Special adaptation of electrical connections

Industry

CPC
H01L2225/06527

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups

Current Industry

H01L2225/06527Special adaptation of electrical connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Stacked semiconductor device assembly in computer system
- Patent number 12,222,880
- Issue date Feb 11, 2025
- RAMBUS INC.
- Scott C. Best
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-die package structures including redistribution layers
- Patent number 12,199,065
- Issue date Jan 14, 2025
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die
- Patent number 12,165,696
- Issue date Dec 10, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of package
- Patent number 12,166,014
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of semiconductor pac...
- Patent number 12,166,015
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Singulation and bonding methods and structures formed thereby
- Patent number 12,159,860
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,136,609
- Issue date Nov 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device for wafer-on-wafer formed memory and logic
- Patent number 12,112,792
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stress reduction apparatus and method
- Patent number 12,113,055
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Chun Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal routing between memory die and logic die for mode based oper...
- Patent number 12,112,793
- Issue date Oct 8, 2024
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with re-fill layer
- Patent number 12,100,634
- Issue date Sep 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,735
- Issue date Sep 10, 2024
- SOCIONEXT INC.
- Hirotaka Takeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,087,745
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrations and methods of making thereof
- Patent number 12,068,231
- Issue date Aug 20, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a through intervia through the molding...
- Patent number 12,033,976
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating the same
- Patent number 12,033,977
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Seong Gwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer(s) on a stacked structure having a via
- Patent number 12,021,066
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Fa Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing semiconductor pa...
- Patent number 12,021,055
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fast memory for programmable devices
- Patent number 12,003,238
- Issue date Jun 4, 2024
- Intel Corporation
- Scott Jeremy Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,984,425
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ji-seok Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-on-wafer formed memory and logic for genomic annotations
- Patent number 11,915,742
- Issue date Feb 27, 2024
- Micron Technology, Inc.
- Sean S. Eilert
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,901,252
- Issue date Feb 13, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking integrated circuits containing serializer and deserializer...
- Patent number 11,894,342
- Issue date Feb 6, 2024
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having conductive vias with aligned back s...
- Patent number 11,869,809
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Jin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid felts of electrospun nanofibers
- Patent number RE49773
- Issue date Jan 2, 2024
- NANOPAREIL, LLC
- Todd J. Menkhaus
Information Patent Grant
Stacked semiconductor device
- Patent number 11,862,235
- Issue date Jan 2, 2024
- RAMBUS INC.
- Frederick A. Ware
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...
- Publication number 20250054844
- Publication date Feb 13, 2025
- Realtek Semiconductor Corp.
- Yu-Hsin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250014999
- Publication date Jan 9, 2025
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...
- Publication number 20250006251
- Publication date Jan 2, 2025
- Micron Technology, Inc.
- Aliasger T. Zaidy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421056
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Jae-Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20240421089
- Publication date Dec 19, 2024
- SOCIONEXT INC.
- Yoshiki ISHIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC
- Publication number 20240420757
- Publication date Dec 19, 2024
- Micron Technology, Inc.
- Glen E. Hush
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240413106
- Publication date Dec 12, 2024
- United Microelectronics Corp.
- Chien-Ming Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE
- Publication number 20240413099
- Publication date Dec 12, 2024
- Xilinx, Inc.
- James David Wesselkamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY
- Publication number 20240395775
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240395776
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Haohua Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL
- Publication number 20240387419
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Pawel Mrozek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387466
- Publication date Nov 21, 2024
- SOCIONEXT INC.
- Hirotaka TAKENO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371840
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE
- Publication number 20240355722
- Publication date Oct 24, 2024
- BroadPak Corporation
- Farhang YAZDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...
- Publication number 20240304603
- Publication date Sep 12, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jinchang ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS
- Publication number 20240250067
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240228264
- Publication date Jul 11, 2024
- STMicroelectronics International N.V.
- Roseanne DUCA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS OF FORMING BONDING STRUCTURES
- Publication number 20240203923
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsing-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240203483
- Publication date Jun 20, 2024
- Rambus Inc.
- Frederick A. Ware
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240186201
- Publication date Jun 6, 2024
- Advanced Semiconductor Engineering, Inc.
- Ming-Han WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DELIVERY NETWORK
- Publication number 20240186248
- Publication date Jun 6, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem HABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178082
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240178083
- Publication date May 30, 2024
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...
- Publication number 20240178193
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...
- Publication number 20240170350
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING
- Publication number 20240153894
- Publication date May 9, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FERROMAGNETIC CONTROL OF WAFER BONDING
- Publication number 20240153910
- Publication date May 9, 2024
- MICRON TECHNOLGY, INC.
- Andrew M. BAYLESS
- H01 - BASIC ELECTRIC ELEMENTS

Special adaptation of electrical connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked semiconductor device assembly in computer system

Multi-die package structures including redistribution layers

Signal routing between memory die and logic die

Manufacturing method of package

Semiconductor package and manufacturing method of semiconductor pac...

Singulation and bonding methods and structures formed thereby

Semiconductor device and method of manufacture

Semiconductor packages

Memory device for wafer-on-wafer formed memory and logic

Stress reduction apparatus and method

Signal routing between memory die and logic die for mode based oper...

Semiconductor device with re-fill layer

Semiconductor device

Package structure and manufacturing method thereof

3D integrations and methods of making thereof

Semiconductor package having a through intervia through the molding...

Semiconductor package and method for fabricating the same

Buffer layer(s) on a stacked structure having a via

Semiconductor package and method for manufacturing semiconductor pa...

Fast memory for programmable devices

Multilayer body and method of manufacturing the same

Semiconductor package

Wafer-on-wafer formed memory and logic for genomic annotations

Semiconductor device package and method of manufacturing the same

Stacking integrated circuits containing serializer and deserializer...

Stacked microfeature devices and associated methods

Semiconductor components having conductive vias with aligned back s...

Hybrid felts of electrospun nanofibers

Stacked semiconductor device

Semiconductor packages with pass-through clock traces and associate...

Patents Applicationslast 30 patents

LEAD FRAME ADAPTED TO BE APPLIED TO A QUAD FLAT NO-LEAD PACKAGE STR...

SEMICONDUCTOR PACKAGES

SIGNAL ROUTING BETWEEN MEMORY DIE AND LOGIC DIE FOR MODE BASED OPER...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MEMORY DEVICE FOR WAFER-ON-WAFER FORMED MEMORY AND LOGIC

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MULTI-DIE PHYSICALLY UNCLONABLE FUNCTION ENTROPY SOURCE

Multi-Die Package Structures Including Redistribution Layers

SINGULATION AND BONDING METHODS AND STRUCTURES FORMED THEREBY

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

DIRECT HYBRID BOND PAD HAVING TAPERED SIDEWALL

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

APPARATUS AND METHOD FOR MAKING A SECURED SUBSTRATE

SEMICONDUCTOR DEVICE AND METHOD OF INTEGRATING POWER MODULE WITH IN...

MULTI-DIE PACKAGE STRUCTURES INCLUDING REDISTRIBUTION LAYERS

DECOUPLING METHOD FOR SEMICONDUCTOR DEVICE

METHODS OF FORMING BONDING STRUCTURES

STACKED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

BACKSIDE POWER DELIVERY NETWORK

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES WITH PASS-THROUGH CLOCK TRACES AND ASSOCIATE...

SEMICONDUCTOR DEVICE STRUCTURE WITH BONDING PAD AND METHOD FOR FORM...

STRUCTURE FOR THERMAL MANAGEMENT IN HYBRID BONDING

FERROMAGNETIC CONTROL OF WAFER BONDING