Wyckoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING
- Publication number 20250006674
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cooling Methodology for Package-on-Package Structures
- Publication number 20250006673
- Publication date Jan 2, 2025
- Intel Corporation
- Siva Prasad JANGILI GANGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429222
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240404909
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240395648
- Publication date Nov 28, 2024
- ROHM CO., LTD.
- Kazuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure
- Publication number 20240395750
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jui Shen CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240395744
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...
- Publication number 20240387425
- Publication date Nov 21, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Srinivasa Reddy YEDURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240379639
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Myung Joo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240363566
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS
- Publication number 20240355768
- Publication date Oct 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE
- Publication number 20240339419
- Publication date Oct 10, 2024
- Sumitomo Electric Industries, Ltd.
- Shota SAMBONSUGE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION
- Publication number 20240339422
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che Wei YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
- Publication number 20240312954
- Publication date Sep 19, 2024
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20240304577
- Publication date Sep 12, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240290677
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Gyuseong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240272224
- Publication date Aug 15, 2024
- SK HYNIX INC.
- Hee Sun LEE
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250039
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250038
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240234361
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kohei TANIKAWA
- H01 - BASIC ELECTRIC ELEMENTS

Silver [Ag] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display substrate and preparation method thereof, and display appar...

Nanowire bonding interconnect for fine-pitch microelectronics

Method for manufacturing semiconductor structure

Method of manufacturing an electronic device

Bonding member for semiconductor device

Microelectronic assemblies with inductors in direct bonding regions

Semiconductor structure and method for preparing same

Semiconductor package including test pad and bonding pad structure...

High reliability lead-free solder alloys for harsh environment elec...

Semiconductor chip with redundant thru-silicon-vias

Stacked semiconductor structure and method

Microelectronic assemblies with inductors in direct bonding regions

Oxidation and corrosion prevention in semiconductor devices and sem...

Light-emitting substrate, method of manufacturing light-emitting su...

Chip package, method of forming a chip package and method of formin...

Semiconductor device having a dual material redistribution line

Structures for low temperature bonding using nanoparticles

Insulating paste-based conductive device and manufacturing method t...

Sensor package and manufacturing method thereof

Packaged die and RDL with bonding structures therebetween

Multiple plated via arrays of different wire heights on a same subs...

Fingerprint sensor and manufacturing method thereof

Semiconductor device

Methods for low temperature bonding using nanoparticles

Silver sintering preparation and the use thereof for the connecting...

Display device

Multi-metal contact structure

Semiconductor device and method of stacking semiconductor die for s...

Semiconductor device having a metallization structure

Bonding process with inhibited oxide formation

Patents Applicationslast 30 patents

BALL-BOND ARRANGEMENT

CAPACITOR STRUCTURE INTEGRATED WITH CONTACT PAD STRUCTURE

METHODS AND STRUCTURES FOR LOW TEMPERATURE HYBRID BONDING

Cooling Methodology for Package-on-Package Structures

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

Three-Dimensional Integrated Circuit with Hybrid Bond Metal Structure

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

OXIDATION AND CORROSION PREVENTION IN SEMICONDUCTOR DEVICES AND SEM...

SEMICONDUCTOR PACKAGE

Semiconductor Package Including Test Pad and Bonding Pad Structure...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

MICROELECTRONIC ASSEMBLIES WITH INDUCTORS IN DIRECT BONDING REGIONS

SILICON CARBIDE SEMICONDUCTOR DEVICE

SUPPORTING SEALANT LAYER STRUCTURE FOR STACKED DIE APPLICATION

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE