Special cross-section of a lead Different cross-sections of different leads Matching cross-section

Industry

CPC
H05K2201/1081

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/1081Special cross-section of a lead Different cross-sections of different leads Matching cross-section

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,474,165
- Issue date Oct 18, 2022
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component and a method for producing an electrical compo...
- Patent number 11,342,126
- Issue date May 24, 2022
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic sensor component and assembly
- Patent number 11,067,645
- Issue date Jul 20, 2021
- Melexis Technologies SA
- Jian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,943,740
- Issue date Mar 9, 2021
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with relay mounted to substrate
- Patent number 10,945,336
- Issue date Mar 9, 2021
- TE Connectivity Corporation
- Ronald Martin Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-cost superior performance coinless RF power amplifier
- Patent number 10,912,185
- Issue date Feb 2, 2021
- Telefonaktiebolaget LM Ericsson (publ)
- Reginald Simpson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a power amplifier (AP) assembly
- Patent number 10,842,028
- Issue date Nov 17, 2020
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald Nehring
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 10,806,036
- Issue date Oct 13, 2020
- Invensas Corporation
- Reynaldo Co
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit terminal and electronic device including press-fit terminal
- Patent number 10,680,360
- Issue date Jun 9, 2020
- Denso Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assembly with increased mounting area
- Patent number 10,652,994
- Issue date May 12, 2020
- AutoNetworks Technologies, Ltd.
- Arinobu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and power semiconductor device
- Patent number 10,561,021
- Issue date Feb 11, 2020
- Fuji Electric Co., Ltd.
- Kenshi Terashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency transformer
- Patent number 10,398,029
- Issue date Aug 27, 2019
- Fuji Electric Co., Ltd.
- Qichen Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connection contact for a ceramic component, a ceramic co...
- Patent number 10,395,843
- Issue date Aug 27, 2019
- Epcos AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Special electric component, printed circuit board assembly, and met...
- Patent number 10,264,679
- Issue date Apr 16, 2019
- The Procter & Gamble Company
- Christian Ellsaesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Discrete device
- Patent number 10,201,087
- Issue date Feb 5, 2019
- Infineon Technologies Austria AG
- Fabio Brucchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Step etched metal electrical contacts
- Patent number 9,967,977
- Issue date May 8, 2018
- Cree Fayetteville, Inc.
- Brice McPherson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressing of wire bond wire tips to provide bent-over tips
- Patent number 9,888,579
- Issue date Feb 6, 2018
- Invensas Corporation
- Reynaldo Co
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed circuit assembly for a solenoid module for an automatic tra...
- Patent number 9,844,137
- Issue date Dec 12, 2017
- Advanced Powertrain Engineering, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,818,541
- Issue date Nov 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin connector structure and method
- Patent number 9,775,242
- Issue date Sep 26, 2017
- Intel Corporation
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed substrate and printed substrate with terminal using same
- Patent number 9,728,869
- Issue date Aug 8, 2017
- Sumitomo Wiring Systems, Ltd.
- Hideki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 9,693,466
- Issue date Jun 27, 2017
- Yazaki Corporation
- Akira Harao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder spacer and electronic module comprising such a spacer
- Patent number 9,629,245
- Issue date Apr 18, 2017
- Sagemcom Broadband SAS
- Stephane Kohn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solid electrolytic capacitor for embedding into a circuit board
- Patent number 9,545,008
- Issue date Jan 10, 2017
- AVX Corporation
- Stanislav Zednicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Weaved electrical components in a substrate package core
- Patent number 9,521,751
- Issue date Dec 13, 2016
- Intel Corporation
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Relay module device
- Patent number 9,515,652
- Issue date Dec 6, 2016
- Anden Co., Ltd.
- Hideyuki Ohtani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic part and electronic control unit
- Patent number 9,332,645
- Issue date May 3, 2016
- Denso Corporation
- Yuuto Kamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pin connector structure and method
- Patent number 9,247,642
- Issue date Jan 26, 2016
- Intel Corporation
- Tsung-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit assembly for a solenoid module for an automatic tra...
- Patent number 9,198,301
- Issue date Nov 24, 2015
- Advanced Powertrain Engineering, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION
- Publication number 20240260188
- Publication date Aug 1, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Brian Mark Hostetler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME
- Publication number 20240006403
- Publication date Jan 4, 2024
- Molex, LLC
- Victor Zaderej
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20230309229
- Publication date Sep 28, 2023
- TDK Corporation
- Takeshi OOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SENSOR COMPONENT AND ASSEMBLY
- Publication number 20210048489
- Publication date Feb 18, 2021
- Melexis Technologies SA
- Jian CHEN
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE
- Publication number 20190387627
- Publication date Dec 19, 2019
- TE Connectivity Corporation
- Ronald Martin Weber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS-FIT TERMINAL AND ELECTRONIC DEVICE INCLUDING PRESS-FIT TERMINAL
- Publication number 20190312367
- Publication date Oct 10, 2019
- DENSO CORPORATION
- Yuki YAGYU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20190304702
- Publication date Oct 3, 2019
- EPCOS AG
- Markus Koini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE
- Publication number 20180338376
- Publication date Nov 22, 2018
- Fuji Electric Co., Ltd.
- Kenshi TERASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER
- Publication number 20180310416
- Publication date Oct 25, 2018
- Telefonaktiebolaget LM Ericsson (publ)
- Ronald NEHRING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20180310410
- Publication date Oct 25, 2018
- AUTONETWORKS TECHNOLOGIES, LTD.
- Arinobu Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISCRETE DEVICE
- Publication number 20180288878
- Publication date Oct 4, 2018
- Infineon Technologies Austria AG
- Fabio Brucchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips
- Publication number 20180146557
- Publication date May 24, 2018
- Invensas Corporation
- Reynaldo CO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...
- Publication number 20180047507
- Publication date Feb 15, 2018
- EPCOS AG
- Markus Koini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE
- Publication number 20150138743
- Publication date May 21, 2015
- Mihir K. Roy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART AND ELECTRONIC CONTROL UNIT
- Publication number 20140240885
- Publication date Aug 28, 2014
- Murata Manufacturing Co., Ltd.
- Yuuto KAMIYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Discrete-Pin Printed-Circuit Mounting with Notches
- Publication number 20140160681
- Publication date Jun 12, 2014
- Wintec Industries, Inc.
- Kong-Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20140146549
- Publication date May 29, 2014
- LG Innotek Co., Ltd.
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
PIN CONNECTOR STRUCTURE AND METHOD
- Publication number 20130342986
- Publication date Dec 26, 2013
- Tsung-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT FOR CLAMPING CHOKE TO CHASSIS
- Publication number 20130293331
- Publication date Nov 7, 2013
- CONTROL TECHNIQUES LTD
- Troy WINSAND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT COMPRISING AN ELECTRIC AND/OR ELECTRONIC MODULE AND A C...
- Publication number 20130063903
- Publication date Mar 14, 2013
- ROBERT BOSCH GmbH
- Michael Heim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120326203
- Publication date Dec 27, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
WIRING BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20120211266
- Publication date Aug 23, 2012
- YAZAKI CORPORATION
- Akira Harao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT
- Publication number 20120181077
- Publication date Jul 19, 2012
- SHINANO KENSHI CO., LTD.
- Kazuya MIYASAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING BOARD
- Publication number 20120145436
- Publication date Jun 14, 2012
- SUMITOMO WIRING SYSTEMS, LTD.
- Yukinori Kita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20120007136
- Publication date Jan 12, 2012
- Kyong Jun KIM
- G02 - OPTICS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20110290534
- Publication date Dec 1, 2011
- HON HAI Precision Industry CO., LTD.
- YI RUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT ASSEMBLY FOR A SOLENOID MODULE FOR AN AUTOMATIC TRA...
- Publication number 20110248200
- Publication date Oct 13, 2011
- ADVANCED POWERTRAIN ENGINEERING, LLC
- Paul Fathauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...
- Publication number 20110235348
- Publication date Sep 29, 2011
- Norikazu Tateishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF
- Publication number 20110198663
- Publication date Aug 18, 2011
- EVERLIGHT YI-GUANG TECHNOLOGY (SHANGHAI) LTD
- Sheng-Jia Sheu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Special cross-section of a lead Different cross-sections of different leads Matching cross-section

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device, printed circuit board (PCB), and method of in...

Magnetic sensor component and assembly

Electrical component and a method for producing an electrical compo...

Magnetic sensor component and assembly

Electrical connection contact for a ceramic component, a ceramic co...

Electronic device with relay mounted to substrate

Low-cost superior performance coinless RF power amplifier

Method for mounting a power amplifier (AP) assembly

Pressing of wire bond wire tips to provide bent-over tips

Press-fit terminal and electronic device including press-fit terminal

Circuit assembly with increased mounting area

Power semiconductor module and power semiconductor device

High-frequency transformer

Electrical connection contact for a ceramic component, a ceramic co...

Special electric component, printed circuit board assembly, and met...

Discrete device

Step etched metal electrical contacts

Pressing of wire bond wire tips to provide bent-over tips

Printed circuit assembly for a solenoid module for an automatic tra...

Multilayer ceramic electronic component and board having the same

Pin connector structure and method

Printed substrate and printed substrate with terminal using same

Wiring board and manufacturing method thereof

Solder spacer and electronic module comprising such a spacer

Solid electrolytic capacitor for embedding into a circuit board

Weaved electrical components in a substrate package core

Relay module device

Electronic part and electronic control unit

Pin connector structure and method

Printed circuit assembly for a solenoid module for an automatic tra...

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

ELECTRONIC COMPONENT

MAGNETIC SENSOR COMPONENT AND ASSEMBLY

ELECTRONIC DEVICE WITH RELAY MOUNTED TO SUBSTRATE

PRESS-FIT TERMINAL AND ELECTRONIC DEVICE INCLUDING PRESS-FIT TERMINAL

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

POWER SEMICONDUCTOR MODULE AND POWER SEMICONDUCTOR DEVICE

SLIDE AND MOUNT MANUFACTURING FOR COINLESS RF POWER AMPLIFIER

CIRCUIT ASSEMBLY

DISCRETE DEVICE

Pressing of Wire Bond Wire Tips to Provide Bent-Over Tips

ELECTRICAL CONNECTION CONTACT FOR A CERAMIC COMPONENT, A CERAMIC CO...

WEAVED ELECTRICAL COMPONENTS IN A SUBSTRATE PACKAGE CORE

ELECTRONIC PART AND ELECTRONIC CONTROL UNIT

Discrete-Pin Printed-Circuit Mounting with Notches

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

PIN CONNECTOR STRUCTURE AND METHOD

COMPONENT FOR CLAMPING CHOKE TO CHASSIS

ARRANGEMENT COMPRISING AN ELECTRIC AND/OR ELECTRONIC MODULE AND A C...

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

WIRING BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD UNIT

PACKAGING BOARD

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT ASSEMBLY FOR A SOLENOID MODULE FOR AN AUTOMATIC TRA...

STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGH...

STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF