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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Smoothing of the dielectric
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Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device including a porous dielectric layer, and metho...
Patent number
11,955,424
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Apr 9, 2024
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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Method of manufacturing semiconductor device and semiconductor devices
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11,955,430
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Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Hsuan Lin
H01 - BASIC ELECTRIC ELEMENTS
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Via patterning for integrated circuits
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11,942,424
Issue date
Mar 26, 2024
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device and method of fabricating the same
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11,908,796
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Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Yu Tseng
H01 - BASIC ELECTRIC ELEMENTS
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Polishing pad, semiconductor fabricating device and fabricating met...
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11,883,926
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Jan 30, 2024
Kioxia Corporation
Takahiko Kawasaki
B24 - GRINDING POLISHING
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Memory device
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11,823,950
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Nov 21, 2023
Winbond Electronics Corp.
Huang-Nan Chen
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and method for forming the same
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11,804,403
Issue date
Oct 31, 2023
United Semiconductor (Xiamen) Co., Ltd.
Ji He Huang
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Method for manufacturing a semiconductor device having a dummy section
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11,798,847
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Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Osamu Koike
H01 - BASIC ELECTRIC ELEMENTS
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Device terminal interconnect structures
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11,791,257
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Oct 17, 2023
Intel Corporation
Sairam Subramanian
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Methods and structures for improved electrical contact between bond...
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11,784,123
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Oct 10, 2023
Intel Corporation
Richard Vreeland
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Semiconductor device
Patent number
11,770,922
Issue date
Sep 26, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Fei Zhou
H01 - BASIC ELECTRIC ELEMENTS
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Self-alignment etching of interconnect layers
Patent number
11,749,561
Issue date
Sep 5, 2023
Applied Materials, Inc.
Suketu Arun Parikh
H01 - BASIC ELECTRIC ELEMENTS
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Methods of forming a semiconductor device with a gate structure hav...
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11,749,753
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Sep 5, 2023
Taiwan Semiconductor Manufacturing Company Limited
Chun-Neng Lin
H01 - BASIC ELECTRIC ELEMENTS
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Method for forming semiconductor device structure with source/drain...
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11,735,470
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Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chun-Hung Liao
H01 - BASIC ELECTRIC ELEMENTS
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Method of semiconductor integrated circuit fabrication
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11,735,477
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Aug 22, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Feng Shieh
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Material for forming organic film, method for forming organic film,...
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11,720,023
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Aug 8, 2023
Shin-Etsu Chemical Co., Ltd.
Daisuke Kori
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Chemical mechanical polishing composition containing composite sili...
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11,718,769
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Aug 8, 2023
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Yi Guo
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Method of forming semiconductor memory device
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11,711,916
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Jul 25, 2023
United Microelectronics Corp.
Yi-Wei Chen
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Method of forming an interconnect structure having an air gap and s...
Patent number
11,682,624
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Szu-Ping Tung
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Interconnect structure and method for manufacturing the interconnec...
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11,637,062
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Apr 25, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Khaderbad Mrunal Abhijith
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Method of integration of a magnetoresistive structure
Patent number
11,631,806
Issue date
Apr 18, 2023
EVERSPIN TECHNOLOGIES, INC.
Kerry Joseph Nagel
H01 - BASIC ELECTRIC ELEMENTS
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Interconnects with tight pitch and reduced resistance
Patent number
11,626,322
Issue date
Apr 11, 2023
International Business Machines Corporation
Kangguo Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor structure and planarization method thereof
Patent number
11,626,315
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chun-Jung Huang
H01 - BASIC ELECTRIC ELEMENTS
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Interconnect structure for semiconductor device and methods of fabr...
Patent number
11,610,841
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Ta Yu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Integrated circuit interconnect structure having discontinuous barr...
Patent number
11,605,558
Issue date
Mar 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chin-Lung Chung
H01 - BASIC ELECTRIC ELEMENTS
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Redistribution substrate, method of fabricating the same, and semic...
Patent number
11,600,564
Issue date
Mar 7, 2023
Samsung Electronics Co., Ltd.
Jongyoun Kim
H01 - BASIC ELECTRIC ELEMENTS
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Method of making a semiconductor structure
Patent number
11,594,449
Issue date
Feb 28, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Ming Lee
H01 - BASIC ELECTRIC ELEMENTS
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Local interconnect with air gap
Patent number
11,594,485
Issue date
Feb 28, 2023
Intel Corporation
Kevin L. Lin
H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
Patent number
11,581,320
Issue date
Feb 14, 2023
Semiconductor Manufacturing International (Shanghai) Corporation
Fei Zhou
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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STACKED FET CONTACT FORMATION
Publication number
20240105590
Publication date
Mar 28, 2024
International Business Machines Corporation
Koichi Motoyama
H01 - BASIC ELECTRIC ELEMENTS
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WET ETCH PROCESS AND METHODS TO FORM AIR GAPS BETWEEN METAL INTERCO...
Publication number
20240087950
Publication date
Mar 14, 2024
TOKYO ELECTRON LIMITED
Shan Hu
H01 - BASIC ELECTRIC ELEMENTS
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SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
Publication number
20240082881
Publication date
Mar 14, 2024
Samsung Electronics Co., Ltd.
Donghoon KWON
B24 - GRINDING POLISHING
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SEMICONDUCTOR DEVICE INTERCONNECTS HAVING CONDUCTIVE ANNULUS-STABIL...
Publication number
20240055323
Publication date
Feb 15, 2024
Micron Technology, Inc.
Ren Yuan Huang
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240021535
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Lin-Yu Huang
H01 - BASIC ELECTRIC ELEMENTS
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COMPOSITION FOR SEMICONDUCTOR PROCESSING AND METHOD OF FABRICATING...
Publication number
20230407135
Publication date
Dec 21, 2023
SK enpulse Co., Ltd.
Seung Chul HONG
H01 - BASIC ELECTRIC ELEMENTS
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MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE HAVING ELASTIC MEMB...
Publication number
20230386909
Publication date
Nov 30, 2023
NANYA TECHNOLOGY CORPORATION
Shing-Yih SHIH
H01 - BASIC ELECTRIC ELEMENTS
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METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION
Publication number
20230386922
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Osamu KOIKE
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
Publication number
20230378064
Publication date
Nov 23, 2023
Changxin Memory Technologies, Inc.
Deyuan XIAO
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230369201
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Po-Hsien Cheng
H01 - BASIC ELECTRIC ELEMENTS
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FIN FIELD-EFFECT TRANSISTOR AND METHOD OF FORMING THE SAME
Publication number
20230369494
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company Limited
CHUN-NENG LIN
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHO...
Publication number
20230361023
Publication date
Nov 9, 2023
Adeia Semiconductor Solutions LLC
Benjamin David Briggs
H01 - BASIC ELECTRIC ELEMENTS
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SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS
Publication number
20230360965
Publication date
Nov 9, 2023
Applied Materials, Inc.
Suketu Arun Parikh
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
INTEGRATED CIRCUIT DEVICES INCLUDING METAL LINES SPACED APART FROM...
Publication number
20230352405
Publication date
Nov 2, 2023
Samsung Electronics Co., Ltd.
Janggeun Lee
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE STRUCTURE
Publication number
20230343638
Publication date
Oct 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chun-Hung LIAO
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
COMPOSITION FOR SEMICONDUCTOR PROCESSING AND MANUFACTURING METHOD O...
Publication number
20230332017
Publication date
Oct 19, 2023
SK enpulse Co., Ltd.
Seung Chul HONG
H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF FORMING SEMICONDUCTOR MEMORY DEVICE
Publication number
20230292498
Publication date
Sep 14, 2023
UNITED MICROELECTRONICS CORP.
Yi-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230282577
Publication date
Sep 7, 2023
KIOXIA Corporation
Akira NAKAJIMA
H01 - BASIC ELECTRIC ELEMENTS
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Method of Forming an Interconnect Structure Having an Air Gap and S...
Publication number
20230275025
Publication date
Aug 31, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Szu-Ping Tung
H01 - BASIC ELECTRIC ELEMENTS
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INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE INTERCONNEC...
Publication number
20230268268
Publication date
Aug 24, 2023
Taiwan Semiconductor Manufacturing company Ltd.
KHADERBAD MRUNAL ABHIJITH
H01 - BASIC ELECTRIC ELEMENTS
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3D UFET DEVICE FOR ADVANCED 3D INTEGRATION
Publication number
20230261113
Publication date
Aug 17, 2023
TOKYO ELECTRON LIMITED
Mark I. Gardner
H01 - BASIC ELECTRIC ELEMENTS
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FORMING LINE END VIAS
Publication number
20230253307
Publication date
Aug 10, 2023
International Business Machines Corporation
Chanro PARK
H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING DISCONTINUOUS BARR...
Publication number
20230230877
Publication date
Jul 20, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chin-Lung Chung
H01 - BASIC ELECTRIC ELEMENTS
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REDUCING COPPER LINE RESISTANCE
Publication number
20230215806
Publication date
Jul 6, 2023
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
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MICROELECTRONIC ASSEMBLIES
Publication number
20230215739
Publication date
Jul 6, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
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DOUBLE PATTERNING WITH SELECTIVELY DEPOSITED SPACER
Publication number
20230197511
Publication date
Jun 22, 2023
International Business Machines Corporation
Chanro Park
H01 - BASIC ELECTRIC ELEMENTS
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REDISTRIBUTION SUBSTRATE, METHOD OF FABRICATING THE SAME, AND SEMIC...
Publication number
20230187345
Publication date
Jun 15, 2023
Samsung Electronics Co., Ltd.
Jongyoun KIM
H01 - BASIC ELECTRIC ELEMENTS
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VIA PATTERNING FOR INTEGRATED CIRCUITS
Publication number
20230170298
Publication date
Jun 1, 2023
International Business Machines Corporation
Tao Li
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
BEOL TOP VIA WIRINGS WITH DUAL DAMASCENE VIA AND SUPER VIA REDUNDANCY
Publication number
20230170293
Publication date
Jun 1, 2023
International Business Machines Corporation
Yann Mignot
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Reliability Macros for Contact Over Active Gate Layout Designs
Publication number
20230160944
Publication date
May 25, 2023
International Business Machines Corporation
Huimei ZHOU
H01 - BASIC ELECTRIC ELEMENTS