Special shape of the cross-section of conductors

Industry

CPC
H05K2201/098

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/098Special shape of the cross-section of conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Laminated circuit board
- Patent number 11,985,768
- Issue date May 14, 2024
- Pi-Crystal Incorporation
- Junichi Takeya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component-embedded substrate
- Patent number 11,979,986
- Issue date May 7, 2024
- Fujikura Ltd.
- Masakazu Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silica-containing substrates with vias having an axially variable s...
- Patent number 11,972,993
- Issue date Apr 30, 2024
- Corning Incorporated
- Rachel Eileen Dahlberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catheter flexible printed wiring board and method for manufacturing...
- Patent number 11,931,099
- Issue date Mar 19, 2024
- Nippon Mektron, Ltd.
- Akio Yoshida
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and method of producing the same
- Patent number 11,917,751
- Issue date Feb 27, 2024
- TOPPAN INC.
- Masao Aratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed wiring board, joined body, pressure sensor and mas...
- Patent number 11,895,776
- Issue date Feb 6, 2024
- Hitachi Metals, Ltd.
- Takahiro Umeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 11,889,634
- Issue date Jan 30, 2024
- LG Innotek Co., Ltd
- Jung Ho Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board including coaxial plated through hole and ele...
- Patent number 11,871,516
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Kwanghyun Baek
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 11,837,554
- Issue date Dec 5, 2023
- Kioxia Corporation
- Ryujiro Bando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate and electronic device
- Patent number 11,830,833
- Issue date Nov 28, 2023
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer copper bus bars with soldered through hole components
- Patent number 11,832,390
- Issue date Nov 28, 2023
- Rolls-Royce Corporation
- Shuai Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light sensing module and display apparatus
- Patent number 11,815,391
- Issue date Nov 14, 2023
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiahua Wang
- G01 - MEASURING TESTING
Information Patent Grant
Circuit board structure
- Patent number 11,818,833
- Issue date Nov 14, 2023
- Unimicron Technology Corp.
- Shih-Lian Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and electronic apparatus
- Patent number 11,818,844
- Issue date Nov 14, 2023
- Canon Kabushiki Kaisha
- Yuya Karakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency circuit
- Patent number 11,812,546
- Issue date Nov 7, 2023
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Koji Nitta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,792,929
- Issue date Oct 17, 2023
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective coating
- Patent number 11,786,930
- Issue date Oct 17, 2023
- Shailendra Vikram Singh
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Component carrier having dielectric layer with conductively filled...
- Patent number 11,784,115
- Issue date Oct 10, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Roland Wilfing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with through hole filled with extra plating struc...
- Patent number 11,778,754
- Issue date Oct 3, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Robin Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual trace thickness for single layer routing
- Patent number 11,769,719
- Issue date Sep 26, 2023
- Intel Corporation
- Jonathan Rosch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,765,813
- Issue date Sep 19, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate having electric component embedded therein
- Patent number 11,765,833
- Issue date Sep 19, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myeong Hui Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240164019
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240155764
- Publication date May 9, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098896
- Publication date Mar 21, 2024
- PanelSemi Corporation
- Chin-Tang LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240074062
- Publication date Feb 29, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Hsin-Fa HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074049
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Kyun Bae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240074057
- Publication date Feb 29, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Man Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20240055370
- Publication date Feb 15, 2024
- KIOXIA Corporation
- Ryujiro BANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20240047393
- Publication date Feb 8, 2024
- Innolux Corporation
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER
- Publication number 20240040693
- Publication date Feb 1, 2024
- KYOCERA CORPORATION
- Atsuo KAWAGOE
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...
- Publication number 20240032202
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Kwang Yun KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD
- Publication number 20240008179
- Publication date Jan 4, 2024
- Shinko Electric Industries Co., Ltd.
- Yuta YAMAZAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE DISPLAY DEVICE
- Publication number 20240004431
- Publication date Jan 4, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun Namkung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING SUBSTRATE
- Publication number 20230403789
- Publication date Dec 14, 2023
- IBIDEN CO., LTD.
- Hiroki WAKAMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING BOARD AND CIRCUIT BOARD
- Publication number 20230395766
- Publication date Dec 7, 2023
- TDK Corporation
- Tomohisa MITOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
- Publication number 20230397333
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20230389186
- Publication date Nov 30, 2023
- InnoLux Corporation
- Yuan-Lin Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING
- Publication number 20230369192
- Publication date Nov 16, 2023
- Intel Corporation
- Jonathan ROSCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20230354509
- Publication date Nov 2, 2023
- Hitachi Astemo, Ltd.
- Ryo AKIBA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD
- Publication number 20230340862
- Publication date Oct 26, 2023
- GeoDynamics, Inc.
- Phillip PHELPS
- F42 - AMMUNITION BLASTING
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Publication number 20230337370
- Publication date Oct 19, 2023
- LG Innotek Co., Ltd.
- Yun Mi BAE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335466
- Publication date Oct 19, 2023
- Unimicron Technology Corp.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230337367
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Mi Jeong JEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230335479
- Publication date Oct 19, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chan Hoon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230328882
- Publication date Oct 12, 2023
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230319987
- Publication date Oct 5, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL WITH NON-UNIFORM TRACE
- Publication number 20230307166
- Publication date Sep 28, 2023
- DSBJ PTE. LTD.
- Soheil SAADAT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...
- Publication number 20230309236
- Publication date Sep 28, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Stefanie Paller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Special shape of the cross-section of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laminated circuit board

Component-embedded substrate

Silica-containing substrates with vias having an axially variable s...

Mating backplane for high speed, high density electrical connector

Catheter flexible printed wiring board and method for manufacturing...

Circuit board preparation method

Method for manufacturing multilayer substrate and multilayer substrate

Multilayer wiring board and method of producing the same

Printed circuit board

Flexible printed wiring board, joined body, pressure sensor and mas...

Printed circuit board and method of manufacturing the same

Wiring substrate and method for manufacturing wiring substrate

Printed circuit board including coaxial plated through hole and ele...

Sn—Bi and copper powder conductive paste in through hole of insulat...

Plated metallization structures

Semiconductor package and semiconductor device

Electronic substrate and electronic device

Multilayer copper bus bars with soldered through hole components

Light sensing module and display apparatus

Circuit board structure

Semiconductor module and electronic apparatus

High-frequency circuit

Backplane footprint for high speed, high density electrical connectors

Wiring substrate and method for manufacturing wiring substrate

Protective coating

Component carrier having dielectric layer with conductively filled...

Component carrier with through hole filled with extra plating struc...

Dual trace thickness for single layer routing

Backplane footprint for high speed, high density electrical connectors

Substrate having electric component embedded therein

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

Carrier Substrate

ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE

ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE

PRINTED WIRING BOARD, MULTILAYER RESONATOR, AND MULTILAYER FILTER

PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRA...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING BOARD

FLEXIBLE DISPLAY DEVICE

WIRING SUBSTRATE

MOUNTING BOARD AND CIRCUIT BOARD

ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT

ELECTRONIC DEVICE

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

DUAL TRACE THICKNESS FOR SINGLE LAYER ROUTING

ELECTRONIC CONTROL DEVICE

ADDRESSABLE SWITCH ASSEMBLY FOR WELLBORE SYSTEMS AND METHOD

PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME

ELECTRONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

COIL WITH NON-UNIFORM TRACE

Inlay With Exposed Porous Layer, Component Carrier and Manufacturin...