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H01L2225/06527
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2225/00
Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
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H01L2225/06527
Special adaptation of electrical connections
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package
Patent number
12,368,119
Issue date
Jul 22, 2025
Samsung Electronics Co., Ltd.
Minki Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor chip package having underfill material surrounding a...
Patent number
12,368,127
Issue date
Jul 22, 2025
Taiwan Semiconductor Manufacturing Company Limited
Po-Chen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High bandwidth die to die interconnect with package area reduction
Patent number
12,368,137
Issue date
Jul 22, 2025
Apple Inc.
Chonghua Zhong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding layer and process of making
Patent number
12,362,304
Issue date
Jul 15, 2025
Tokyo Electron Limited
Robert D. Clark
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cross stack bridge bonding devices and associated methods
Patent number
12,362,319
Issue date
Jul 15, 2025
Micron Technology, Inc.
Seng Kim Ye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure
Patent number
12,362,320
Issue date
Jul 15, 2025
Advanced Semiconductor Engineering, Inc.
Chien-Chi Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
12,354,980
Issue date
Jul 8, 2025
Samsung Electronics Co., Ltd.
Boin Noh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing between memory die and logic die for performing oper...
Patent number
12,354,649
Issue date
Jul 8, 2025
Micron Technology, Inc.
Aliasger T. Zaidy
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
12,347,731
Issue date
Jul 1, 2025
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D system integration
Patent number
12,327,783
Issue date
Jun 10, 2025
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
Patent number
12,327,819
Issue date
Jun 10, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
12,322,705
Issue date
Jun 3, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package and method of manufacturing the same
Patent number
12,300,560
Issue date
May 13, 2025
Advanced Semiconductor Engineering, Inc.
Ming-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Secure semiconductor integration and method for making thereof
Patent number
12,255,189
Issue date
Mar 18, 2025
BroadPak Corporation
Farhang Yazdani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device
Patent number
12,249,593
Issue date
Mar 11, 2025
Nagase & Co., Ltd.
Yoichiro Kurita
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Through stack bridge bonding devices and associated methods
Patent number
12,237,301
Issue date
Feb 25, 2025
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and related methods
Patent number
12,230,606
Issue date
Feb 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon Im
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor device assembly in computer system
Patent number
12,222,880
Issue date
Feb 11, 2025
RAMBUS INC.
Scott C. Best
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Multi-die package structures including redistribution layers
Patent number
12,199,065
Issue date
Jan 14, 2025
Parabellum Strategic Opportunities Fund LLC
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing between memory die and logic die
Patent number
12,165,696
Issue date
Dec 10, 2024
Micron Technology, Inc.
Sean S. Eilert
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Manufacturing method of package
Patent number
12,166,014
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
Patent number
12,166,015
Issue date
Dec 10, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Singulation and bonding methods and structures formed thereby
Patent number
12,159,860
Issue date
Dec 3, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacture
Patent number
12,136,609
Issue date
Nov 5, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Haohua Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages
Patent number
12,131,997
Issue date
Oct 29, 2024
SK hynix Inc.
Won Duck Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Memory device for wafer-on-wafer formed memory and logic
Patent number
12,112,792
Issue date
Oct 8, 2024
Micron Technology, Inc.
Glen E. Hush
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Stress reduction apparatus and method
Patent number
12,113,055
Issue date
Oct 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yao-Chun Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Signal routing between memory die and logic die for mode based oper...
Patent number
12,112,793
Issue date
Oct 8, 2024
Micron Technology, Inc.
Aliasger T. Zaidy
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device with re-fill layer
Patent number
12,100,634
Issue date
Sep 24, 2024
NANYA TECHNOLOGY CORPORATION
Shing-Yih Shih
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED MEMORY DEVICE WITH IMPROVED PER-DIE POWER DELIVERY
Publication number
20250194111
Publication date
Jun 12, 2025
Micron Technology, Inc.
Sujeet Ayyapureddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
Publication number
20250192102
Publication date
Jun 12, 2025
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PITCH CONFIGURATION FOR BACK-END-OF-LINE WIRING
Publication number
20250194199
Publication date
Jun 12, 2025
International Business Machines Corporation
Brent A. Anderson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE PAD WITH PROTRUSION AND M...
Publication number
20250183208
Publication date
Jun 5, 2025
NANYA TECHNOLOGY CORPORATION
Yi-Jen LO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH SYSTEM TEST RING
Publication number
20250174500
Publication date
May 29, 2025
MEDIATEK INC.
Cing-Yao Jhan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Device Assembly in Computer System
Publication number
20250165420
Publication date
May 22, 2025
Rambus Inc.
Scott C. Best
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE AND RELATED METHODS
Publication number
20250149512
Publication date
May 8, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Seungwon IM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE
Publication number
20250104761
Publication date
Mar 27, 2025
Micron Technology, Inc.
Sean S. Eilert
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20250096203
Publication date
Mar 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Kang Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20250062283
Publication date
Feb 20, 2025
SK HYNIX INC.
Seong Ju LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250062289
Publication date
Feb 20, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
Publication number
20250054844
Publication date
Feb 13, 2025
Realtek Semiconductor Corp.
Yu-Hsin Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20250014999
Publication date
Jan 9, 2025
SK HYNIX INC.
Won Duck JUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
Publication number
20250006251
Publication date
Jan 2, 2025
Micron Technology, Inc.
Aliasger T. Zaidy
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240421020
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
YOUNG KWAN SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240421056
Publication date
Dec 19, 2024
Samsung Electronics Co., Ltd.
Jae-Min Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Publication number
20240421089
Publication date
Dec 19, 2024
SOCIONEXT INC.
Yoshiki ISHIGAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
Publication number
20240420757
Publication date
Dec 19, 2024
Micron Technology, Inc.
Glen E. Hush
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
Publication number
20240413106
Publication date
Dec 12, 2024
United Microelectronics Corp.
Chien-Ming Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE
Publication number
20240413099
Publication date
Dec 12, 2024
Xilinx, Inc.
James David Wesselkamper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Multi-Die Package Structures Including Redistribution Layers
Publication number
20240404992
Publication date
Dec 5, 2024
Parabellum Strategic Opportunities Fund LLC
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
Publication number
20240395775
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Publication number
20240395776
Publication date
Nov 28, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Haohua Zhou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
Publication number
20240387419
Publication date
Nov 21, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Pawel Mrozek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240387466
Publication date
Nov 21, 2024
SOCIONEXT INC.
Hirotaka TAKENO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240371840
Publication date
Nov 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
Publication number
20240363564
Publication date
Oct 31, 2024
TOKYO ELECTRON LIMITED
Soo Doo CHAE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
Publication number
20240355722
Publication date
Oct 24, 2024
BroadPak Corporation
Farhang YAZDANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
Publication number
20240304603
Publication date
Sep 12, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Jinchang ZHOU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
Publication number
20240250067
Publication date
Jul 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS