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SEMICONDUCTOR PACKAGE
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Publication number 20240120299
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Publication date Apr 11, 2024
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Samsung Electronics Co., Ltd.
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JIHOON KIM
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240113066
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Publication date Apr 4, 2024
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Sony Semiconductor Solutions Corporation
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Takashi IMAHIGASHI
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H01 - BASIC ELECTRIC ELEMENTS
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GALVANIC ISOLATION DEVICE
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Publication number 20240113094
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Publication date Apr 4, 2024
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TEXAS INSTRUMENTS INCORPORATED
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Jeffrey Alan West
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H01 - BASIC ELECTRIC ELEMENTS
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ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
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Publication number 20240105667
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Publication date Mar 28, 2024
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TANAKA DENSHI KOGYO K.K.
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Shuichi MITOMA
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C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
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EMBEDDED METAL PADS
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Publication number 20240088072
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Publication date Mar 14, 2024
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Micron Technology, Inc.
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Tsung Han Chiang
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRONIC DEVICE
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Publication number 20240038706
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Publication date Feb 1, 2024
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Sony Semiconductor Solutions Corporation
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Takashi IMAHIGASHI
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY DEVICE
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Publication number 20240038745
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Publication date Feb 1, 2024
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WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
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Zhou ZHANG
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H01 - BASIC ELECTRIC ELEMENTS
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DISPLAY PANEL
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Publication number 20240038947
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Publication date Feb 1, 2024
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WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
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Qiang LU
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H01 - BASIC ELECTRIC ELEMENTS